[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

HK80091A - Photosensitive positive composition and photoresist material prepared therewith - Google Patents

Photosensitive positive composition and photoresist material prepared therewith

Info

Publication number
HK80091A
HK80091A HK800/91A HK80091A HK80091A HK 80091 A HK80091 A HK 80091A HK 800/91 A HK800/91 A HK 800/91A HK 80091 A HK80091 A HK 80091A HK 80091 A HK80091 A HK 80091A
Authority
HK
Hong Kong
Prior art keywords
propylene glycol
alkyl ether
ether acetate
soluble
mixture
Prior art date
Application number
HK800/91A
Inventor
Dana Durham
Original Assignee
Hoechst Celanese Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoechst Celanese Corp filed Critical Hoechst Celanese Corp
Publication of HK80091A publication Critical patent/HK80091A/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0048Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/0226Quinonediazides characterised by the non-macromolecular additives

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

1. Claims for the contracting states : DE, FR, GB, IT, NL, AT Radiation-sensitive positive-working mixture which is composed essentially of at least one waterin-soluble novolak resin or polyvinylphenol resin which is soluble in aqueous alkaline solutions, as binder, at least one o-quinone diazide as photosensitive compound and a solvent containing propylene glycol alkyl ether acetate, characterized in that the solvent contains a mixture of propylene glycol (C1 -C4 )alkyl ether acetate and propylene glycol (C1 -C4 )alkyl ether in a mixing ratio of between 10:1 and 1:10 or is composed thereof. 1. Claims for the contracting states : CH, LI Radiation-sensitive positive-working mixture which is composed essentially of at least one waterin-soluble novolak resin or polyvinylphenol resin which is soluble in aqueous alkaline solutions, as binder, at least one o-quinone diazide as photosensitive compound and a solvent containing propylene glycol alkyl ether acetate, characterized in that the solvent contains a mixture of propylene glycol (C1 -C4 )alkyl ether acetate and propylene glycol (C1 -C4 )alkyl ether or is composed thereof.
HK800/91A 1985-10-28 1991-10-10 Photosensitive positive composition and photoresist material prepared therewith HK80091A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US79188085A 1985-10-28 1985-10-28

Publications (1)

Publication Number Publication Date
HK80091A true HK80091A (en) 1991-10-18

Family

ID=25155071

Family Applications (1)

Application Number Title Priority Date Filing Date
HK800/91A HK80091A (en) 1985-10-28 1991-10-10 Photosensitive positive composition and photoresist material prepared therewith

Country Status (6)

Country Link
EP (1) EP0220645B1 (en)
JP (1) JPS62105137A (en)
KR (1) KR950001004B1 (en)
AT (1) ATE56545T1 (en)
DE (1) DE3674141D1 (en)
HK (1) HK80091A (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2719912B2 (en) * 1987-05-07 1998-02-25 コニカ株式会社 Photosensitive lithographic printing plate
JPS63303343A (en) * 1987-06-03 1988-12-09 Konica Corp Photosensitive composition and photosensitive planographic plate
JPS63276047A (en) * 1987-05-07 1988-11-14 Konica Corp Photosensitive composition and photosensitive planographic printing plate
JPS6477051A (en) * 1987-06-03 1989-03-23 Konishiroku Photo Ind Photosensitive composition and photosensitive planographic printing plate
JP2806474B2 (en) * 1987-07-28 1998-09-30 三菱化学株式会社 Photosensitive composition
JPH01116537A (en) * 1987-10-29 1989-05-09 Konica Corp Photosensitive composition
JPH01250945A (en) * 1988-03-30 1989-10-05 Sumitomo Chem Co Ltd Positive type resist composition
JPH0229750A (en) * 1988-07-20 1990-01-31 Mitsubishi Kasei Corp Photosensitive composition and photosensitive planographic printing plate
JP2947519B2 (en) * 1988-10-03 1999-09-13 コニカ株式会社 Photosensitive lithographic printing plate
JP2584311B2 (en) * 1989-03-20 1997-02-26 富士写真フイルム株式会社 Positive photoresist composition
US5558227A (en) * 1991-07-18 1996-09-24 Hakamada; Ikuhiro Sealed container having a calendar function
JP4209297B2 (en) * 2003-10-06 2009-01-14 東京応化工業株式会社 POSITIVE PHOTORESIST COMPOSITION FOR DISCHARGE NOZZLE TYPE COATING METHOD AND METHOD FOR FORMING RESIST PATTERN
JP5329999B2 (en) * 2009-01-29 2013-10-30 AzエレクトロニックマテリアルズIp株式会社 Pattern formation method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3040156A1 (en) * 1980-10-24 1982-06-03 Hoechst Ag, 6000 Frankfurt LIGHT SENSITIVE MIXTURE AND LIGHT SENSITIVE COPY MATERIAL PRODUCED THEREOF
NO173574C (en) * 1984-06-01 1993-12-29 Rohm & Haas Method of producing a thermally stable, positive or negative image on a substrate surface
DE3421160A1 (en) * 1984-06-07 1985-12-12 Hoechst Ag, 6230 Frankfurt Positive-working radiation-sensitive coating solution
EP0164083B1 (en) * 1984-06-07 1991-05-02 Hoechst Aktiengesellschaft Positively acting light-sensitive coating solution
US4550069A (en) * 1984-06-11 1985-10-29 American Hoechst Corporation Positive photoresist compositions with o-quinone diazide, novolak, and propylene glycol alkyl ether acetate
DE3437687A1 (en) * 1984-10-15 1986-04-17 Hoechst Ag, 6230 Frankfurt METHOD FOR PRODUCING NEGATIVE COPIES BY MEANS OF A MATERIAL BASED ON 1,2-CHINONDIAZIDES
ATE47631T1 (en) * 1985-03-11 1989-11-15 Hoechst Celanese Corp PROCESS FOR MAKING PHOTORESIST STRUCTURES.

