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GB2284928B - Laminated tape - Google Patents

Laminated tape

Info

Publication number
GB2284928B
GB2284928B GB9325884A GB9325884A GB2284928B GB 2284928 B GB2284928 B GB 2284928B GB 9325884 A GB9325884 A GB 9325884A GB 9325884 A GB9325884 A GB 9325884A GB 2284928 B GB2284928 B GB 2284928B
Authority
GB
United Kingdom
Prior art keywords
tape
electrical
bonding
bond
conductor layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9325884A
Other versions
GB2284928A (en
GB9325884D0 (en
Inventor
Michael Lawrence Mcgeary
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB9325884A priority Critical patent/GB2284928B/en
Publication of GB9325884D0 publication Critical patent/GB9325884D0/en
Publication of GB2284928A publication Critical patent/GB2284928A/en
Application granted granted Critical
Publication of GB2284928B publication Critical patent/GB2284928B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

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    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
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    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

A flexible laminated interconnect tape is suitable for use as an electrical interconnecting medium between electronic components and between bonding pads of integrated circuit die and IC packaging bond pads. The tape may be used as a modification to existing TAB (tape automated bonding) tape technology, or as a substitute to wire bond technology. The flexible laminated tape comprises a plurality of conductor layers (40)(a - y) eg of Al, each separated from adjacent conductor layers by a polymeric insulating layer (42)(a - z). The tape offers improvement to bonding processes by simplification of the requirement to create compatible metallurgies at the bond sites. By using vacuum deposition techniques to form the electrical conductor a wider range of materials (and characteristics) is made available for electrical interconnect. Benefits may also follow in the high-frequency signal transmission between interconnected components by reducing "skin effect" attenuation; this laminated tape could be regarded as an evolution of Litzendraht Wire. <IMAGE>
GB9325884A 1993-12-17 1993-12-17 Laminated tape Expired - Fee Related GB2284928B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9325884A GB2284928B (en) 1993-12-17 1993-12-17 Laminated tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9325884A GB2284928B (en) 1993-12-17 1993-12-17 Laminated tape

Publications (3)

Publication Number Publication Date
GB9325884D0 GB9325884D0 (en) 1994-02-23
GB2284928A GB2284928A (en) 1995-06-21
GB2284928B true GB2284928B (en) 1997-07-30

Family

ID=10746814

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9325884A Expired - Fee Related GB2284928B (en) 1993-12-17 1993-12-17 Laminated tape

Country Status (1)

Country Link
GB (1) GB2284928B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG148056A1 (en) 2007-05-17 2008-12-31 Micron Technology Inc Integrated circuit packages, methods of forming integrated circuit packages, and methods of assembling intgrated circuit packages

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0014444A1 (en) * 1979-02-02 1980-08-20 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Insulating laminate
EP0324244A2 (en) * 1988-01-15 1989-07-19 International Business Machines Corporation Tape automated bonding package for a semiconductor chip with decoupling

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0014444A1 (en) * 1979-02-02 1980-08-20 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Insulating laminate
EP0324244A2 (en) * 1988-01-15 1989-07-19 International Business Machines Corporation Tape automated bonding package for a semiconductor chip with decoupling

Also Published As

Publication number Publication date
GB2284928A (en) 1995-06-21
GB9325884D0 (en) 1994-02-23

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PCNP Patent ceased through non-payment of renewal fee

Effective date: 19971217