GB919272A - Electrolytic copper plating baths - Google Patents
Electrolytic copper plating bathsInfo
- Publication number
- GB919272A GB919272A GB44559/61A GB4455961A GB919272A GB 919272 A GB919272 A GB 919272A GB 44559/61 A GB44559/61 A GB 44559/61A GB 4455961 A GB4455961 A GB 4455961A GB 919272 A GB919272 A GB 919272A
- Authority
- GB
- United Kingdom
- Prior art keywords
- isothiourea
- alkyl
- atom
- carboxy
- plating baths
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
919,272. Copper-plating baths. DEHYDAG DEUTSCHE HYDRIENWERKE G.m.b.H. Dec. 13, 1961 [Feb. 20, 1961], No. 44559/61. Addition to 872,879. Class 41. Copper-plating baths include as a levelling agent an alkyl or aryl isothiourea which contains a COOH group substituted at the N atom, and in which the S group is neutralized by substitution therein of a group, e.g. alkyl, alkenyl, phenacyl, carbo-alkoxy, or carboxy alkyl. Examples are : S-methyl N.phenyl.N<SP>1</SP>.carboxy. methyl isothiourea, S-carboethoxy N-phenyl- N<SP>l</SP>-carboxy methyl isothiourea, and may be obtained by reacting the isothiourea N-substitution product containing the reactive S atom with halogen compounds, e.g. alkyl halides or halo-carboxylic acids or ketones. Such compounds are also formed by linking two isothiourea molecules by methylene groups via the S atom. These products are used in conjunction with lustring agents, as described in the parent Specification, e.g. N: N-dimethyl dithio-carbamic acid alkyl ester sulphonates. Ductility improving agents, e.g. 1: 3-propylene diamine, may also be added.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DED35441A DE1142741B (en) | 1961-02-20 | 1961-02-20 | Acid galvanic copper baths |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB919272A true GB919272A (en) | 1963-02-20 |
Family
ID=7042639
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB11122/60A Expired GB872879A (en) | 1961-02-20 | 1960-03-30 | Electrolytic copper-plating baths |
| GB44559/61A Expired GB919272A (en) | 1961-02-20 | 1961-12-13 | Electrolytic copper plating baths |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB11122/60A Expired GB872879A (en) | 1961-02-20 | 1960-03-30 | Electrolytic copper-plating baths |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US3023152A (en) |
| DE (1) | DE1142741B (en) |
| GB (2) | GB872879A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB872879A (en) * | 1961-02-20 | 1961-07-12 | Dehydag Gmbh | Electrolytic copper-plating baths |
| JPS544329B2 (en) * | 1973-03-20 | 1979-03-06 | ||
| US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
| KR20040073974A (en) * | 2003-02-14 | 2004-08-21 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. | Electroplating composition |
| DE102014208733A1 (en) | 2014-05-09 | 2015-11-12 | Dr. Hesse Gmbh & Cie Kg | Process for the electrolytic deposition of copper from water-based electrolytes |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2563360A (en) * | 1941-05-24 | 1951-08-07 | Gen Motors Corp | Electrodeposition of copper |
| US2696467A (en) * | 1952-01-04 | 1954-12-07 | Gen Motors Corp | Copper plating bath and process |
| US2738318A (en) * | 1954-12-28 | 1956-03-13 | Udylite Res Corp | Electrodeposition of copper from an acid bath |
| BE565994A (en) * | 1957-04-16 | |||
| US2954331A (en) * | 1958-08-14 | 1960-09-27 | Dayton Bright Copper Company | Bright copper plating bath |
| GB872879A (en) * | 1961-02-20 | 1961-07-12 | Dehydag Gmbh | Electrolytic copper-plating baths |
-
1960
- 1960-03-30 GB GB11122/60A patent/GB872879A/en not_active Expired
- 1960-04-28 US US25242A patent/US3023152A/en not_active Expired - Lifetime
-
1961
- 1961-02-20 DE DED35441A patent/DE1142741B/en active Pending
- 1961-12-13 GB GB44559/61A patent/GB919272A/en not_active Expired
-
1962
- 1962-01-25 US US168796A patent/US3179578A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US3023152A (en) | 1962-02-27 |
| GB872879A (en) | 1961-07-12 |
| DE1142741B (en) | 1963-01-24 |
| US3179578A (en) | 1965-04-20 |
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