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GB2343684B - Sputtering target material - Google Patents

Sputtering target material

Info

Publication number
GB2343684B
GB2343684B GB0001523A GB0001523A GB2343684B GB 2343684 B GB2343684 B GB 2343684B GB 0001523 A GB0001523 A GB 0001523A GB 0001523 A GB0001523 A GB 0001523A GB 2343684 B GB2343684 B GB 2343684B
Authority
GB
United Kingdom
Prior art keywords
target material
sputtering target
sputtering
target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0001523A
Other versions
GB2343684A (en
GB0001523D0 (en
Inventor
Noriaki Hara
Somei Yarita
Ken Hagiwara
Ritsuya Matsuzaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Publication of GB0001523D0 publication Critical patent/GB0001523D0/en
Publication of GB2343684A publication Critical patent/GB2343684A/en
Application granted granted Critical
Publication of GB2343684B publication Critical patent/GB2343684B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B11/00—Obtaining noble metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/04—Alloys based on a platinum group metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/20—Electrolytic production, recovery or refining of metals by electrolysis of solutions of noble metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
GB0001523A 1998-06-17 1999-06-16 Sputtering target material Expired - Fee Related GB2343684B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18571398 1998-06-17
PCT/JP1999/003194 WO1999066099A1 (en) 1998-06-17 1999-06-16 Target material for spattering

Publications (3)

Publication Number Publication Date
GB0001523D0 GB0001523D0 (en) 2000-03-15
GB2343684A GB2343684A (en) 2000-05-17
GB2343684B true GB2343684B (en) 2003-04-23

Family

ID=16175558

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0001523A Expired - Fee Related GB2343684B (en) 1998-06-17 1999-06-16 Sputtering target material

Country Status (6)

Country Link
JP (1) JP3436763B2 (en)
KR (1) KR100348023B1 (en)
DE (1) DE19981314C2 (en)
GB (1) GB2343684B (en)
TW (1) TW491909B (en)
WO (1) WO1999066099A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1640898A4 (en) * 2003-06-27 2011-01-12 Nc Medical Res Inc Medical care self-cell delivery support system, medical care self-cell delivery support financial system, and their methods
KR100881851B1 (en) * 2004-03-01 2009-02-06 닛코킨조쿠 가부시키가이샤 HIGH-PURITY Ru POWDER, SPUTTARING TARGET OBTAINED BY SINTERING THE SAME, THIN FILM OBTAINED BY SPUTTERING THE TARGET AND PROCESS FOR PRODUCING HIGH-PURITY Ru POWDER
KR100841418B1 (en) * 2006-11-29 2008-06-25 희성금속 주식회사 Fabrication of a precious metal target using a spark plasma sintering
JP5086452B2 (en) * 2011-02-09 2012-11-28 Ｊｘ日鉱日石金属株式会社 Indium target and manufacturing method thereof

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4274926A (en) * 1979-04-12 1981-06-23 Degussa Aktiengesellschaft Process for the electrolytic deposition of silver and silver alloy coatings and compositions therefore
US4719442A (en) * 1984-07-31 1988-01-12 Rosemount Inc. Platinum resistance thermometer
EP0286175A1 (en) * 1987-04-01 1988-10-12 Shell Internationale Researchmaatschappij B.V. Process for the electrolytic production of metals
JPS63262461A (en) * 1987-04-21 1988-10-28 Mitsubishi Kasei Corp Target for sputtering
JPH04333587A (en) * 1990-06-29 1992-11-20 Electroplating Eng Of Japan Co Method and bath for electroforming and plating platinum or platinum alloy and its electro-formed and plated article
JPH07332494A (en) * 1994-06-01 1995-12-22 Honda Motor Co Ltd High strength inorganic film
JPH0867974A (en) * 1994-08-26 1996-03-12 Mitsubishi Materials Corp Sputtering target for forming thin platinum film
JPH08250427A (en) * 1995-03-13 1996-09-27 Central Glass Co Ltd Tungsten target for semiconductor
JPH0941131A (en) * 1995-07-31 1997-02-10 Mitsubishi Materials Corp Production of high purity iridium or ruthenium sputtering target
JPH11158612A (en) * 1997-12-01 1999-06-15 Mitsubishi Materials Corp Molten ruthenium sputtering target

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6428368A (en) * 1987-07-22 1989-01-30 Seiko Epson Corp Production of alloy target
JP2601843B2 (en) * 1987-10-19 1997-04-16 株式会社東芝 Semiconductor device and method of manufacturing the same
DE19710903A1 (en) * 1997-03-15 1998-09-17 Leybold Materials Gmbh Sputtering target for optical storage layer deposition

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4274926A (en) * 1979-04-12 1981-06-23 Degussa Aktiengesellschaft Process for the electrolytic deposition of silver and silver alloy coatings and compositions therefore
US4719442A (en) * 1984-07-31 1988-01-12 Rosemount Inc. Platinum resistance thermometer
EP0286175A1 (en) * 1987-04-01 1988-10-12 Shell Internationale Researchmaatschappij B.V. Process for the electrolytic production of metals
JPS63262461A (en) * 1987-04-21 1988-10-28 Mitsubishi Kasei Corp Target for sputtering
JPH04333587A (en) * 1990-06-29 1992-11-20 Electroplating Eng Of Japan Co Method and bath for electroforming and plating platinum or platinum alloy and its electro-formed and plated article
JPH07332494A (en) * 1994-06-01 1995-12-22 Honda Motor Co Ltd High strength inorganic film
JPH0867974A (en) * 1994-08-26 1996-03-12 Mitsubishi Materials Corp Sputtering target for forming thin platinum film
JPH08250427A (en) * 1995-03-13 1996-09-27 Central Glass Co Ltd Tungsten target for semiconductor
JPH0941131A (en) * 1995-07-31 1997-02-10 Mitsubishi Materials Corp Production of high purity iridium or ruthenium sputtering target
JPH11158612A (en) * 1997-12-01 1999-06-15 Mitsubishi Materials Corp Molten ruthenium sputtering target

Also Published As

Publication number Publication date
TW491909B (en) 2002-06-21
KR100348023B1 (en) 2002-08-07
DE19981314C2 (en) 2003-07-03
WO1999066099A1 (en) 1999-12-23
KR20010021519A (en) 2001-03-15
DE19981314T1 (en) 2002-10-24
JP3436763B2 (en) 2003-08-18
GB2343684A (en) 2000-05-17
GB0001523D0 (en) 2000-03-15

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20180616