GB2398181A - Nonplanar lead-frame; mounting magnetic components and a circuit board; lead-frame and heat sink - Google Patents
Nonplanar lead-frame; mounting magnetic components and a circuit board; lead-frame and heat sink Download PDFInfo
- Publication number
- GB2398181A GB2398181A GB0302483A GB0302483A GB2398181A GB 2398181 A GB2398181 A GB 2398181A GB 0302483 A GB0302483 A GB 0302483A GB 0302483 A GB0302483 A GB 0302483A GB 2398181 A GB2398181 A GB 2398181A
- Authority
- GB
- United Kingdom
- Prior art keywords
- lead frame
- component
- lead
- frame
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
- H01F27/22—Cooling by heat conduction through solid or powdered fillings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/04—Leading of conductors or axles through casings, e.g. for tap-changing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
A non-planar lead-frame 12 may include two parallel sections 14,18 and an intermediate perpendicular section 16. Magnetic components 24 may be connected by being mounted in the lead-frame on the shorter 14 of the two parallel sections and a circuit board 26 may be connected to and supported by the longer 18 of the parallel sections. A compressible foam material 32 between the magnetic component and circuit board provides mechanical robustness. The magnetic components 24 and circuit board 26 may be assembled onto a flat lead-frame, figure 1, which is folded about fold lines 36 into a U-shape, figure 2. The assembly may be housed in a compartment formed from walls 6, 8, a lid 4 and a heat sink 10, and may comprise a DC to DC converter. The lead-frame long parallel section 18 may form a heat path from the circuit board 26 to the heat sink 10. Compressible foam 34 may be located between the magnetic component 24 and the lid 4.
Description
IMPROVEMENTS IN OR RELATING TO AN ELECTRICAL DEVICE
The present invention relates to an electrical device, in particular an electrical device comprising a lead frame.
Lead frames are, in general, metal frames to which a packaged or unpackaged electronic component, for example a semi-conductor chip, is electrically connected and which provide electrical connections from the packaged electronic component to other components and devices. However, known lead frames suffer from a number of disadvantages.
Specific electronic components or groups of electronic components often require specifically shaped lead frames.
This leads to the use of a wide range of different shapes and sizes of lead frames, resulting in complicated manufacturing processes and thus higher manufacturing costs.
The present invention seeks to provide an improved electrical device comprising a lead frame.
According to the present invention there is provided an electrical device comprising a non-planar lead frame.
Preferably, the cross-section of the lead frame has a first portion, an intermediate portion and a second portion, wherein the first portion and second portion are substantially parallel and the intermediate portion is substantially perpendicular to the first and second portions.
Advantageously, the second portion projects further away from the intermediate section than the first portion.
Conveniently, the first portion supports a component.
Advantageously, the component is a magnetic component.
Preferably, the device is a transformer.
Conveniently, the second portion has projections for engaging with a printed circuit board.
Advantageously, the second portion supports a printed circuit board. . Preferably, the lead frame provides a thermally conductive pathway from a component to a heat sink. . Conveniently, a compressible member is located between the first portion or a component located thereon, and the second portion or a component located thereon.
Advantageously, a compressible member is located on the surface of the first portion, or a component located thereon, which faces away from the second portion.
Preferably, the compressible member comprises a foam.
Conveniently, the lead frame is under compression.
Advantageously, the lead frame is under compression by enclosure within a compartment.
Preferably the lead frame comprises copper.
Conveniently, the lead frame has connectors for connection to external circuitry.
Advantageously, the device further comprises a heat sink.
Preferably, a layer of thermally-conductive and electrically-insulating material is located between the lead frame and the heat sink.
Conveniently, the layer of material comprises T-gon 110 or T-gon 210 material.
According to another aspect of the present invention, there is provided a method of making an electrical device comprising the steps of: forming a substantially planar lead frame, folding the lead frame into a non-planar configuration, and attaching at least one component onto the lead frame.
Preferably, the method further comprises the step of plating the lead frame.
