HK1042780A1 - Non-circular micro-via - Google Patents

Non-circular micro-via

Info

Publication number: HK1042780A1
Authority: HK; Hong Kong
Prior art keywords: circular micro; micro; circular
Prior art date: 1998-09-10

Application number

HK02101572A

Other languages

English (en)

Inventor

Martin A Cotton

Original Assignee

Viasystems Group Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1998-09-10

Filing date

2002-02-28

Publication date

2002-08-23

2002-02-28 Application filed by Viasystems Group Inc filed Critical Viasystems Group Inc

2002-08-23 Publication of HK1042780A1 publication Critical patent/HK1042780A1/xx

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09354—Ground conductor along edge of main surface
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Electromagnetism (AREA)
Structure Of Printed Boards (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Multi-Conductor Connections (AREA)
Manufacturing Of Printed Wiring (AREA)
Parts Printed On Printed Circuit Boards (AREA)
Laminated Bodies (AREA)

HK02101572A 1998-09-10 2002-02-28 Non-circular micro-via HK1042780A1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US9973098P	1998-09-10	1998-09-10
PCT/US1999/020418 WO2000016443A1 (en)	1998-09-10	1999-09-07	Non-circular micro-via

Publications (1)

Publication Number	Publication Date
HK1042780A1 true HK1042780A1 (en)	2002-08-23

Family

ID=22276347

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
HK02101572A HK1042780A1 (en)	1998-09-10	2002-02-28	Non-circular micro-via

Country Status (16)

Country	Link
EP (1)	EP1127387B1 (pt)
JP (1)	JP2002525854A (pt)
KR (3)	KR20010086372A (pt)
CN (1)	CN1133240C (pt)
AU (2)	AU5812099A (pt)
BR (1)	BR9913588A (pt)
CA (1)	CA2343445A1 (pt)
DE (1)	DE69934814T2 (pt)
EA (1)	EA003157B1 (pt)
ES (1)	ES2281188T3 (pt)
HK (1)	HK1042780A1 (pt)
IL (1)	IL141826A0 (pt)
NO (1)	NO20011219L (pt)
PL (1)	PL346561A1 (pt)
TR (1)	TR200100713T2 (pt)
WO (2)	WO2000016443A1 (pt)

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DE10052532C2 (de) *	2000-10-23	2002-11-14	Conducta Endress & Hauser	Leiterplatte mit einer Eingangsschaltung zur Aufnahme und Verarbeitung eines elektrischen Signals sowie Verwendung der Leiterplatte
KR20030053466A (ko) *	2001-01-24	2003-06-28	코닌클리케 필립스 일렉트로닉스 엔.브이.	기판 위에 트랙을 제조하는 방법
DE10219388A1 (de) *	2002-04-30	2003-11-20	Siemens Ag	Verfahren zur Erzeugung einer Grabenstruktur in einem Polymer-Substrat
WO2007052396A1 (ja) *	2005-10-31	2007-05-10	Sharp Kabushiki Kaisha	多層配線基板及び多層配線基板の製造方法
JP2009033114A (ja) *	2007-06-29	2009-02-12	Tdk Corp	電子モジュール、及び電子モジュールの製造方法
DE102009019782A1 (de)	2009-05-02	2010-11-04	Valeo Schalter Und Sensoren Gmbh	Verfahren zur Herstellung von durchkontaktierbaren Leiterplatten
JP2011061021A (ja) *	2009-09-10	2011-03-24	Kyokutoku Kagi Kofun Yugenkoshi	非円柱ビア構造及びこのビア構造を有する伝熱促進基板
US8488329B2 (en)	2010-05-10	2013-07-16	International Business Machines Corporation	Power and ground vias for power distribution systems
US8748750B2 (en)	2011-07-08	2014-06-10	Honeywell International Inc.	Printed board assembly interface structures
CN105009283B (zh) *	2013-01-09	2018-05-08	恩智浦美国有限公司	电子高频装置以及制造方法
KR102128508B1 (ko) *	2013-10-08	2020-06-30	엘지이노텍 주식회사	인쇄회로기판
KR101507268B1 (ko) *	2014-01-10	2015-03-30	(주)인터플렉스	연성회로기판의 그라운드 확장 구조
US20170064821A1 (en) *	2015-08-31	2017-03-02	Kristof Darmawikarta	Electronic package and method forming an electrical package
US10516207B2 (en)	2017-05-17	2019-12-24	Nxp B.V.	High frequency system, communication link
FR3077158B1 (fr)	2018-01-25	2021-02-26	Commissariat Energie Atomique	Puce electronique a face arriere protegee par une structure de fragilisation amelioree
ES2884900T3 (es) *	2018-06-13	2021-12-13	Airbus Operations Slu	Procedimiento para instalar cables impresos en sistemas colectores de cables para aeronaves, y elemento compuesto con un sistema colector de cables integrado
US11981501B2 (en)	2019-03-12	2024-05-14	Absolics Inc.	Loading cassette for substrate including glass and substrate loading method to which same is applied
CN113366628B (zh)	2019-03-12	2022-09-30	爱玻索立克公司	封装基板及包括其的半导体装置
US11967542B2 (en)	2019-03-12	2024-04-23	Absolics Inc.	Packaging substrate, and semiconductor device comprising same
JP7087205B2 (ja)	2019-03-29	2022-06-20	アブソリックスインコーポレイテッド	半導体用パッケージングガラス基板、半導体用パッケージング基板及び半導体装置
KR102413117B1 (ko)	2019-08-23	2022-06-24	앱솔릭스 인코포레이티드	패키징 기판 및 이를 포함하는 반도체 장치
KR20220003342A (ko)	2020-07-01	2022-01-10	삼성전기주식회사	전자 소자 패키지 및 이의 제조방법

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CA939831A (en) *	1969-03-27	1974-01-08	Frederick W. Schneble (Jr.)	Plated through hole printed circuit boards
US5347086A (en) *	1992-03-24	1994-09-13	Microelectronics And Computer Technology Corporation	Coaxial die and substrate bumps
US5304743A (en) *	1992-05-12	1994-04-19	Lsi Logic Corporation	Multilayer IC semiconductor package
JP3241139B2 (ja) *	1993-02-04	2001-12-25	三菱電機株式会社	フィルムキャリア信号伝送線路
US5401912A (en) *	1993-06-07	1995-03-28	St Microwave Corp., Arizona Operations	Microwave surface mount package
US5359767A (en) *	1993-08-26	1994-11-01	International Business Machines Corporation	Method of making multilayered circuit board
JPH07235775A (ja) *	1994-02-21	1995-09-05	Mitsubishi Electric Corp	多層プリント配線基板
US5773195A (en) *	1994-12-01	1998-06-30	International Business Machines Corporation	Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic structures including the cap, and a process of forming the cap and for forming multi-layer electronic structures including the cap
WO1998006243A1 (de) *	1996-07-31	1998-02-12	Dyconex Patente	Verfahren zur herstellung von verbindungsleitern
US5724727A (en) *	1996-08-12	1998-03-10	Motorola, Inc.	Method of forming electronic component

1999
- 1999-09-07 ES ES99945538T patent/ES2281188T3/es not_active Expired - Lifetime
- 1999-09-07 IL IL14182699A patent/IL141826A0/xx unknown
- 1999-09-07 WO PCT/US1999/020418 patent/WO2000016443A1/en active IP Right Grant
- 1999-09-07 TR TR2001/00713T patent/TR200100713T2/xx unknown
- 1999-09-07 EA EA200100329A patent/EA003157B1/ru active IP Right Revival
- 1999-09-07 BR BR9913588-4A patent/BR9913588A/pt not_active IP Right Cessation
- 1999-09-07 EP EP99945538A patent/EP1127387B1/en not_active Expired - Lifetime
- 1999-09-07 PL PL99346561A patent/PL346561A1/xx unknown
- 1999-09-07 KR KR1020017002973A patent/KR20010086372A/ko active Application Filing
- 1999-09-07 CA CA002343445A patent/CA2343445A1/en not_active Abandoned
- 1999-09-07 JP JP2000570871A patent/JP2002525854A/ja active Pending
- 1999-09-07 DE DE69934814T patent/DE69934814T2/de not_active Expired - Fee Related
- 1999-09-07 CN CN998107409A patent/CN1133240C/zh not_active Expired - Fee Related
- 1999-09-07 AU AU58120/99A patent/AU5812099A/en not_active Abandoned
- 1999-09-09 AU AU58209/99A patent/AU5820999A/en not_active Withdrawn
- 1999-09-09 WO PCT/US1999/020830 patent/WO2000014771A2/en unknown
2001
- 2001-03-09 NO NO20011219A patent/NO20011219L/no not_active Application Discontinuation
2002
- 2002-02-28 HK HK02101572A patent/HK1042780A1/xx not_active IP Right Cessation
2003
- 2003-08-25 KR KR10-2003-0058608A patent/KR20030074544A/ko not_active Application Discontinuation
- 2003-08-25 KR KR10-2003-0058610A patent/KR100455021B1/ko not_active IP Right Cessation

Also Published As

Publication number	Publication date
DE69934814D1 (de)	2007-02-22
EP1127387A1 (en)	2001-08-29
BR9913588A (pt)	2001-06-05
TR200100713T2 (tr)	2001-10-22
CN1133240C (zh)	2003-12-31
KR100455021B1 (ko)	2004-11-06
EA200100329A1 (ru)	2001-10-22
KR20030074545A (ko)	2003-09-19
EA003157B1 (ru)	2003-02-27
KR20010086372A (ko)	2001-09-10
IL141826A0 (en)	2002-03-10
EP1127387B1 (en)	2007-01-10
NO20011219L (no)	2001-05-04
PL346561A1 (en)	2002-02-11
CN1317163A (zh)	2001-10-10
AU5812099A (en)	2000-04-03
CA2343445A1 (en)	2000-03-23
NO20011219D0 (no)	2001-03-09
ES2281188T3 (es)	2007-09-16
JP2002525854A (ja)	2002-08-13
WO2000016443A1 (en)	2000-03-23
DE69934814T2 (de)	2007-10-11
EP1127387A4 (en)	2004-05-26
WO2000014771A2 (en)	2000-03-16
AU5820999A (en)	2000-03-27
KR20030074544A (ko)	2003-09-19

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DE59912932D1 (en)	2006-01-19	Arylphenylsubstituierte cyclische ketoenole
DE59912303D1 (en)	2005-08-25	Arylphenylsubstituierte cyclische ketoenole
IL141826A0 (en)	2002-03-10	Non-circular micro-via
DE69904335D1 (en)	2003-01-16	Aminomethylcarbonsäurederivate
DE69835235D1 (en)	2006-08-24	Thermoplastische silikonelastomere
DE59903023D1 (en)	2002-11-14	Perorale wirkstoff-suspension
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HUP0101753A3 (en)	2002-05-28	Boring-tool
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DE69904442D1 (en)	2003-01-23	Cyclohexandiol-derivate
GB9825643D0 (en)	1999-01-13	Drawing boards
GB2341012B (en)	2000-07-26	HF-tight bushing
DE59904407D1 (en)	2003-04-03	Chromanderivate
DE69821502D1 (en)	2004-03-11	Boroskop
GB9816729D0 (en)	1998-09-30	Substituted cyclohexylaminopyrimidines
PL347397A1 (en)	2002-04-08	Substituted 3-aryl-pyrazoles
DE59900471D1 (en)	2002-01-10	Inchbremseinrichtung
PL345866A1 (en)	2002-01-14	Substituted cyclooctadepsipeptides
HK1039335A1 (zh)	2002-04-19	取代的苯甲酰基環已二酮類化合物
DE69902586D1 (en)	2002-09-26	Expandierte ethylencopolymere
GB2341222B (en)	2001-04-11	Adjusting unit
DE59905941D1 (en)	2003-07-17	Methoximinophenylessigsäureamide
GB0005589D0 (en)	2000-05-03	New
DE59911094D1 (en)	2004-12-23	Tryptase-inhibitoren
GB9807027D0 (en)	1998-06-03	Screw

Legal Events

Date	Code	Title	Description
2012-04-20	PC	Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)	Effective date: 20110907