GB860807A - Improvements in or relating to methods of manufacturing vacuum-tight envelopes - Google Patents
Improvements in or relating to methods of manufacturing vacuum-tight envelopesInfo
- Publication number
- GB860807A GB860807A GB3615057A GB3615057A GB860807A GB 860807 A GB860807 A GB 860807A GB 3615057 A GB3615057 A GB 3615057A GB 3615057 A GB3615057 A GB 3615057A GB 860807 A GB860807 A GB 860807A
- Authority
- GB
- United Kingdom
- Prior art keywords
- copper
- base
- cap
- iron
- joined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 9
- 229910052802 copper Inorganic materials 0.000 abstract 9
- 239000010949 copper Substances 0.000 abstract 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 8
- 229910052742 iron Inorganic materials 0.000 abstract 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 229910052732 germanium Inorganic materials 0.000 abstract 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 abstract 2
- 229910052738 indium Inorganic materials 0.000 abstract 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 229910000831 Steel Inorganic materials 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 239000010959 steel Substances 0.000 abstract 1
- 238000005482 strain hardening Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J31/00—Cathode ray tubes; Electron beam tubes
- H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
- H01J31/50—Image-conversion or image-amplification tubes, i.e. having optical, X-ray, or analogous input, and optical output
- H01J31/54—Image-conversion or image-amplification tubes, i.e. having optical, X-ray, or analogous input, and optical output in which the electron ray or beam is reflected by the image input screen on to the image output screen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
- H01J5/20—Seals between parts of vessels
- H01J5/22—Vacuum-tight joints between parts of vessel
- H01J5/28—Vacuum-tight joints between parts of vessel between conductive parts of vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2893/00—Discharge tubes and lamps
- H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
- H01J2893/0037—Solid sealing members other than lamp bases
- H01J2893/0044—Direct connection between two metal elements, in particular via material a connecting material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Adjustable Resistors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
860,807. Semi-conductor devices. PHILIPS ELECTRICAL INDUSTRIES Ltd. Nov. 20, 1957 [Nov. 23, 1956], No. 36150/57. Class 37. [Also in Group XXII] In the manufacture of an envelope for a semiconductor such as a transistor, a copper cap 2 is joined to an iron base 1 having an annular groove 3 milled therein. Upon application of pressure and due to the work hardening of the copper the walls of the groove become closed in at 6, 7, Fig. 3. The base may have a central portion of copper soldered thereto, Fig. 8 (not shown) or the cap may be of steel and the base of copper, Fig. 4 (not shown). In other expedients, Figs. 5, 7 (not shown), a copper cap and a copper base having two parallel holes are joined to the same on opposite sides of an iron plate. The groove 3, Fig. 6, may be provided in an iron insert 21 fixed in a copper base plate 20. Two concentric grooves, Fig. 9, are provided in an iron base 30 for forming a vacuum-tight joint with the cap. The latter encloses a transistor comprising a protrusion 31 of the base 30, plated successively with copper and gilt and secured by a disc 32 of indium to a disc 33 of germanium. The latter is connected by a nickel strip 35 with a base contact pin 37. A second indium electrode 34 is joined to the germanium disc and is connected by a copper strip 39 with an emitter contact pin 38. The envelope constitutes the contact for the collector 32.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL212445 | 1956-11-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB860807A true GB860807A (en) | 1961-02-08 |
Family
ID=19750812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB3615057A Expired GB860807A (en) | 1956-11-23 | 1957-11-20 | Improvements in or relating to methods of manufacturing vacuum-tight envelopes |
Country Status (4)
| Country | Link |
|---|---|
| CH (1) | CH363094A (en) |
| DE (1) | DE1111299B (en) |
| FR (1) | FR1186598A (en) |
| GB (1) | GB860807A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3068382A (en) * | 1960-05-23 | 1962-12-11 | Westinghouse Electric Corp | Hermetically sealed semiconductor devices |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1164577A (en) * | 1915-04-03 | 1915-12-14 | James Godfrey | Boiler-flue joint. |
| DE335213C (en) * | 1920-05-28 | 1921-03-24 | Walter Overhoff Dipl Ing | Connection of metallic components |
| CH297932A (en) * | 1942-11-12 | 1954-04-15 | Grossfuss Johannes | Method for connecting a hollow sheet metal sleeve to an insert. |
| DE918090C (en) * | 1943-11-03 | 1954-09-20 | Siemens Ag | Connecting parts that run at least partially in a straight line |
| AT179700B (en) * | 1945-10-02 | 1954-09-25 | Ernst Koller | Method for the permanent connection of structural parts, in particular of profile pieces |
| DE842729C (en) * | 1949-08-30 | 1952-06-30 | Rca Corp | Attachment of a small metallic object in a carrier |
-
1957
- 1957-11-19 DE DEN14347A patent/DE1111299B/en active Pending
- 1957-11-20 FR FR1186598D patent/FR1186598A/en not_active Expired
- 1957-11-20 CH CH5286857A patent/CH363094A/en unknown
- 1957-11-20 GB GB3615057A patent/GB860807A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE1111299B (en) | 1961-07-20 |
| FR1186598A (en) | 1959-08-27 |
| CH363094A (en) | 1962-07-15 |
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