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HK1074816A1 - Resin sealing molding apparatus - Google Patents

Resin sealing molding apparatus

Info

Publication number
HK1074816A1
HK1074816A1 HK05107137A HK05107137A HK1074816A1 HK 1074816 A1 HK1074816 A1 HK 1074816A1 HK 05107137 A HK05107137 A HK 05107137A HK 05107137 A HK05107137 A HK 05107137A HK 1074816 A1 HK1074816 A1 HK 1074816A1
Authority
HK
Hong Kong
Prior art keywords
molding apparatus
resin sealing
sealing molding
resin
sealing
Prior art date
Application number
HK05107137A
Inventor
Kenji Ogata
Yuichi Tanaka
Original Assignee
Dai Ichi Seiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Ichi Seiko Co Ltd filed Critical Dai Ichi Seiko Co Ltd
Publication of HK1074816A1 publication Critical patent/HK1074816A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1753—Cleaning or purging, e.g. of the injection unit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1769—Handling of moulded articles or runners, e.g. sorting, stacking, grinding of runners

Landscapes

  • Engineering & Computer Science (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
HK05107137A 2003-10-30 2005-08-17 Resin sealing molding apparatus HK1074816A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003370707A JP3609824B1 (en) 2003-10-30 2003-10-30 Resin sealing molding equipment

Publications (1)

Publication Number Publication Date
HK1074816A1 true HK1074816A1 (en) 2005-11-25

Family

ID=34101303

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05107137A HK1074816A1 (en) 2003-10-30 2005-08-17 Resin sealing molding apparatus

Country Status (5)

Country Link
JP (1) JP3609824B1 (en)
KR (1) KR100675466B1 (en)
CN (1) CN100366414C (en)
HK (1) HK1074816A1 (en)
TW (1) TWI251885B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3926379B1 (en) * 2006-10-25 2007-06-06 株式会社エヌ．エフ．テイ Resin molding equipment
CN102785326A (en) * 2011-05-19 2012-11-21 深圳市安托山特种机电有限公司 Novel injection machine for package materials
JP5387646B2 (en) * 2011-10-07 2014-01-15 第一精工株式会社 Resin sealing device
JP5866398B2 (en) 2013-05-15 2016-02-17 東芝機械株式会社 Molding system and method for manufacturing molded article
JP6218549B2 (en) * 2013-10-17 2017-10-25 Ｔｏｗａ株式会社 Semiconductor substrate supply method and semiconductor substrate supply apparatus for semiconductor encapsulated type
JP7068094B2 (en) * 2018-08-10 2022-05-16 アピックヤマダ株式会社 Work transfer device, resin transfer device and resin molding method
JP7335647B2 (en) * 2018-08-10 2023-08-30 アピックヤマダ株式会社 Work transfer device and resin molding device
JP7203414B2 (en) * 2018-12-27 2023-01-13 アピックヤマダ株式会社 Resin supply/take-out device, workpiece transfer device, and resin molding device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06830A (en) * 1992-06-22 1994-01-11 Toshiba Corp Mold system
TW257745B (en) * 1993-07-22 1995-09-21 Towa Kk
TW410194B (en) * 1996-08-20 2000-11-01 Apic Yamada Kk Resin molding machine
TW509615B (en) * 2000-04-21 2002-11-11 Apic Yamada Corp Resin molding machine and resin tablet feeding machine
JP4327986B2 (en) * 2000-04-21 2009-09-09 アピックヤマダ株式会社 Resin sealing device

Also Published As

Publication number Publication date
JP2005136193A (en) 2005-05-26
KR20050041890A (en) 2005-05-04
KR100675466B1 (en) 2007-01-26
TWI251885B (en) 2006-03-21
JP3609824B1 (en) 2005-01-12
CN100366414C (en) 2008-02-06
TW200529335A (en) 2005-09-01
CN1611339A (en) 2005-05-04

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20201027