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HK1213841A1 - 加熱接合裝置及加熱接合產品的製造方法 - Google Patents

加熱接合裝置及加熱接合產品的製造方法

Info

Publication number
HK1213841A1
HK1213841A1 HK16101807.3A HK16101807A HK1213841A1 HK 1213841 A1 HK1213841 A1 HK 1213841A1 HK 16101807 A HK16101807 A HK 16101807A HK 1213841 A1 HK1213841 A1 HK 1213841A1
Authority
HK
Hong Kong
Prior art keywords
heat
bonded
bonding device
article manufacturing
article
Prior art date
Application number
HK16101807.3A
Other languages
English (en)
Inventor
松田純
鈴木隆之
黑田正己
Original Assignee
Origin Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Origin Electric filed Critical Origin Electric
Publication of HK1213841A1 publication Critical patent/HK1213841A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
HK16101807.3A 2013-01-24 2016-02-18 加熱接合裝置及加熱接合產品的製造方法 HK1213841A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013011041A JP5902107B2 (ja) 2013-01-24 2013-01-24 加熱接合装置及び加熱接合製品の製造方法
PCT/JP2014/050240 WO2014115584A1 (ja) 2013-01-24 2014-01-09 加熱接合装置及び加熱接合製品の製造方法

Publications (1)

Publication Number Publication Date
HK1213841A1 true HK1213841A1 (zh) 2016-07-15

Family

ID=51227376

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16101807.3A HK1213841A1 (zh) 2013-01-24 2016-02-18 加熱接合裝置及加熱接合產品的製造方法

Country Status (7)

Country Link
US (1) US9730335B2 (zh)
EP (1) EP2949415B1 (zh)
JP (1) JP5902107B2 (zh)
CN (1) CN104968462B (zh)
HK (1) HK1213841A1 (zh)
TW (1) TWI556900B (zh)
WO (1) WO2014115584A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6144495B2 (ja) * 2013-01-24 2017-06-07 オリジン電気株式会社 加熱接合装置及び加熱接合製品の製造方法
CN105448862B (zh) * 2014-09-29 2018-08-10 中芯国际集成电路制造(上海)有限公司 半导体结构及其制作方法
DE102014118523B4 (de) * 2014-12-12 2017-11-23 Semikron Elektronik Gmbh & Co. Kg Kühleinrichtung und Verfahren zum Abkühlen von flüssigem Lot zur Herstellung einer Lötverbindung
DE102015106298B4 (de) * 2015-04-24 2017-01-26 Semikron Elektronik Gmbh & Co. Kg Vorrichtung, Verfahren und Anlage zur inhomogenen Abkühlung eines flächigen Gegenstandes
KR102429619B1 (ko) * 2015-11-18 2022-08-04 삼성전자주식회사 본딩 스테이지와 이를 포함하는 본딩 장치
JP6215426B1 (ja) * 2016-09-21 2017-10-18 オリジン電気株式会社 加熱装置及び板状部材の製造方法
CN109791017B (zh) * 2016-09-30 2021-03-12 富士胶片株式会社 辐射冷却装置
EP3560716B1 (en) * 2016-12-26 2021-06-30 Fuji Corporation Screen printing machine
JP6322746B1 (ja) * 2017-03-30 2018-05-09 オリジン電気株式会社 ワーク処理装置及び処理済ワークの製造方法
TWI651148B (zh) * 2017-11-14 2019-02-21 廣化科技股份有限公司 真空焊接爐
CN108672876B (zh) * 2018-08-09 2020-06-23 乐清野岛机电有限公司 一种框架断路器触头全自动焊接系统
US11862482B2 (en) * 2021-03-11 2024-01-02 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor substrate bonding tool and methods of operation

Family Cites Families (22)

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Publication number Priority date Publication date Assignee Title
NL8901598A (nl) * 1989-06-23 1991-01-16 Soltec Bv Met een beschermgas werkende soldeermachine, voorzien van automatisch werkende sluisdeuren.
JPH04262865A (ja) * 1991-01-22 1992-09-18 Kenji Kondo はんだ付け装置
JPH05211391A (ja) * 1992-01-21 1993-08-20 Hitachi Ltd 高精度はんだ付け方法及び装置
JP3210537B2 (ja) * 1995-01-17 2001-09-17 日本電熱計器株式会社 リフローはんだ付け方法およびその装置
JP3409679B2 (ja) 1998-02-06 2003-05-26 神港精機株式会社 半田付け装置
JP3894405B2 (ja) * 1999-10-07 2007-03-22 株式会社アルバック 真空熱処理装置
JP3627011B2 (ja) * 2001-02-13 2005-03-09 インターナショナル・ビジネス・マシーンズ・コーポレーション 接合方法
JP3833487B2 (ja) * 2001-03-21 2006-10-11 シャープ株式会社 加熱装置
JP3809806B2 (ja) * 2002-03-29 2006-08-16 富士電機デバイステクノロジー株式会社 半導体装置の製造方法
JP4233905B2 (ja) * 2003-03-26 2009-03-04 Ｊｕｋｉ株式会社 部品装着装置
JP4282501B2 (ja) * 2004-02-03 2009-06-24 パナソニック株式会社 リフローはんだ付け装置および方法
JP4448749B2 (ja) 2004-09-16 2010-04-14 神港精機株式会社 加熱及び冷却装置
DE102004047359B3 (de) * 2004-09-29 2006-01-26 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Verfahren und Vorrichtung zur Regelung und Überwachung eines Lötprozesses
US7435964B2 (en) * 2005-01-26 2008-10-14 Analog Devices, Inc. Thermal sensor with increased sensitivity
JP2008068311A (ja) * 2006-09-15 2008-03-27 Fujitsu Ltd ボイド除去装置、ボイド除去方法および電子機器の製造方法
DE102007005345B4 (de) * 2007-02-02 2014-06-18 Seho Systemtechnik Gmbh Verfahren zum Reflow-Löten sowie Vorrichtung zur Durchführung des Verfahrens
JP4974805B2 (ja) * 2007-08-10 2012-07-11 トヨタ自動車株式会社 加熱炉および加熱炉の加熱方法
JP4263761B1 (ja) * 2008-01-17 2009-05-13 トヨタ自動車株式会社 減圧式加熱装置とその加熱方法および電子製品の製造方法
JP5251456B2 (ja) * 2008-11-27 2013-07-31 株式会社デンソー 半田付け用真空加熱装置
JP2010267769A (ja) * 2009-05-14 2010-11-25 Toyota Motor Corp はんだ付け方法及び装置
KR101660622B1 (ko) * 2012-04-25 2016-09-27 오리진 일렉트릭 캄파니 리미티드 납땜 장치 및 납땜 제품의 제조방법
JP6144495B2 (ja) * 2013-01-24 2017-06-07 オリジン電気株式会社 加熱接合装置及び加熱接合製品の製造方法

Also Published As

Publication number Publication date
WO2014115584A1 (ja) 2014-07-31
JP2014140870A (ja) 2014-08-07
EP2949415A4 (en) 2016-10-12
TWI556900B (zh) 2016-11-11
CN104968462B (zh) 2018-06-05
CN104968462A (zh) 2015-10-07
EP2949415B1 (en) 2017-08-16
TW201436919A (zh) 2014-10-01
JP5902107B2 (ja) 2016-04-13
US20150366079A1 (en) 2015-12-17
US9730335B2 (en) 2017-08-08
EP2949415A1 (en) 2015-12-02

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