Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
  • H01L23/495—Lead-frames or other flat leads
  • H01L23/49541—Geometry of the lead-frame
  • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Lead Frames For Integrated Circuits (AREA)
• Die Bonding (AREA)

Applications Claiming Priority (1)

Publications (2)

Family

ID=24539266

Family Applications (1)

Country Status (5)

Families Citing this family (7)

• 1985
  • 1985-07-11 FR FR8510630A patent/FR2568059A1/en active Pending
  • 1985-07-18 JP JP15928585A patent/JPS6136960A/en active Pending
  • 1985-07-19 IT IT21638/85A patent/IT1185286B/en active
  • 1985-07-22 GB GB858518468A patent/GB8518468D0/en active Pending
  • 1985-07-22 IL IL75877A patent/IL75877A0/en unknown

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