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GB9517225D0 - Circuit board production - Google Patents

Circuit board production

Info

Publication number
GB9517225D0
GB9517225D0 GBGB9517225.0A GB9517225A GB9517225D0 GB 9517225 D0 GB9517225 D0 GB 9517225D0 GB 9517225 A GB9517225 A GB 9517225A GB 9517225 D0 GB9517225 D0 GB 9517225D0
Authority
GB
United Kingdom
Prior art keywords
circuit board
board production
production
circuit
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB9517225.0A
Other versions
GB2305018A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB9517225A priority Critical patent/GB2305018A/en
Publication of GB9517225D0 publication Critical patent/GB9517225D0/en
Publication of GB2305018A publication Critical patent/GB2305018A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936Marks, inscriptions, etc. for information
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10689Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
GB9517225A 1995-08-23 1995-08-23 Printed circuit boards having circuitry on an insulating sheet Withdrawn GB2305018A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9517225A GB2305018A (en) 1995-08-23 1995-08-23 Printed circuit boards having circuitry on an insulating sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9517225A GB2305018A (en) 1995-08-23 1995-08-23 Printed circuit boards having circuitry on an insulating sheet

Publications (2)

Publication Number Publication Date
GB9517225D0 true GB9517225D0 (en) 1995-10-25
GB2305018A GB2305018A (en) 1997-03-26

Family

ID=10779622

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9517225A Withdrawn GB2305018A (en) 1995-08-23 1995-08-23 Printed circuit boards having circuitry on an insulating sheet

Country Status (1)

Country Link
GB (1) GB2305018A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10118866A1 (en) * 2001-04-18 2002-10-24 Swoboda Gmbh Geb Radar antenna with metal foil coating is made by separate injection molding of plastic part and electroforming of metal foil and joining them with adhesive

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2964124D1 (en) * 1978-02-01 1983-01-05 Du Pont Producing printed circuits by soldering metal powder images
US4571072A (en) * 1983-09-30 1986-02-18 Honeywell Information Systems Inc. System and method for making changes to printed wiring boards
GB2189350B (en) * 1986-04-16 1989-11-29 Marconi Electronic Devices Electrical circuits
DE4129964C2 (en) * 1991-09-10 2001-05-03 Sel Alcatel Ag Method for producing an electrically conductive fastening of an integrated circuit on a printed circuit
US5277734A (en) * 1991-11-07 1994-01-11 Fred Bayer Holdings Inc. Electrically conductive circuit sheet and method and apparatus for making same

Also Published As

Publication number Publication date
GB2305018A (en) 1997-03-26

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)