GB624369A - Improvements in and relating to soldering metals and alloys, more particularly thosethat are difficult to solder - Google Patents
Improvements in and relating to soldering metals and alloys, more particularly thosethat are difficult to solderInfo
- Publication number
- GB624369A GB624369A GB23542/46A GB2354246A GB624369A GB 624369 A GB624369 A GB 624369A GB 23542/46 A GB23542/46 A GB 23542/46A GB 2354246 A GB2354246 A GB 2354246A GB 624369 A GB624369 A GB 624369A
- Authority
- GB
- United Kingdom
- Prior art keywords
- layer
- alloys
- coating
- per cent
- glaze
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/002—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of light metal
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Coating By Spraying Or Casting (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
In coating metals or alloys particularly those difficult to coat such as aluminium or its alloys, chromium or its alloys, zirconium, or magnesium alloys, the metals &c. are coated first with a solderable metal layer by burning on with a glaze, and then with molten metal such as by dipping in molten zinc. The solderable layer may be effected without first removing the oxide on the article, and anodized aluminium articles may then be coated. A suspension of enamel and metal such as silver, copper, platinum, gold, or compounds thereof may be painted or sprayed on to the object and then burnt on in a manner similar to coating ceramic materials. As an alternative a layer of enamel may be first applied and then a metallizing suspension. Where the surface is still difficult to solder after burning on a glaze containing metals, a further metal layer free from glaze may be burnt on. In a further form a glaze containing a metal suspension may be first applied and dried, a coating of glaze-free metal suspension then applied, and burning on then effected to fix the coating. An aluminium plate may be sprayed with a suspension formed of 200 grams of borosilicate enamel containing 5.6 per cent of SiO2 14.8 per cent of B2O3, 71.4 per cent of PbO, 1 per cent of H2O3, 1.4 per cent of ZnO, and 2000 grams of silver or silver oxide in 1000 grams of ethylene glycol to which 50 grams of nitrocellulose is added. After drying, a layer of silver or silver oxide free of enamel is sprayed on and after drying the second layer, heating is effected for 10 minutes at 500 DEG C. The surface prior to coating may be pickled or sand blasted. Sleeves or tubes of aluminium may then be used in the manufacture of coils, transformers potentiometers and other electrical parts and for kitchen or household articles.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL624369X | 1942-11-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB624369A true GB624369A (en) | 1949-06-07 |
Family
ID=19788521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB23542/46A Expired GB624369A (en) | 1942-11-18 | 1946-08-08 | Improvements in and relating to soldering metals and alloys, more particularly thosethat are difficult to solder |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB624369A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3167858A (en) * | 1959-12-22 | 1965-02-02 | Knapp Mills Inc | Process of lead cladding |
US3244553A (en) * | 1959-12-22 | 1966-04-05 | Knapp Mills Inc | Process of lead cladding using molten lead |
EP0001220A1 (en) * | 1977-09-23 | 1979-04-04 | Siemens Aktiengesellschaft | Process for indirectly joining two parts |
EP0024355A1 (en) * | 1979-08-21 | 1981-03-04 | Siemens Aktiengesellschaft | Process for securing disc or plate like target materials to cooled backing members for cathodic sputtering devices |
WO1997030418A2 (en) * | 1996-02-12 | 1997-08-21 | David Finn | Method and device for bonding a wire conductor |
US8028923B2 (en) | 2007-11-14 | 2011-10-04 | Smartrac Ip B.V. | Electronic inlay structure and method of manufacture thereof |
US8090407B2 (en) | 2007-06-27 | 2012-01-03 | On Track Innovations Ltd. | Contactless smart SIM |
-
1946
- 1946-08-08 GB GB23542/46A patent/GB624369A/en not_active Expired
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3167858A (en) * | 1959-12-22 | 1965-02-02 | Knapp Mills Inc | Process of lead cladding |
US3244553A (en) * | 1959-12-22 | 1966-04-05 | Knapp Mills Inc | Process of lead cladding using molten lead |
EP0001220A1 (en) * | 1977-09-23 | 1979-04-04 | Siemens Aktiengesellschaft | Process for indirectly joining two parts |
EP0024355A1 (en) * | 1979-08-21 | 1981-03-04 | Siemens Aktiengesellschaft | Process for securing disc or plate like target materials to cooled backing members for cathodic sputtering devices |
WO1997030418A2 (en) * | 1996-02-12 | 1997-08-21 | David Finn | Method and device for bonding a wire conductor |
WO1997030418A3 (en) * | 1996-02-12 | 1997-10-02 | David Finn | Method and device for bonding a wire conductor |
US6233818B1 (en) | 1996-02-12 | 2001-05-22 | David Finn | Method and device for bonding a wire conductor |
US8090407B2 (en) | 2007-06-27 | 2012-01-03 | On Track Innovations Ltd. | Contactless smart SIM |
US8028923B2 (en) | 2007-11-14 | 2011-10-04 | Smartrac Ip B.V. | Electronic inlay structure and method of manufacture thereof |
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