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GB8902431D0 - Flip chip solder bond structure for devices with gold based metallisation - Google Patents

Flip chip solder bond structure for devices with gold based metallisation

Info

Publication number
GB8902431D0
GB8902431D0 GB898902431A GB8902431A GB8902431D0 GB 8902431 D0 GB8902431 D0 GB 8902431D0 GB 898902431 A GB898902431 A GB 898902431A GB 8902431 A GB8902431 A GB 8902431A GB 8902431 D0 GB8902431 D0 GB 8902431D0
Authority
GB
United Kingdom
Prior art keywords
metallisation
devices
flip chip
bond structure
solder bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB898902431A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plessey Co Ltd
Original Assignee
Plessey Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Co Ltd filed Critical Plessey Co Ltd
Priority to GB898902431A priority Critical patent/GB8902431D0/en
Publication of GB8902431D0 publication Critical patent/GB8902431D0/en
Priority to GB8911147A priority patent/GB2228825B/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53242—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being a noble metal, e.g. gold
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    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53242—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being a noble metal, e.g. gold
    • H01L23/53252—Additional layers associated with noble-metal layers, e.g. adhesion, barrier, cladding layers
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    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
GB898902431A 1989-02-03 1989-02-03 Flip chip solder bond structure for devices with gold based metallisation Pending GB8902431D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB898902431A GB8902431D0 (en) 1989-02-03 1989-02-03 Flip chip solder bond structure for devices with gold based metallisation
GB8911147A GB2228825B (en) 1989-02-03 1989-05-16 A method of making a flip chip solder bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB898902431A GB8902431D0 (en) 1989-02-03 1989-02-03 Flip chip solder bond structure for devices with gold based metallisation

Publications (1)

Publication Number Publication Date
GB8902431D0 true GB8902431D0 (en) 1989-03-22

Family

ID=10651083

Family Applications (2)

Application Number Title Priority Date Filing Date
GB898902431A Pending GB8902431D0 (en) 1989-02-03 1989-02-03 Flip chip solder bond structure for devices with gold based metallisation
GB8911147A Expired - Fee Related GB2228825B (en) 1989-02-03 1989-05-16 A method of making a flip chip solder bonding device

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB8911147A Expired - Fee Related GB2228825B (en) 1989-02-03 1989-05-16 A method of making a flip chip solder bonding device

Country Status (1)

Country Link
GB (2) GB8902431D0 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5266520A (en) * 1991-02-11 1993-11-30 International Business Machines Corporation Electronic packaging with varying height connectors
US5173763A (en) * 1991-02-11 1992-12-22 International Business Machines Corporation Electronic packaging with varying height connectors
GB2292016B (en) * 1994-07-29 1998-07-22 Plessey Semiconductors Ltd Inductor device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3663184A (en) * 1970-01-23 1972-05-16 Fairchild Camera Instr Co Solder bump metallization system using a titanium-nickel barrier layer
US4273859A (en) * 1979-12-31 1981-06-16 Honeywell Information Systems Inc. Method of forming solder bump terminals on semiconductor elements
GB2095904B (en) * 1981-03-23 1985-11-27 Gen Electric Semiconductor device with built-up low resistance contact and laterally conducting second contact
US4661375A (en) * 1985-04-22 1987-04-28 At&T Technologies, Inc. Method for increasing the height of solder bumps

Also Published As

Publication number Publication date
GB8911147D0 (en) 1989-07-05
GB2228825A (en) 1990-09-05
GB2228825B (en) 1993-01-06

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