HK1114185A1 - Method for imprint lithography at constant temperature - Google Patents
Method for imprint lithography at constant temperatureInfo
- Publication number
- HK1114185A1 HK1114185A1 HK08103894.3A HK08103894A HK1114185A1 HK 1114185 A1 HK1114185 A1 HK 1114185A1 HK 08103894 A HK08103894 A HK 08103894A HK 1114185 A1 HK1114185 A1 HK 1114185A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- constant temperature
- imprint lithography
- imprint
- lithography
- constant
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/10—Isostatic pressing, i.e. using non-rigid pressure-exerting members against rigid parts or dies
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Computer Hardware Design (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Micromachines (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04445057.5A EP1594001B1 (en) | 2004-05-07 | 2004-05-07 | Device and method for imprint lithography |
US52156204P | 2004-05-25 | 2004-05-25 | |
PCT/EP2004/053106 WO2005109095A2 (en) | 2004-05-07 | 2004-11-25 | Method for imprint lithography at constant temperature |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1114185A1 true HK1114185A1 (en) | 2008-10-24 |
Family
ID=35320858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK08103894.3A HK1114185A1 (en) | 2004-05-07 | 2008-04-08 | Method for imprint lithography at constant temperature |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4879511B2 (en) |
KR (1) | KR101166278B1 (en) |
HK (1) | HK1114185A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101171190B1 (en) | 2005-11-02 | 2012-08-06 | 삼성전자주식회사 | Manufacturing method of dsplay device and mold therefor |
KR100776633B1 (en) | 2006-06-21 | 2007-11-15 | 이우영 | Imprint system and imprinting method using the same |
US7854877B2 (en) * | 2007-08-14 | 2010-12-21 | Asml Netherlands B.V. | Lithography meandering order |
JP4578517B2 (en) * | 2007-12-26 | 2010-11-10 | Scivax株式会社 | Imprint apparatus and imprint method |
KR100982110B1 (en) * | 2008-08-21 | 2010-09-14 | 성균관대학교산학협력단 | Method of fabricating a ultra fine pattern using a organometallic solution |
JP5388539B2 (en) * | 2008-10-28 | 2014-01-15 | 旭化成イーマテリアルズ株式会社 | Pattern formation method |
JP5319326B2 (en) | 2009-02-25 | 2013-10-16 | 株式会社東芝 | Method for forming uneven pattern and sheet for forming uneven pattern |
JP2012220346A (en) * | 2011-04-08 | 2012-11-12 | Institute Of National Colleges Of Technology Japan | Hardness tester and imprint device |
WO2015076147A1 (en) * | 2013-11-22 | 2015-05-28 | 綜研化学株式会社 | Structure-manufacturing method using step-and-repeat imprinting technique |
JP6421980B2 (en) * | 2015-03-02 | 2018-11-14 | パナソニックIpマネジメント株式会社 | Imprint device |
KR20160111697A (en) | 2015-03-17 | 2016-09-27 | 권은순 | Flexible control panel device of the vehicle |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6190929B1 (en) | 1999-07-23 | 2001-02-20 | Micron Technology, Inc. | Methods of forming semiconductor devices and methods of forming field emission displays |
-
2004
- 2004-11-25 KR KR1020067025662A patent/KR101166278B1/en active IP Right Grant
-
2005
- 2005-05-09 JP JP2005136511A patent/JP4879511B2/en active Active
-
2008
- 2008-04-08 HK HK08103894.3A patent/HK1114185A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR101166278B1 (en) | 2012-07-17 |
JP2006013453A (en) | 2006-01-12 |
JP4879511B2 (en) | 2012-02-22 |
KR20070010195A (en) | 2007-01-22 |
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