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GB2339332B - Processes for assembly of planar electrical components - Google Patents

Processes for assembly of planar electrical components

Info

Publication number
GB2339332B
GB2339332B GB9814829A GB9814829A GB2339332B GB 2339332 B GB2339332 B GB 2339332B GB 9814829 A GB9814829 A GB 9814829A GB 9814829 A GB9814829 A GB 9814829A GB 2339332 B GB2339332 B GB 2339332B
Authority
GB
United Kingdom
Prior art keywords
processes
assembly
electrical components
planar electrical
planar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB9814829A
Other versions
GB9814829D0 (en
GB2339332A (en
Inventor
Nicholas Frederick Stogdale
Stephen George Porter
Anthony Maurice Howard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infrared Integrated Systems Ltd
Original Assignee
Infrared Integrated Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infrared Integrated Systems Ltd filed Critical Infrared Integrated Systems Ltd
Priority to GB9814829A priority Critical patent/GB2339332B/en
Publication of GB9814829D0 publication Critical patent/GB9814829D0/en
Publication of GB2339332A publication Critical patent/GB2339332A/en
Application granted granted Critical
Publication of GB2339332B publication Critical patent/GB2339332B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
    • H10N15/10—Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/83138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/8314—Guiding structures outside the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83194—Lateral distribution of the layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0182—Using a temporary spacer element or stand-off during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
GB9814829A 1998-07-08 1998-07-08 Processes for assembly of planar electrical components Expired - Lifetime GB2339332B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9814829A GB2339332B (en) 1998-07-08 1998-07-08 Processes for assembly of planar electrical components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9814829A GB2339332B (en) 1998-07-08 1998-07-08 Processes for assembly of planar electrical components

Publications (3)

Publication Number Publication Date
GB9814829D0 GB9814829D0 (en) 1998-09-09
GB2339332A GB2339332A (en) 2000-01-19
GB2339332B true GB2339332B (en) 2000-07-26

Family

ID=10835184

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9814829A Expired - Lifetime GB2339332B (en) 1998-07-08 1998-07-08 Processes for assembly of planar electrical components

Country Status (1)

Country Link
GB (1) GB2339332B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6534724B1 (en) * 1997-05-28 2003-03-18 International Business Machines Corporation Enhanced design and process for a conductive adhesive
US8043464B2 (en) * 2009-11-17 2011-10-25 Raytheon Company Systems and methods for assembling lightweight RF antenna structures
US9754914B1 (en) * 2016-05-10 2017-09-05 Rosemount Aerospace Inc. Method to provide die attach stress relief using gold stud bumps

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62204561A (en) * 1986-03-05 1987-09-09 Hitachi Ltd Hybrid integrated circuit
US4999136A (en) * 1988-08-23 1991-03-12 Westinghouse Electric Corp. Ultraviolet curable conductive resin
EP0529298A2 (en) * 1991-08-23 1993-03-03 E.I. Du Pont De Nemours And Company Method for making thick film/solder joints
GB2283362A (en) * 1993-10-29 1995-05-03 Murata Manufacturing Co Pyroelectric infrared array sensor
US5681757A (en) * 1996-04-29 1997-10-28 Microfab Technologies, Inc. Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process
EP0810649A2 (en) * 1996-05-28 1997-12-03 Motorola, Inc. Method for coupling substrates and structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62204561A (en) * 1986-03-05 1987-09-09 Hitachi Ltd Hybrid integrated circuit
US4999136A (en) * 1988-08-23 1991-03-12 Westinghouse Electric Corp. Ultraviolet curable conductive resin
EP0529298A2 (en) * 1991-08-23 1993-03-03 E.I. Du Pont De Nemours And Company Method for making thick film/solder joints
GB2283362A (en) * 1993-10-29 1995-05-03 Murata Manufacturing Co Pyroelectric infrared array sensor
US5681757A (en) * 1996-04-29 1997-10-28 Microfab Technologies, Inc. Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process
EP0810649A2 (en) * 1996-05-28 1997-12-03 Motorola, Inc. Method for coupling substrates and structure

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Patent abstracts of Japan, section E, section no. 585, Vol 12, No 63, Pg 25, 25/2/88 & JP 62 204 561 A *

Also Published As

Publication number Publication date
GB9814829D0 (en) 1998-09-09
GB2339332A (en) 2000-01-19

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Expiry date: 20180707