GB2199846B - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- GB2199846B GB2199846B GB08803056A GB8803056A GB2199846B GB 2199846 B GB2199846 B GB 2199846B GB 08803056 A GB08803056 A GB 08803056A GB 8803056 A GB8803056 A GB 8803056A GB 2199846 B GB2199846 B GB 2199846B
- Authority
- GB
- United Kingdom
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
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- H01L2924/0132—Binary Alloys
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- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20753—Diameter ranges larger or equal to 30 microns less than 40 microns
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Wire Bonding (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59032434A JPS60177637A (en) | 1984-02-24 | 1984-02-24 | Semiconductor device |
JP59032433A JPS60177666A (en) | 1984-02-24 | 1984-02-24 | Semiconductor device |
JP59032435A JPS60177667A (en) | 1984-02-24 | 1984-02-24 | Semiconductor device |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8803056D0 GB8803056D0 (en) | 1988-03-09 |
GB2199846A GB2199846A (en) | 1988-07-20 |
GB2199846B true GB2199846B (en) | 1988-11-30 |
Family
ID=27287695
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08504656A Expired GB2155036B (en) | 1984-02-24 | 1985-02-22 | Semiconductor device |
GB08803056A Expired GB2199846B (en) | 1984-02-24 | 1985-02-22 | Semiconductor device |
GB08803057A Expired GB2200135B (en) | 1984-02-24 | 1985-02-22 | Semiconductor device |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08504656A Expired GB2155036B (en) | 1984-02-24 | 1985-02-22 | Semiconductor device |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08803057A Expired GB2200135B (en) | 1984-02-24 | 1985-02-22 | Semiconductor device |
Country Status (7)
Country | Link |
---|---|
DE (1) | DE3506264A1 (en) |
FR (1) | FR2561446B1 (en) |
GB (3) | GB2155036B (en) |
HK (3) | HK95190A (en) |
IT (1) | IT1183375B (en) |
MY (1) | MY101028A (en) |
SG (1) | SG82790G (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8349462B2 (en) | 2009-01-16 | 2013-01-08 | Alcoa Inc. | Aluminum alloys, aluminum alloy products and methods for making the same |
WO2021192121A1 (en) * | 2020-03-25 | 2021-09-30 | 日鉄マイクロメタル株式会社 | Al BONDING WIRE |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1297872B (en) * | 1966-07-30 | 1969-06-19 | Aluminium Giesserei Villingen | Use of an aluminum casting alloy for the production of highly electrically conductive cast parts |
CH524225A (en) * | 1968-05-21 | 1972-06-15 | Southwire Co | Aluminum alloy wire or bar |
DE2029584A1 (en) * | 1969-06-18 | 1970-12-23 | Kaiser Aluminum & Chemical Corp., Oakland, Calif. (V.St.A.) | Method of manufacturing an electrical conductor using aluminum |
ZA723663B (en) * | 1971-06-07 | 1973-03-28 | Southwire Co | Aluminum nickel alloy electrical conductor |
DE2143808A1 (en) * | 1971-09-01 | 1973-03-08 | Siemens Ag | ELECTRICALLY CONDUCTIVE CONNECTION BETWEEN THE METALS GOLD AND ALUMINUM |
BE791269R (en) * | 1971-11-11 | 1973-03-01 | Southwire Co | ALUMINUM ALLOY TREFILE PRODUCTS AND PROCESS FOR THE |
CA1037742A (en) * | 1973-07-23 | 1978-09-05 | Enrique C. Chia | High iron aluminum alloy |
IN155541B (en) * | 1974-08-01 | 1985-02-16 | Southwire Co | |
FR2289035A1 (en) * | 1974-08-29 | 1976-05-21 | Trefimetaux | ELECTRICAL CONDUCTORS IN ALUMINUM ALLOYS AND PROCESS FOR OBTAINING |
JPS5251867A (en) * | 1975-10-23 | 1977-04-26 | Nec Corp | Bonding wire for semiconductor device |
GB1510940A (en) * | 1975-12-09 | 1978-05-17 | Southwire Co | Aluminium-iron-nickel alloy electrical conductor |
DE2625092A1 (en) * | 1976-06-04 | 1977-12-15 | Demetron | Contact sheet for semiconductor devices - comprising sandwich of metal of specified conductivity with softer outer layers |
DE2929623C2 (en) * | 1979-07-21 | 1981-11-26 | W.C. Heraeus Gmbh, 6450 Hanau | Fine wire made from an aluminum alloy |
DE3023528C2 (en) * | 1980-06-24 | 1984-11-29 | W.C. Heraeus Gmbh, 6450 Hanau | Fine wire containing aluminum |
NL184184C (en) * | 1981-03-20 | 1989-05-01 | Philips Nv | METHOD FOR APPLYING CONTACT INCREASES TO CONTACT PLACES OF AN ELECTRONIC MICROCKETES |
JPS58154241A (en) * | 1982-03-10 | 1983-09-13 | Hitachi Ltd | Electric apparatus and preparation thereof and bonding wire used thereto and preparation thereof |
JPS5928553A (en) * | 1982-08-11 | 1984-02-15 | Hitachi Ltd | Corrosion resistant aluminum electronic material |
FR2555813B1 (en) * | 1983-09-28 | 1986-06-20 | Hitachi Ltd | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SUCH A DEVICE |
-
1985
- 1985-02-20 IT IT19571/85A patent/IT1183375B/en active
- 1985-02-22 GB GB08504656A patent/GB2155036B/en not_active Expired
- 1985-02-22 GB GB08803056A patent/GB2199846B/en not_active Expired
- 1985-02-22 DE DE19853506264 patent/DE3506264A1/en not_active Withdrawn
- 1985-02-22 GB GB08803057A patent/GB2200135B/en not_active Expired
- 1985-05-09 FR FR8506995A patent/FR2561446B1/en not_active Expired
-
1987
- 1987-09-25 MY MYPI87001951A patent/MY101028A/en unknown
-
1990
- 1990-10-11 SG SG827/90A patent/SG82790G/en unknown
- 1990-11-15 HK HK951/90A patent/HK95190A/en not_active IP Right Cessation
- 1990-11-15 HK HK950/90A patent/HK95090A/en not_active IP Right Cessation
- 1990-11-15 HK HK949/90A patent/HK94990A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
GB2155036B (en) | 1988-11-09 |
IT1183375B (en) | 1987-10-22 |
GB2200135A (en) | 1988-07-27 |
MY101028A (en) | 1991-06-29 |
GB2199846A (en) | 1988-07-20 |
IT8519571A0 (en) | 1985-02-20 |
DE3506264A1 (en) | 1985-08-29 |
SG82790G (en) | 1990-11-23 |
GB8504656D0 (en) | 1985-03-27 |
HK95090A (en) | 1990-11-23 |
GB8803057D0 (en) | 1988-03-09 |
HK95190A (en) | 1990-11-23 |
GB8803056D0 (en) | 1988-03-09 |
GB2155036A (en) | 1985-09-18 |
FR2561446A1 (en) | 1985-09-20 |
HK94990A (en) | 1990-11-23 |
GB2200135B (en) | 1988-11-30 |
FR2561446B1 (en) | 1987-02-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19970222 |