GB2346383B - Lead-free solder and soldered article - Google Patents
Lead-free solder and soldered articleInfo
- Publication number
- GB2346383B GB2346383B GB0006315A GB0006315A GB2346383B GB 2346383 B GB2346383 B GB 2346383B GB 0006315 A GB0006315 A GB 0006315A GB 0006315 A GB0006315 A GB 0006315A GB 2346383 B GB2346383 B GB 2346383B
- Authority
- GB
- United Kingdom
- Prior art keywords
- lead
- free solder
- soldered article
- soldered
- article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP02004499A JP3575311B2 (en) | 1998-01-28 | 1999-01-28 | Pb-free solder and soldering article |
GB9908173A GB2346380B (en) | 1999-01-28 | 1999-04-09 | Lead-free solder and soldered article |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0006315D0 GB0006315D0 (en) | 2000-05-03 |
GB2346383A GB2346383A (en) | 2000-08-09 |
GB2346383B true GB2346383B (en) | 2001-01-17 |
Family
ID=26315402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0006315A Expired - Lifetime GB2346383B (en) | 1999-01-28 | 1999-04-09 | Lead-free solder and soldered article |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2346383B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2888253B1 (en) * | 2005-07-07 | 2007-11-23 | Ind Des Poudres Spheriques Sa | UNLEADED, TIN-BASED, LEAD-FREE ASSEMBLY ALLOY, AND OXIDATION TO AIR IS DELAYED AND USE OF SUCH ALLOY. |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1548755A (en) * | 1975-04-05 | 1979-07-18 | Semikron Gleichrichterbau | Semicondutor device |
JPS6188996A (en) * | 1984-10-05 | 1986-05-07 | Furukawa Electric Co Ltd:The | Sn-sb alloy solder |
DE19816671A1 (en) * | 1997-04-16 | 1998-10-22 | Fuji Electric Co Ltd | Lead-free tin-antimony-silver solder alloy |
-
1999
- 1999-04-09 GB GB0006315A patent/GB2346383B/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1548755A (en) * | 1975-04-05 | 1979-07-18 | Semikron Gleichrichterbau | Semicondutor device |
JPS6188996A (en) * | 1984-10-05 | 1986-05-07 | Furukawa Electric Co Ltd:The | Sn-sb alloy solder |
DE19816671A1 (en) * | 1997-04-16 | 1998-10-22 | Fuji Electric Co Ltd | Lead-free tin-antimony-silver solder alloy |
Also Published As
Publication number | Publication date |
---|---|
GB2346383A (en) | 2000-08-09 |
GB0006315D0 (en) | 2000-05-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PE20 | Patent expired after termination of 20 years |
Expiry date: 20190408 |