[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

GB993504A - Semi-conductor devices - Google Patents

Semi-conductor devices

Info

Publication number
GB993504A
GB993504A GB850263A GB850263A GB993504A GB 993504 A GB993504 A GB 993504A GB 850263 A GB850263 A GB 850263A GB 850263 A GB850263 A GB 850263A GB 993504 A GB993504 A GB 993504A
Authority
GB
United Kingdom
Prior art keywords
semi
lead
diode
conductor
spacer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB850263A
Inventor
Anthony Peter Clelford
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Mobility Ltd
Original Assignee
Westinghouse Brake and Signal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Brake and Signal Co Ltd filed Critical Westinghouse Brake and Signal Co Ltd
Priority to GB850263A priority Critical patent/GB993504A/en
Publication of GB993504A publication Critical patent/GB993504A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fire Alarms (AREA)

Abstract

993,504. Semi-conductor devices. WESTINGHOUSE BRAKE & SIGNAL CO. Ltd. Feb. 11, 1964 [March 4, 1963], No. 8502/63. Heading H1K. A semi-conductor diode is contained in a housing provided with two end caps to which the electrodes of the diode are connected and which have projecting tags whereby the device can be connected to a printed circuit. As shown, a semi-conductor diode 4 is mounted inside a metal can 2 the end wall 3 of which forms one electrode. A lead 7 comprises a wire 9, connected to the second electrode 6 of diode 4, and a tubular member 10 which is supported coaxially with can 2 by an electrically insulating seal 8 and is crimped at 11 to wire 9. A lead S is provided at the closed end 3 of can 2. A spacer 27 of insulating material is threaded on to lead 7 and two metal end caps 20, 24 each provided with a central hole and a radially projecting tag 23, 26 are threaded over leads 5 and 7 respectively, pushed on to the ends of the can and spacer and soldered to the leads. Any excess lead is then cut off. Tags 23, 26 may be pressed into suitable apertures in a printed circuit board, and may be of different widths to polarize the connections of the device.
GB850263A 1963-03-04 1963-03-04 Semi-conductor devices Expired GB993504A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB850263A GB993504A (en) 1963-03-04 1963-03-04 Semi-conductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB850263A GB993504A (en) 1963-03-04 1963-03-04 Semi-conductor devices

Publications (1)

Publication Number Publication Date
GB993504A true GB993504A (en) 1965-05-26

Family

ID=9853701

Family Applications (1)

Application Number Title Priority Date Filing Date
GB850263A Expired GB993504A (en) 1963-03-04 1963-03-04 Semi-conductor devices

Country Status (1)

Country Link
GB (1) GB993504A (en)

Similar Documents

Publication Publication Date Title
NL157456B (en) SEMI-CONDUCTOR DEVICE IN AN INSULATING PLASTIC COVER.
GB1176390A (en) Moulded Case Circuit Breaker and Mounting Means therefor
GB937516A (en) Improvements relating to electrical connections
ES374813A1 (en) Semiconductor rectifier assembly having high explosion rating
GB2060255B (en) Four terminal pulse suppressor
GB1181459A (en) Improvements in Semiconductor Structures
GB1349720A (en) Protector for electric circuits
GB993504A (en) Semi-conductor devices
GB1472347A (en) Camera tubes
JPS5152306Y2 (en)
ES158004U (en) A SET OF ELECTRICAL TERMINAL.
GB512124A (en) Improvements in or relating to terminals for electrical condensers and like apparatus
GB1055074A (en) Terminating coil ends with lead-out wires
GB1021320A (en) Microminiature electrical connection
GB846559A (en) Improvements in or relating to a method of securing electrical components to circuit panels having adhering conductors
GB609061A (en) Improvements in or relating to terminals for electric condensers and like components in sealed containers
ES352861A1 (en) An encapsulated semiconductor device. (Machine-translation by Google Translate, not legally binding)
ES309968A1 (en) Improvements in the assembly of fixed condensers in printed electrical circuits. (Machine-translation by Google Translate, not legally binding)
GB1205522A (en) A capacitor type cable terminal
GB584807A (en) Improvements in or relating to tubular containers for electrical condensers or other apparatus
GB1319573A (en) Semiconductor devices
ES89252U (en) Air circuit breaker (Machine-translation by Google Translate, not legally binding)
ES327388A1 (en) Assembly method for the manufacture of encapsulated semiconductor devices provided with terminal conductors. (Machine-translation by Google Translate, not legally binding)
FR2315761A1 (en) Fuse box for farm tractor - has set of terminals each with fuse wire between insulated upper and lower contacts
ES114740U (en) Alarm device. (Machine-translation by Google Translate, not legally binding)