GB8323625D0 - Heat sink method - Google Patents
Heat sink methodInfo
- Publication number
- GB8323625D0 GB8323625D0 GB838323625A GB8323625A GB8323625D0 GB 8323625 D0 GB8323625 D0 GB 8323625D0 GB 838323625 A GB838323625 A GB 838323625A GB 8323625 A GB8323625 A GB 8323625A GB 8323625 D0 GB8323625 D0 GB 8323625D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- heat sink
- sink method
- heat
- sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US45098382A | 1982-12-20 | 1982-12-20 |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8323625D0 true GB8323625D0 (en) | 1983-10-05 |
GB2138631A GB2138631A (en) | 1984-10-24 |
GB2138631B GB2138631B (en) | 1986-12-03 |
Family
ID=23790323
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08323625A Expired GB2138631B (en) | 1982-12-20 | 1983-09-02 | Heat sinks |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS59119380A (en) |
DE (1) | DE3346017A1 (en) |
FR (1) | FR2538167B1 (en) |
GB (1) | GB2138631B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001183987A (en) * | 1999-12-27 | 2001-07-06 | Pioneer Electronic Corp | Cooling structure and display device using the same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52106863A (en) * | 1976-03-03 | 1977-09-07 | Teikoku Hormone Mfg Co Ltd | Synthesis of substituted benzamides |
EP0054069A1 (en) * | 1980-06-19 | 1982-06-23 | Digital Equipment Corporation | Heat pin integrated circuit packaging |
DE8114325U1 (en) * | 1981-05-14 | 1982-09-30 | Siemens AG, 1000 Berlin und 8000 München | Heat dissipation device |
-
1983
- 1983-09-02 GB GB08323625A patent/GB2138631B/en not_active Expired
- 1983-11-07 JP JP20891583A patent/JPS59119380A/en active Pending
- 1983-12-19 FR FR8320732A patent/FR2538167B1/en not_active Expired
- 1983-12-20 DE DE19833346017 patent/DE3346017A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
FR2538167A1 (en) | 1984-06-22 |
DE3346017A1 (en) | 1984-06-20 |
GB2138631A (en) | 1984-10-24 |
FR2538167B1 (en) | 1987-05-29 |
JPS59119380A (en) | 1984-07-10 |
GB2138631B (en) | 1986-12-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |