GB2300072B - Microcooling device and method for the production thereof - Google Patents
Microcooling device and method for the production thereofInfo
- Publication number
- GB2300072B GB2300072B GB9608171A GB9608171A GB2300072B GB 2300072 B GB2300072 B GB 2300072B GB 9608171 A GB9608171 A GB 9608171A GB 9608171 A GB9608171 A GB 9608171A GB 2300072 B GB2300072 B GB 2300072B
- Authority
- GB
- United Kingdom
- Prior art keywords
- production
- microcooling device
- microcooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
- H01C1/082—Cooling, heating or ventilating arrangements using forced fluid flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Fluid Mechanics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Micromachines (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19514548A DE19514548C1 (en) | 1995-04-20 | 1995-04-20 | Method of manufacturing a micro cooler |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9608171D0 GB9608171D0 (en) | 1996-06-26 |
GB2300072A GB2300072A (en) | 1996-10-23 |
GB2300072B true GB2300072B (en) | 1997-04-02 |
Family
ID=7759958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9608171A Expired - Fee Related GB2300072B (en) | 1995-04-20 | 1996-04-19 | Microcooling device and method for the production thereof |
Country Status (6)
Country | Link |
---|---|
US (1) | US6101715A (en) |
JP (1) | JP3010343B2 (en) |
KR (1) | KR960040104A (en) |
DE (1) | DE19514548C1 (en) |
FR (1) | FR2733386B1 (en) |
GB (1) | GB2300072B (en) |
Families Citing this family (100)
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JP4048579B2 (en) * | 1997-08-28 | 2008-02-20 | 住友電気工業株式会社 | Heat dissipating body including refrigerant flow path and manufacturing method thereof |
US5842787A (en) * | 1997-10-09 | 1998-12-01 | Caliper Technologies Corporation | Microfluidic systems incorporating varied channel dimensions |
US6227287B1 (en) * | 1998-05-25 | 2001-05-08 | Denso Corporation | Cooling apparatus by boiling and cooling refrigerant |
US6935409B1 (en) | 1998-06-08 | 2005-08-30 | Thermotek, Inc. | Cooling apparatus having low profile extrusion |
US7147045B2 (en) * | 1998-06-08 | 2006-12-12 | Thermotek, Inc. | Toroidal low-profile extrusion cooling system and method thereof |
US6202303B1 (en) * | 1999-04-08 | 2001-03-20 | Intel Corporation | Method for producing high efficiency heat sinks |
KR100294317B1 (en) * | 1999-06-04 | 2001-06-15 | 이정현 | Micro-cooling system |
US7305843B2 (en) * | 1999-06-08 | 2007-12-11 | Thermotek, Inc. | Heat pipe connection system and method |
US6981322B2 (en) | 1999-06-08 | 2006-01-03 | Thermotek, Inc. | Cooling apparatus having low profile extrusion and method of manufacture therefor |
US6253835B1 (en) * | 2000-02-11 | 2001-07-03 | International Business Machines Corporation | Isothermal heat sink with converging, diverging channels |
DE10017971A1 (en) * | 2000-04-11 | 2001-10-25 | Bosch Gmbh Robert | Cooling device for cooling components of power electronics with a micro heat exchanger |
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US6390181B1 (en) * | 2000-10-04 | 2002-05-21 | David R. Hall | Densely finned tungsten carbide and polycrystalline diamond cooling module |
FR2827079B1 (en) * | 2001-07-04 | 2004-05-28 | Alstom | PROCESS FOR PRODUCING A DIAMOND SUBSTRATE AND DIAMOND SUBSTRATE OBTAINED BY SUCH A PROCESS |
US7857037B2 (en) | 2001-11-27 | 2010-12-28 | Thermotek, Inc. | Geometrically reoriented low-profile phase plane heat pipes |
US9113577B2 (en) | 2001-11-27 | 2015-08-18 | Thermotek, Inc. | Method and system for automotive battery cooling |
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US7836597B2 (en) | 2002-11-01 | 2010-11-23 | Cooligy Inc. | Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system |
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US20070053966A1 (en) * | 2003-10-17 | 2007-03-08 | Robert Ang | Medicated orthopedic support structures for treatment of damaged musculoskeletal tissue |
US7422910B2 (en) * | 2003-10-27 | 2008-09-09 | Velocys | Manifold designs, and flow control in multichannel microchannel devices |
DK200301577A (en) * | 2003-10-27 | 2005-04-28 | Danfoss Silicon Power Gmbh | Flow distribution unit and cooling unit |
WO2005104323A2 (en) * | 2004-03-30 | 2005-11-03 | Purdue Research Foundation | Improved microchannel heat sink |
DE102004023037B4 (en) * | 2004-05-06 | 2008-08-21 | Liu I-Ming | Heat sink with integrated heat pipe |
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US7190580B2 (en) * | 2004-07-01 | 2007-03-13 | International Business Machines Corporation | Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages |
US7139172B2 (en) * | 2004-07-01 | 2006-11-21 | International Business Machines Corporation | Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages |
US7641865B2 (en) * | 2005-04-08 | 2010-01-05 | Velocys | Flow control through plural, parallel connecting channels to/from a manifold |
DE102005029074B3 (en) * | 2005-06-23 | 2006-08-10 | Wieland-Werke Ag | Heat exchanger for cooling e.g. microprocessor, has heat exchanging unit (3) with inner structure that runs in flow direction for increasing heat transfer and extends in inner space from lower side to upper side |
KR100772381B1 (en) * | 2005-09-29 | 2007-11-01 | 삼성전자주식회사 | Heat sink |
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US20070227698A1 (en) * | 2006-03-30 | 2007-10-04 | Conway Bruce R | Integrated fluid pump and radiator reservoir |
DE112007000768T5 (en) | 2006-03-30 | 2009-02-12 | Cooligy, Inc., Mountain View | Integrated module for the liquid-air line |
US7715194B2 (en) | 2006-04-11 | 2010-05-11 | Cooligy Inc. | Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers |
JP4586772B2 (en) * | 2006-06-21 | 2010-11-24 | 日本電気株式会社 | COOLING STRUCTURE AND COOLING STRUCTURE MANUFACTURING METHOD |
DE102006028675B4 (en) | 2006-06-22 | 2008-08-21 | Siemens Ag | Cooling arrangement for arranged on a support plate electrical components |
EP1882893A3 (en) * | 2006-07-26 | 2013-05-01 | Furukawa-Sky Aluminum Corporation | Heat exchanger |
US8042606B2 (en) * | 2006-08-09 | 2011-10-25 | Utah State University Research Foundation | Minimal-temperature-differential, omni-directional-reflux, heat exchanger |
DE102006045564A1 (en) | 2006-09-25 | 2008-04-03 | Behr Gmbh & Co. Kg | Device for cooling electrical elements |
US8030754B2 (en) * | 2007-01-31 | 2011-10-04 | Hewlett-Packard Development Company, L.P. | Chip cooling channels formed in wafer bonding gap |
TW200850136A (en) * | 2007-06-15 | 2008-12-16 | Nat Univ Tsing Hua | Microchannel heat sink |
US7791188B2 (en) * | 2007-06-18 | 2010-09-07 | Chien-Min Sung | Heat spreader having single layer of diamond particles and associated methods |
US20090000139A1 (en) * | 2007-06-29 | 2009-01-01 | Hodges Timothy M | Clothes dryer air intake system |
CA2697348A1 (en) * | 2007-07-09 | 2009-01-15 | A-Heat Allied Heat Exchange Technology Ag | Heat exchange system with a heat exchanger and a method for the manufacture of a heat exchange system |
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US7764494B2 (en) * | 2007-11-20 | 2010-07-27 | Basic Electronics, Inc. | Liquid cooled module |
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US8479806B2 (en) * | 2007-11-30 | 2013-07-09 | University Of Hawaii | Two-phase cross-connected micro-channel heat sink |
US9671179B2 (en) * | 2008-01-15 | 2017-06-06 | Showa Denko K.K. | Liquid-cooled-type cooling device |
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CN103503589A (en) * | 2011-05-12 | 2014-01-08 | 丰田自动车株式会社 | Cooler and manufacturing method for cooler |
CN104247008A (en) * | 2012-03-30 | 2014-12-24 | 京瓷株式会社 | Flow path member, and heat exchanger and semiconductor device using same |
US9052724B2 (en) | 2012-08-07 | 2015-06-09 | International Business Machines Corporation | Electro-rheological micro-channel anisotropic cooled integrated circuits and methods thereof |
EP2871672B1 (en) * | 2013-11-06 | 2018-09-26 | Nxp B.V. | Semiconductor device |
EP3075447B1 (en) * | 2013-11-28 | 2021-03-24 | Kyocera Corporation | Duct member |
KR101695708B1 (en) | 2014-01-09 | 2017-01-13 | 한국전자통신연구원 | Semiconductor device and method of fabricating the same |
US9263366B2 (en) * | 2014-05-30 | 2016-02-16 | International Business Machines Corporation | Liquid cooling of semiconductor chips utilizing small scale structures |
JP6394267B2 (en) * | 2014-10-15 | 2018-09-26 | 富士通株式会社 | Cooling device and electronic equipment |
US10502498B2 (en) * | 2015-07-20 | 2019-12-10 | Delta Electronics, Inc. | Slim vapor chamber |
US9798088B2 (en) * | 2015-11-05 | 2017-10-24 | Globalfoundries Inc. | Barrier structures for underfill blockout regions |
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CN106601703B (en) * | 2016-10-27 | 2019-08-02 | 湖北工程学院 | Using the micro-channel heat sink of secondary back refrigerating mode |
JP6378299B2 (en) * | 2016-12-14 | 2018-08-22 | ファナック株式会社 | heatsink |
GB201621690D0 (en) | 2016-12-20 | 2017-02-01 | Element Six Tech Ltd | A heat sink comprising synthetic diamond material |
GB201701173D0 (en) * | 2017-01-24 | 2017-03-08 | Element Six Tech Ltd | Synthetic diamond plates |
CN108682662B (en) * | 2018-05-21 | 2020-05-19 | 北京科技大学 | Preparation method of diamond micro-channel heat sink for heat dissipation with ultrahigh heat flow density |
US20220099389A1 (en) * | 2020-09-25 | 2022-03-31 | Abb Power Electronics Inc. | Systems and methods for thermal management using matrix coldplates |
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CN113479841B (en) * | 2021-05-24 | 2024-05-28 | 中国电子科技集团公司第五十五研究所 | Silicon-based micro-channel substrate preparation method |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5016090A (en) * | 1990-03-21 | 1991-05-14 | International Business Machines Corporation | Cross-hatch flow distribution and applications thereof |
US5034688A (en) * | 1988-05-05 | 1991-07-23 | Ets Gourdon | Temperature conditioning support for small objects such as semi-conductor components and thermal regulation process using said support |
US5079619A (en) * | 1990-07-13 | 1992-01-07 | Sun Microsystems, Inc. | Apparatus for cooling compact arrays of electronic circuitry |
GB2275571A (en) * | 1993-02-26 | 1994-08-31 | Gec Alsthom Ltd | Cooling semiconductor devices with flowing fluid |
EP0715352A1 (en) * | 1994-11-30 | 1996-06-05 | Sumitomo Electric Industries, Ltd. | Substrate, semiconductor device, element-mounted device and preparation of substrate |
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-
1995
- 1995-04-20 DE DE19514548A patent/DE19514548C1/en not_active Expired - Fee Related
-
1996
- 1996-04-16 KR KR1019960011347A patent/KR960040104A/en active Search and Examination
- 1996-04-17 FR FR9604785A patent/FR2733386B1/en not_active Expired - Fee Related
- 1996-04-19 GB GB9608171A patent/GB2300072B/en not_active Expired - Fee Related
- 1996-04-19 JP JP8132492A patent/JP3010343B2/en not_active Expired - Fee Related
-
1998
- 1998-01-30 US US09/016,312 patent/US6101715A/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5034688A (en) * | 1988-05-05 | 1991-07-23 | Ets Gourdon | Temperature conditioning support for small objects such as semi-conductor components and thermal regulation process using said support |
US5016090A (en) * | 1990-03-21 | 1991-05-14 | International Business Machines Corporation | Cross-hatch flow distribution and applications thereof |
US5079619A (en) * | 1990-07-13 | 1992-01-07 | Sun Microsystems, Inc. | Apparatus for cooling compact arrays of electronic circuitry |
GB2275571A (en) * | 1993-02-26 | 1994-08-31 | Gec Alsthom Ltd | Cooling semiconductor devices with flowing fluid |
EP0715352A1 (en) * | 1994-11-30 | 1996-06-05 | Sumitomo Electric Industries, Ltd. | Substrate, semiconductor device, element-mounted device and preparation of substrate |
Also Published As
Publication number | Publication date |
---|---|
DE19514548C1 (en) | 1996-10-02 |
FR2733386B1 (en) | 1998-06-26 |
GB9608171D0 (en) | 1996-06-26 |
JP3010343B2 (en) | 2000-02-21 |
GB2300072A (en) | 1996-10-23 |
US6101715A (en) | 2000-08-15 |
KR960040104A (en) | 1996-11-25 |
FR2733386A1 (en) | 1996-10-25 |
JPH08293573A (en) | 1996-11-05 |
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