Also Published As

Publication number Publication date
EP0220645A2 (en) 1987-05-06
KR870004334A (en) 1987-05-08
DE3674141D1 (en) 1990-10-18
EP0220645A3 (en) 1987-08-26
JPS62105137A (en) 1987-05-15
ATE56545T1 (en) 1990-09-15
EP0220645B1 (en) 1990-09-12
JPH0459630B2 (en) 1992-09-22
KR950001004B1 (en) 1995-02-06

Similar Documents

Publication Publication Date Title
EP0220645A3 (en) Photosensitive positive composition and photoresist material prepared therewith
GB2193335B (en) A developer solution for positive-working photoresist compositions
EP0136110A3 (en) Positive photosensitive compositions useful as photoresists
HK76895A (en) Radiation-sensitive composition with acid cleavable compounds
GB2181441B (en) A positive-working photoresist composition
EP0271199A3 (en) Novolak resin for positive photoresist
DE3165261D1 (en) Photosensitive mixture based on o-naphthoquinone diazides, and photosensible copying material made therefrom
DE3270623D1 (en) Positive-working resist compositions having improved development rates
EP0253219A3 (en) Photoresist compositions containing quinone sensitizer
GB2180842B (en) A novel positive-working photoresist composition
JPS55123614A (en) Photosensitive resin and positive type-photosensitive resin composition
DE3274354D1 (en) Novolak resin and a positive photoresist composition containing the same
GB2222270B (en) Developer solution for positive-working resist composition
DE69012909D1 (en) Dry mix for epoxy cement concrete.
IE831482L (en) Stabilizing memadione and thiamine
JPS5318655A (en) Chlorine-containing resin composition
JPS54151928A (en) Phenol compound*its preparation and use for epoxy resin setting agent
ES8503863A1 (en) Photosensitive composition, photoprinting material prepared therewith and process for producing a printing plate with that material.
KR870004332A (en) Photoresist composition
ATE72061T1 (en) LIGHT-SENSITIVE 1,2-NAPHTHOCHINONEDIAZIDE-4SULPHONES|UREMONOESTERS AND LIGHT-SENSITIVE COMPOSITIONS THEREOF.
DE68927129D1 (en) Resist composition, phenol compound and quinonediazide sulfonic acid ester of this phenol compound
JPS5357246A (en) Polyethylene resin compositions having improved adhesivity
JPS53142523A (en) Termite-proof resin composition
AU6117690A (en) Radiation - sensitive positive - working mixture
JPS5318556A (en) Halogenation of methyl ketone

Legal Events

Date Code Title Description
PF Patent in force
AS Change of ownership

Owner name: AZ ELECTRONIC MATERIALS (JAPAN) K.K

Free format text: FORMER OWNER(S): HOECHST CELANESE CORPORATION ?

CHPA Change of a particular in the register (except of change of ownership)
PE Patent expired

Effective date: 20061019