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HK1167042A1 - 分類裝置 - Google Patents

分類裝置

Info

Publication number
HK1167042A1
HK1167042A1 HK12107688.8A HK12107688A HK1167042A1 HK 1167042 A1 HK1167042 A1 HK 1167042A1 HK 12107688 A HK12107688 A HK 12107688A HK 1167042 A1 HK1167042 A1 HK 1167042A1
Authority
HK
Hong Kong
Prior art keywords
classification apparatus
classification
Prior art date
Application number
HK12107688.8A
Other languages
English (en)
Inventor
增田高之
Original Assignee
上野精機株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上野精機株式會社 filed Critical 上野精機株式會社
Publication of HK1167042A1 publication Critical patent/HK1167042A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Specific Conveyance Elements (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
HK12107688.8A 2009-05-27 2012-08-06 分類裝置 HK1167042A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2009/002342 WO2010137072A1 (ja) 2009-05-27 2009-05-27 分類装置

Publications (1)

Publication Number Publication Date
HK1167042A1 true HK1167042A1 (zh) 2012-11-16

Family

ID=42306590

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12107688.8A HK1167042A1 (zh) 2009-05-27 2012-08-06 分類裝置

Country Status (5)

Country Link
JP (1) JP4466976B1 (zh)
CN (1) CN102449751B (zh)
HK (1) HK1167042A1 (zh)
MY (1) MY159061A (zh)
WO (1) WO2010137072A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5540193B2 (ja) * 2010-11-30 2014-07-02 上野精機株式会社 電子部品分類装置
WO2012073282A1 (ja) * 2010-11-30 2012-06-07 上野精機株式会社 電子部品保持装置、及びこれを備える電子部品検査装置、電子部品分類装置
CN109950179B (zh) * 2019-03-26 2021-11-09 佛山市劲电科技有限公司 一种用于芯片加工的防损坏的一体化分拣装置
CN111014055B (zh) * 2020-03-09 2020-05-26 征图新视(江苏)科技股份有限公司 偏光片孔洞检测设备
KR20230135661A (ko) * 2021-03-18 2023-09-25 토와 가부시기가이샤 가공 장치 및 가공품의 제조 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5841727U (ja) * 1981-09-11 1983-03-19 富士紡績株式会社 基板受取装置
JPH01184476A (ja) * 1988-01-19 1989-07-24 Hitachi Electron Eng Co Ltd Ｉｃハンドラの予熱・分類装置
JP3563108B2 (ja) * 1994-05-27 2004-09-08 株式会社アドバンテスト Ｉｃテストハンドラのデバイス搬送機構
JP3390601B2 (ja) * 1996-06-11 2003-03-24 宮崎沖電気株式会社 半導体製造装置
JPH1167879A (ja) * 1997-08-26 1999-03-09 Matsushita Electric Works Ltd 半導体実装方法及びその装置
JP3399308B2 (ja) * 1997-08-28 2003-04-21 松下電器産業株式会社 チップの仕分け装置および仕分け方法
JP3655847B2 (ja) * 2000-12-13 2005-06-02 Ｎｅｃマシナリー株式会社 リードレス半導体素子の複合処理方法及び複合処理装置
ES2298915T3 (es) * 2005-11-19 2008-05-16 Atlantic Zeiser Gmbh Instalacion de tratamiento de soportes de informacion.
US7528617B2 (en) * 2006-03-07 2009-05-05 Testmetrix, Inc. Apparatus having a member to receive a tray(s) that holds semiconductor devices for testing

Also Published As

Publication number Publication date
JPWO2010137072A1 (ja) 2012-11-12
CN102449751B (zh) 2014-10-15
WO2010137072A1 (ja) 2010-12-02
CN102449751A (zh) 2012-05-09
MY159061A (en) 2016-12-15
JP4466976B1 (ja) 2010-05-26

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190523