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HK1099124A1 - Connecting structure and connecting method of circuit - Google Patents

Connecting structure and connecting method of circuit

Info

Publication number
HK1099124A1
HK1099124A1 HK07105563.9A HK07105563A HK1099124A1 HK 1099124 A1 HK1099124 A1 HK 1099124A1 HK 07105563 A HK07105563 A HK 07105563A HK 1099124 A1 HK1099124 A1 HK 1099124A1
Authority
HK
Hong Kong
Prior art keywords
circuit
connecting structure
connecting method
Prior art date
Application number
HK07105563.9A
Inventor
Sakairi Mikio
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of HK1099124A1 publication Critical patent/HK1099124A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/46—Connecting or feeding means, e.g. leading-in conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
    • H01J2211/20—Constructional details
    • H01J2211/46—Connecting or feeding means, e.g. leading-in conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Combinations Of Printed Boards (AREA)
HK07105563.9A 2003-12-26 2007-05-28 Connecting structure and connecting method of circuit HK1099124A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003435618A JP4423970B2 (en) 2003-12-26 2003-12-26 Circuit connection structure and connection method
PCT/JP2004/011815 WO2005066992A1 (en) 2003-12-26 2004-08-18 Connecting structure and connecting method of circuit

Publications (1)

Publication Number Publication Date
HK1099124A1 true HK1099124A1 (en) 2007-08-03

Family

ID=34746908

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07105563.9A HK1099124A1 (en) 2003-12-26 2007-05-28 Connecting structure and connecting method of circuit

Country Status (6)

Country Link
JP (1) JP4423970B2 (en)
KR (1) KR100939607B1 (en)
CN (1) CN1898764B (en)
HK (1) HK1099124A1 (en)
TW (1) TWI244667B (en)
WO (1) WO2005066992A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100820631B1 (en) * 2006-10-10 2008-04-11 엘지전자 주식회사 Plasma display apparatus
KR100814819B1 (en) 2006-10-31 2008-03-20 삼성에스디아이 주식회사 Plasma display device
JP2008205132A (en) * 2007-02-19 2008-09-04 Nec Corp Printed wiring board, and solder connection structure and method between the structure and flexible printed board
WO2009047846A1 (en) * 2007-10-10 2009-04-16 Hitachi, Ltd. Display panel and lighting tester
KR100904710B1 (en) 2007-11-01 2009-06-29 삼성에스디아이 주식회사 Flexible printed circuit board, junction method thereof and battery pack using the same
JP5247571B2 (en) * 2008-04-24 2013-07-24 パナソニック株式会社 Wiring board and wiring board connection method
CN101713875B (en) * 2008-10-07 2011-10-12 元太科技工业股份有限公司 Flexible display panel
JP5293955B2 (en) * 2009-02-18 2013-09-18 コニカミノルタ株式会社 The camera module
KR20110066597A (en) 2009-12-11 2011-06-17 삼성에스디아이 주식회사 Light emission device and display device with the same
JP2012069548A (en) 2010-09-21 2012-04-05 Brother Ind Ltd Structure and method for connecting wiring board
JP5695881B2 (en) * 2010-10-28 2015-04-08 デクセリアルズ株式会社 Electronic component connection method and connection structure
JP5382010B2 (en) 2011-01-24 2014-01-08 ブラザー工業株式会社 WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
KR101966241B1 (en) * 2012-05-31 2019-04-05 엘지이노텍 주식회사 Touch window and manufacturing method thereof
JP6344888B2 (en) * 2013-03-27 2018-06-20 デクセリアルズ株式会社 Connection body manufacturing method, electronic component connection method, connection structure
JP6329014B2 (en) * 2014-06-19 2018-05-23 積水化学工業株式会社 Connection structure and method for manufacturing connection structure
CN109315068A (en) * 2016-05-11 2019-02-05 伟创立汽车工业有限公司 Circuit unit and its manufacturing method
CN107979915B (en) * 2016-10-25 2020-10-30 宁波舜宇光电信息有限公司 Circuit board substrate, camera module, manufacturing method of camera module and electronic equipment
JP6600019B2 (en) * 2017-09-08 2019-10-30 株式会社タムラ製作所 Method for manufacturing electronic substrate and anisotropic conductive paste
WO2023171464A1 (en) * 2022-03-08 2023-09-14 株式会社村田製作所 Stretchable device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3492195B2 (en) * 1997-04-30 2004-02-03 松下電器産業株式会社 Electrode bonding method for plasma display panel
JP2000299555A (en) * 1999-04-13 2000-10-24 Advanced Display Inc Method for connecting circuit board
JP2003297516A (en) 2002-03-29 2003-10-17 Optrex Corp Connection method of flexible board

Also Published As

Publication number Publication date
JP2005197001A (en) 2005-07-21
JP4423970B2 (en) 2010-03-03
WO2005066992A1 (en) 2005-07-21
KR20060103460A (en) 2006-09-29
CN1898764B (en) 2010-05-12
TWI244667B (en) 2005-12-01
TW200522121A (en) 2005-07-01
CN1898764A (en) 2007-01-17
KR100939607B1 (en) 2010-02-01

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Legal Events

Date Code Title Description
PE Patent expired

Effective date: 20240817