Conveniently, the lead frame is plated with tin.
Advantageously, the at least one component is attached to the lead frame using solder.
Preferably, solder resist is applied to the lead frame prior to the connection of the at least one component.
The present invention will now be described, by way of example, with reference to the accompanying drawings in which Figure 1 is a crosssectional view through an electrical device according to the present invention, and Figure 2 is a schematic illustration of a lead frame according to the present invention.
Turning to figure 1, an electrical device 2 is shown.
The device 2 comprises a compartment having a box-like configuration with a lid 4, side walls 6 and 8, and a base which comprises a heat sink 10. Within the device 2 there is located a lead frame 12 of substantially Ushaped configuration in cross-section. The lead frame 12 has a substantially horizontal first portion 14, a substantially vertical intermediate portion 16 and a substantially horizontal second portion 18. The elongate first and second portions of the lead frame thus form the limbs of the "U" shape. The second portion 18 is located on the base of the device 2. Between the second portion 18 and the base of the compartment there is a layer 20 of a thermally conductive but electrically insulating material. Suitable materials include those sold under the trade marks T-gon 110 and T-gon 210 by Thermagon, Inc., Cleveland, USA. Thus the layer 20 provides a thermally-conductive path from the lower portion 18 of the lead frame 12 to the base of the device 2 and so to the heat sink 10. The lead frame 12 itself is constructed from copper.
In alternative embodiments, the lead frame 12 may be constructed from other metals.
A portion 22 of the second portion 18 of the lead frame 12 protrudes through the side wall 8 of the device 2. The externally protruding portion 22 provides electrical connectors for connection with external components and circuitry.
The first portion 14 of the lead frame 12 supports components 24. The device 2 shown is a DC to DC convertor which transforms one voltage to another and the components 24 comprise magnetic components which sandwich the first portion 14. On the second portion 18 of the lead frame 12 there is located a printed circuit board (PCB) 26. The PCB 26 comprises circuitry and a number of components. Power dissipating components such as component 28 are attached directly to the lead frame. The PCB 26 is attached to the second portion 18 by a layer of pressure sensitive adhesive.
Also, a plurality of projections 30 are formed from the lead frame 12 which project upward from the second portion 18. The projections 30 extend through apertures in the PCB 26 in order to accurately locate the PCB 26 on the lower portion 18.
The projections 30 are formed so as to have a piercing tip. The PCB 26 is coated with a layer of contact adhesive which extends over the apertures therein. In the manufacture of the device, the piercing tips of the projections 30 pierce the layer of adhesive for easy fixing of the PCB 26 onto the second portion 18.
Between the first portion 14 and the second portion 18 of the lead frame 12 (and/or components located thereon) there is provided a compressible member 32 comprising foam material.
There is also a compressible member 34 comprising foam material located between the first portion 14 and/or components located thereon, and the lid 4 of the device 2.
The lead frame 12 and the device 2 are arranged such that the members 32 and 34 are under compression when the device 2 is assembled as shown in figure 1. This arrangement has a number of advantages. For example, the compressibility of the members 32 and 34 allows for a range of tolerance in the dimensions and arrangement of the lead frame 12, the components attached thereto, and the device 2. Also, the members 32 and 34 act as mechanical shock absorbers to prevent damage to the components of the device 2 whilst in use or in transit.
The folding of the lead frame in this way allows for a compact construction of the device 2, allowing more flexibility of manufacture and facilitates the use of standard size components such as heat sinks.
Figure 2 is a two-dimensional view of the folded, U- shaped lead frame 12. The lead frame 12 has the U-shaped configuration as shown in figure 1 indicated by the fold lines 36 between the first portion 14 and the intermediate portion 16, and the intermediate portion 16 and the second portion 18.
The PCB 26 can clearly be seen located on the second portion 18 comprising a number of electronic components such as component 28. It can also be seen that the lead frame 12 provides three external connectors 22 which would project externally of the side wall 8 of the device 2 for connection to external circuitry.
