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GB2346383B - Lead-free solder and soldered article - Google Patents

Lead-free solder and soldered article

Info

Publication number
GB2346383B
GB2346383B GB0006315A GB0006315A GB2346383B GB 2346383 B GB2346383 B GB 2346383B GB 0006315 A GB0006315 A GB 0006315A GB 0006315 A GB0006315 A GB 0006315A GB 2346383 B GB2346383 B GB 2346383B
Authority
GB
United Kingdom
Prior art keywords
lead
free solder
soldered article
soldered
article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB0006315A
Other versions
GB2346383A (en
GB0006315D0 (en
Inventor
Hidekiyo Takaoka
Kiyotaka Maegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP02004499A external-priority patent/JP3575311B2/en
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority claimed from GB9908173A external-priority patent/GB2346380B/en
Publication of GB0006315D0 publication Critical patent/GB0006315D0/en
Publication of GB2346383A publication Critical patent/GB2346383A/en
Application granted granted Critical
Publication of GB2346383B publication Critical patent/GB2346383B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • C22C13/02Alloys based on tin with antimony or bismuth as the next major constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB0006315A 1999-01-28 1999-04-09 Lead-free solder and soldered article Expired - Lifetime GB2346383B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP02004499A JP3575311B2 (en) 1998-01-28 1999-01-28 Pb-free solder and soldering article
GB9908173A GB2346380B (en) 1999-01-28 1999-04-09 Lead-free solder and soldered article

Publications (3)

Publication Number Publication Date
GB0006315D0 GB0006315D0 (en) 2000-05-03
GB2346383A GB2346383A (en) 2000-08-09
GB2346383B true GB2346383B (en) 2001-01-17

Family

ID=26315402

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0006315A Expired - Lifetime GB2346383B (en) 1999-01-28 1999-04-09 Lead-free solder and soldered article

Country Status (1)

Country Link
GB (1) GB2346383B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2888253B1 (en) * 2005-07-07 2007-11-23 Ind Des Poudres Spheriques Sa UNLEADED, TIN-BASED, LEAD-FREE ASSEMBLY ALLOY, AND OXIDATION TO AIR IS DELAYED AND USE OF SUCH ALLOY.

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1548755A (en) * 1975-04-05 1979-07-18 Semikron Gleichrichterbau Semicondutor device
JPS6188996A (en) * 1984-10-05 1986-05-07 Furukawa Electric Co Ltd:The Sn-sb alloy solder
DE19816671A1 (en) * 1997-04-16 1998-10-22 Fuji Electric Co Ltd Lead-free tin-antimony-silver solder alloy

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1548755A (en) * 1975-04-05 1979-07-18 Semikron Gleichrichterbau Semicondutor device
JPS6188996A (en) * 1984-10-05 1986-05-07 Furukawa Electric Co Ltd:The Sn-sb alloy solder
DE19816671A1 (en) * 1997-04-16 1998-10-22 Fuji Electric Co Ltd Lead-free tin-antimony-silver solder alloy

Also Published As

Publication number Publication date
GB2346383A (en) 2000-08-09
GB0006315D0 (en) 2000-05-03

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Expiry date: 20190408