GB2315597B - A process for etching an ingap layer - Google Patents
A process for etching an ingap layerInfo
- Publication number
- GB2315597B GB2315597B GB9715325A GB9715325A GB2315597B GB 2315597 B GB2315597 B GB 2315597B GB 9715325 A GB9715325 A GB 9715325A GB 9715325 A GB9715325 A GB 9715325A GB 2315597 B GB2315597 B GB 2315597B
- Authority
- GB
- United Kingdom
- Prior art keywords
- etching
- ingap layer
- ingap
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005530 etching Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
- H01L21/30612—Etching of AIIIBV compounds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Weting (AREA)
- Junction Field-Effect Transistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8193338A JPH1041285A (en) | 1996-07-23 | 1996-07-23 | Etching method of indium-gallium-phosphorus layer |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9715325D0 GB9715325D0 (en) | 1997-09-24 |
GB2315597A GB2315597A (en) | 1998-02-04 |
GB2315597B true GB2315597B (en) | 1999-02-24 |
Family
ID=16306240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9715325A Expired - Fee Related GB2315597B (en) | 1996-07-23 | 1997-07-21 | A process for etching an ingap layer |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPH1041285A (en) |
KR (1) | KR100236662B1 (en) |
FR (1) | FR2751788B1 (en) |
GB (1) | GB2315597B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5228298B2 (en) * | 2006-08-04 | 2013-07-03 | カシオ計算機株式会社 | Semiconductor thin film processing method and semiconductor device manufacturing method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0106477A2 (en) * | 1982-09-10 | 1984-04-25 | Western Electric Company, Incorporated | Process for manufacturing semiconductor devices comprising an electrochemical-etching step |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5270245A (en) * | 1992-11-27 | 1993-12-14 | Motorola, Inc. | Method of forming a light emitting diode |
-
1996
- 1996-07-23 JP JP8193338A patent/JPH1041285A/en not_active Withdrawn
-
1997
- 1997-07-21 GB GB9715325A patent/GB2315597B/en not_active Expired - Fee Related
- 1997-07-21 FR FR9709226A patent/FR2751788B1/en not_active Expired - Fee Related
- 1997-07-22 KR KR1019970034251A patent/KR100236662B1/en not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0106477A2 (en) * | 1982-09-10 | 1984-04-25 | Western Electric Company, Incorporated | Process for manufacturing semiconductor devices comprising an electrochemical-etching step |
Also Published As
Publication number | Publication date |
---|---|
FR2751788B1 (en) | 2000-07-07 |
GB9715325D0 (en) | 1997-09-24 |
KR100236662B1 (en) | 2000-01-15 |
JPH1041285A (en) | 1998-02-13 |
KR980011975A (en) | 1998-04-30 |
FR2751788A1 (en) | 1998-01-30 |
GB2315597A (en) | 1998-02-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20030721 |