There can also be seen three circuits 40, 42 and 44 located on the first portion 14, each with its own set of magnetic components 24. The lead frame 12 provides mechanical support and electrical connections for the various parts of the device 2. As shown, there are several "break outs" 38 located around the lead frame 12 comprising weak bridging sections between parts of the lead frame 12 which are intended to be mechanically and electrically isolated. These "break outs" are a result of the manufacturing process and would be removed by chemical or physical means before the device is ready to be used. In practice, the lead frame is manufactured with a substantially planar configuration, and is then folded into a substantially U-shaped configuration. Components and PCBs are then attached to the lead frame.
It is to be appreciated that the folding of the lead frame 12 to the Ushaped configuration allows for a very compact and robust device 2, which can withstand relatively harsh conditions. For example, a device comprising a lead frame of the invention may be particularly suitable for use in vehicles, particularly cars, lorries and the like.
Claims (29)
1. An electrical device comprising a non-planar lead frame.
2. A device according to claim 1 or 2 wherein the cross-section of the lead frame has a first portion, an intermediate portion and a second portion, wherein the first portion and second portion are substantially parallel and the intermediate portion is substantially perpendicular to the first and second portions.
3. A device according to claim 1 or 2 wherein the second portion projects further away from the intermediate portion than the first portion.
4. A device according to claim 1, 2 or 3 wherein the first portion supports a component.
5. A device according to claim 4 wherein the component is a magnetic component.
6. A device according to any preceding claim which is a transformer.
7. A device according to any preceding claim wherein the second portion has projections for engaging with a printed circuit board.
8. A device according to any preceding claim wherein the second portion supports a printed circuit board.
9. A device according to any preceding claim wherein the lead frame provides a thermally-conductive pathway from a component to a heat-sink.
10. A device according to any preceding claim wherein a compressible member is located between the first portion or a component located thereon, and the second portion or a component located thereon.
11. A device according to any preceding claim wherein a compressible member is located on the surface of the first portion, or a component located thereon, which faces away from the second portion.
12. A device according to claim 10 or 11 wherein the compressible member comprises a foam.
13. A device according to any preceding claim wherein the lead frame is under compression.
14. A device according to any preceding claim wherein the lead frame is under compression by enclosure within a compartment.
15. A device according to any preceding claim wherein the lead frame comprises copper.
16. A device according to any preceding claim wherein the lead frame has connectors for connection to external circuitry. t
17. A device according to any preceding claim further comprising a heat sink.
18. A device according to claim 17 wherein a layer of thermallyconductive and electrically-insulating material is located between the lead frame and the heat sink.
19. A device according to claim 18 wherein the layer of material comprises T-gon 110 or T-gon 210 material.
20. A method of making an electrical device comprising the steps of: forming a substantially planar lead frame, folding the lead frame into a non-planar configuration, and attaching at least one component onto the lead frame.
21. A method according to claim 20 further comprising the step of plating the lead frame.
22. A method according to claim 21 wherein the lead frame is plated with tin.
23. A method according to claim 20, 21 or 22 wherein the at least one component is attached to the lead frame using solder.
24. A method according to claim 23 wherein solder resist is applied to the lead frame prior to the connection of the at least one component.
25. A device substantially as hereinbefore described with reference to and as shown in the accompanying drawings.
26. A lead frame substantially as hereinbefore described with reference to and as shown in the accompanying drawings.
527. A method of making a device substantially as hereinbefore described with reference to and as shown in the accompanying drawings.
28. A method of making a lead frame substantially as hereinbefore described with reference to and as shown in the accompanying drawings.
29. Any novel feature or combination of features disclosed herein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0302483A GB2398181A (en) | 2003-02-04 | 2003-02-04 | Nonplanar lead-frame; mounting magnetic components and a circuit board; lead-frame and heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0302483A GB2398181A (en) | 2003-02-04 | 2003-02-04 | Nonplanar lead-frame; mounting magnetic components and a circuit board; lead-frame and heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB0302483D0 GB0302483D0 (en) | 2003-03-05 |
| GB2398181A true GB2398181A (en) | 2004-08-11 |
Family
ID=9952362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0302483A Withdrawn GB2398181A (en) | 2003-02-04 | 2003-02-04 | Nonplanar lead-frame; mounting magnetic components and a circuit board; lead-frame and heat sink |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2398181A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3127339A1 (en) * | 2021-09-20 | 2023-03-24 | Valeo Systemes De Controle Moteur | Electronic module with improved connection element |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0033142A1 (en) * | 1980-01-24 | 1981-08-05 | Siemens Aktiengesellschaft | Process for the electrical connection and insulation of an electrical element |
| JPS60161643A (en) * | 1984-02-01 | 1985-08-23 | Hitachi Micro Comput Eng Ltd | Semiconductor device |
| JPS60258944A (en) * | 1985-02-15 | 1985-12-20 | Hitachi Ltd | Ic device |
| JPS615559A (en) * | 1984-06-20 | 1986-01-11 | Hitachi Tokyo Electronics Co Ltd | Lead frame |
| US5425166A (en) * | 1993-06-01 | 1995-06-20 | Eaton Corporation | Current transformer using a laminated toroidal core structure and a lead frame |
| US5697689A (en) * | 1993-08-09 | 1997-12-16 | General Automotive Specialty Co., Inc. | Rotary switch indicator including horseshoe light guide |
| JPH11284119A (en) * | 1998-03-27 | 1999-10-15 | Mitsumi Electric Co Ltd | Heat dissipation structure of semiconductor integrated device |
| GB2340314A (en) * | 1998-08-06 | 2000-02-16 | Delta Electronics Inc | Semiconductor device directly connected to the conductor of an inductive arrangement |
| GB2354693A (en) * | 1999-08-27 | 2001-04-04 | Grahame Kenneth Pearce | Vermin trap |
| US20010052639A1 (en) * | 2000-06-13 | 2001-12-20 | Fairchild Korea Semiconductor Ltd. | Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof |
-
2003
- 2003-02-04 GB GB0302483A patent/GB2398181A/en not_active Withdrawn
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0033142A1 (en) * | 1980-01-24 | 1981-08-05 | Siemens Aktiengesellschaft | Process for the electrical connection and insulation of an electrical element |
| JPS60161643A (en) * | 1984-02-01 | 1985-08-23 | Hitachi Micro Comput Eng Ltd | Semiconductor device |
| JPS615559A (en) * | 1984-06-20 | 1986-01-11 | Hitachi Tokyo Electronics Co Ltd | Lead frame |
| JPS60258944A (en) * | 1985-02-15 | 1985-12-20 | Hitachi Ltd | Ic device |
| US5425166A (en) * | 1993-06-01 | 1995-06-20 | Eaton Corporation | Current transformer using a laminated toroidal core structure and a lead frame |
| US5697689A (en) * | 1993-08-09 | 1997-12-16 | General Automotive Specialty Co., Inc. | Rotary switch indicator including horseshoe light guide |
| JPH11284119A (en) * | 1998-03-27 | 1999-10-15 | Mitsumi Electric Co Ltd | Heat dissipation structure of semiconductor integrated device |
| GB2340314A (en) * | 1998-08-06 | 2000-02-16 | Delta Electronics Inc | Semiconductor device directly connected to the conductor of an inductive arrangement |
| GB2354693A (en) * | 1999-08-27 | 2001-04-04 | Grahame Kenneth Pearce | Vermin trap |
| US20010052639A1 (en) * | 2000-06-13 | 2001-12-20 | Fairchild Korea Semiconductor Ltd. | Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3127339A1 (en) * | 2021-09-20 | 2023-03-24 | Valeo Systemes De Controle Moteur | Electronic module with improved connection element |
Also Published As
| Publication number | Publication date |
|---|---|
| GB0302483D0 (en) | 2003-03-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |