GB2181084A - Soldering apparatus - Google Patents
Soldering apparatus Download PDFInfo
- Publication number
- GB2181084A GB2181084A GB08622861A GB8622861A GB2181084A GB 2181084 A GB2181084 A GB 2181084A GB 08622861 A GB08622861 A GB 08622861A GB 8622861 A GB8622861 A GB 8622861A GB 2181084 A GB2181084 A GB 2181084A
- Authority
- GB
- United Kingdom
- Prior art keywords
- solder
- flux
- primary
- bath
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Abstract
Soldering apparatus for soldering a printed circuit board (3) carrying electronic parts (2) has a primary fluxer (5), a preheater (6), a primary solder bath (8), a secondary fluxer (13) and a secondary solder bath (10) all arranged in line such that the secondary fluxer (13) lies between the primary and secondary solder baths (8 and 10). The provision of the secondary fluxer (13) and the secondary solder bath (10) is to remove undesirable solder stalactites and solder bridges. <IMAGE>
Description
SPECIFICATION
Soldering apparatus
The present invention relates to soldering apparatus.
Such soldering apparatus may be used for soldering a printed circuit board and, may take the form of a continuous soldering apparatus which is suitable for continuously soldering a printed circuit board having chip parts or the like packaged therein in a high density.
It is an object of the present invention to provide a improved soldering apparatus.
According to the present invention, there is provided an apparatus for soldering a printed circuit board having electronic parts packaged therein, comprising: a primary fluxer for applying post-flux to said printed circuit board; a preparatory heater arranged downstream of said primary fluxer for evaporating the solvent of said post-flux and for preheating said printed circuit board to soften the heat shocks; a primary solder bath arranged downstream of said preparatory heater and having a primary sprayer for spraying solder to said printed circuit board; and a secondary solder bath arranged downstream of said primary solder bath and having a secondary sprayer for spraying solder to said printed circuit board once soldered, wherein the improvement comprises a secondary fluxer interposed between said primary and secondary solder baths for applying mist of flux to the lower side of said printed circuit board once soldered.
The secoridary fluxer is arranged upstream of the secondary solder bath again the flux to the printed circuit board, which has been subjected to the primary soldering in the primary solder bath and then heated, so that the printed circuit board is finished in the secondary solder bath after it has been preheated to have its solvent evaporated by the upstream and downstream solder baths. As a result, the slug left on the surface of the secondary solder bath is removed by the effect of the flux applied again, and the activation by the flux continues while the board is being dipped in the secondary solder bath. The flux thus applied is gasified by the heat of the solder to clear the board of the ambient air so that the board surface wetted with the solder is kept non-oxidized to form clear fillets.
Soldering apparatus embodying the present invention, will now be described by way of example with reference to the accompanying diagrammatic drawing, in which:
Figure 1 is a longitudinal section through the soldering apparatus embodying the present invention; and
Figure 2 is a longitudinal section through a previously proposed soldering apparatus.
Fig. 2 shows a previously proposed printedcircuit board soldering apparatus. A printed circuit board 3 carrying electronic parts 1 with leads and chip parts 2, as shown in longitudinal section, is wetted with post-flux 5 by a primary fluxer 4 of the foaming type and is preheated by a pre-heater 6 to evaporate the solvent in the flux and to soften the heat shocks.
Next, a high-wave solder is sprayed from a primary wave sprayer 9 in a primary solder bath 8 of a solder bath body 7 such that it may not fail to wet the part by preventing air from being stagnant on the part. However, the solder application by the primary wave sprayer 9 forms high waves on the surface of the molten solder so that solder stalactites and/or solder bridges frequently develop from the high waves. In order to eliminate the stalactites and bridges of the solder, therefore, a secondary soldering is performed in a secondary solder bath 10 by a secondary wave sprayer 11, and the molten solder surface having less waves is pulled up to reduce the developments of the stalactites and bridges.
During the primary soldering, however, the flux is removed by the high-wave solder, or its active agent is damaged by the heat to reduce the fluxing effect. The part thus soldered is complete after it has been cooled by a blower 12. The soldering steps thus far described are conducted in a continuous manner.
The following problems arise if a printed circuit board having a higher package density is to be soldered by this soldering apparatus.
(1) Insufficient soldering is caused frequently by the solder stalactites and bridges and is difficult and inefficient to repair because the printed circuit board is small-sized and package density is high.
(2) The repairer has to resort to a soldering iron to extend the heating time period thereby to cause secondary problems in that the parts are thermally damaged or in that the printed pattern and/or chip parts have some of their silver electrodes melted away.
In the apparatus shown in Fig. 1 parts similar to those in Fig. 2 are similarly referenced.
The apparatus of Fig. 1 is similar to the apparatus of Fig. 2 except that a secondary fluxer 13 is interposed between the primary solder bath 8 and the secondary solder bath 10. A solder bath body 14 incorporates the primary solder bath 8, the secondary solder bath 10 and the secondary fluxer 13. This fluxer 13 is arranged centrally of the solder bath body 14 and has an opening 15, which is formed in a lower portion of the solder bath body 14, and a blower 16 which is positioned above the opening 15. Air is blown around a doubleboxed flux bath formed by inner and outer boxes 17 and 18 partly to reduce the temperature of the molten flux and partly to prevent heat transfer by convection of the heat liberated from the primary and secondary solder baths 8 and 10. The secondary flux bath 13 is equipped therein with a spray mist genera tor 19, which operates to spray a mist 20 of the flux onto the underside of the printed circuit board when a detector (not shown) detects the approach of the printed circuit board.
The following effects can be achieved by the described apparatus.
(1) A high dense package can be soldered with less solder stalactite and bridge defects.
(2) Because of the resulting reduction in the number of parts to be repaired, the risk of a secondary defective is accordingly reduced, and the silver electrodes of the printed patterns and chip parts are less molten away.
(3) It is possible to provide a soldering apparatus having an excellent production efficiency.
Claims (7)
1. Apparatus for soldering a printed circuit board carrying electronic components, the apparatus, comprising:
a primary fluxer for applying post-flux to said printed circuit board;
a preheater arranged downstream of said primary fluxer for evaporating the solvent of said post-flux and for preheating said printed circuit board to soften the heat shocks;
a primary solder bath arranged downstream of said preparatory heater and having a primary sprayer for spraying solder onto said printed circuit board; and
a secondary solder bath arranged downstream of said primary solder bath and having a secondary sprayer for spraying solder to said printed circuit board once soldered, and a secondary fluxer interposed between said primary and secondary solder baths for applying a mist of flux onto the solder deposited on the printed circuit board by the primary solder bath.
2. Apparatus according to Claim 1, wherein said primary solder bath, said secondary fluxer and said secondary solder bath are accommodated in a common solder bath body.
3. An apparatus according to Claim 1 or to
Claim 2, wherein said secondary fluxer includes: a flux bath containing flux therein and positioned in an upper portion of said solder bath body; an opening formed in a lower portion of said solder bath body below said flux bath and a blower positioned above said opening for directing a stream of air upwardly around said flux bath to reduce the temperature of the molten flux and to reduce heat transfer to the flux bath from said primary and second solder baths by convection.
4. Apparatus according to any one of
Claims 1 to 3, wherein said secondary fluxer further includes a spray mist generator for spraying the flux in the form of mist from said flux bath onto the underside of said printed circuit board.
5. Apparatus according to Claim 3, wherein said flux bath has an inner and outer spaced walls.
6. Apparatus according to any preceeding
Claim further comprising a blower arranged downstream of said secondary solder bath for cooling said printed circuit board.
7. Apparatus for soldering a printed circuit board substantially as hereinbefore described, with reference to Fig. 1 of the accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60219956A JPS6281264A (en) | 1985-10-02 | 1985-10-02 | Soldering device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8622861D0 GB8622861D0 (en) | 1986-10-29 |
| GB2181084A true GB2181084A (en) | 1987-04-15 |
| GB2181084B GB2181084B (en) | 1989-09-13 |
Family
ID=16743668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8622861A Expired GB2181084B (en) | 1985-10-02 | 1986-09-23 | Soldering apparatus |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS6281264A (en) |
| KR (1) | KR870004649A (en) |
| GB (1) | GB2181084B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992019416A1 (en) * | 1991-05-08 | 1992-11-12 | Peter Philip Andrew Lymn | Solder leveller |
| US5507882A (en) * | 1994-02-28 | 1996-04-16 | Delco Electronics Corporation | Low residue water-based soldering flux and process for soldering with same |
| EP0761361A1 (en) * | 1995-09-08 | 1997-03-12 | Ford Motor Company | Apparatus for cooling printed circuit boards in wave soldering |
| EP0827800A1 (en) * | 1996-09-09 | 1998-03-11 | LYMN, Peter Philip Andrew | Solder leveller |
| US6066197A (en) * | 1995-07-11 | 2000-05-23 | Delphi Technologies, Inc. | Coatings and methods, especially for circuit boards |
| EP1033197A2 (en) * | 1999-02-22 | 2000-09-06 | Senju Metal Industry Co., Ltd. | Method and apparatus for soldering printed circuit boards and cooling mechanism for a soldering apparatus |
| US6786385B1 (en) * | 1997-09-08 | 2004-09-07 | Fujitsu Limited | Semiconductor device with gold bumps, and method and apparatus of producing the same |
| CN100425382C (en) * | 2005-06-17 | 2008-10-15 | 杨国金 | Jetting flow welding method and its apparatus |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04258370A (en) * | 1991-02-06 | 1992-09-14 | Matsushita Electric Ind Co Ltd | Device and method for dip soldering |
| JPH0734989B2 (en) * | 1992-09-04 | 1995-04-19 | 大阪アサヒ化学株式会社 | No-clean method for jet soldering |
| JPH06296074A (en) * | 1993-04-09 | 1994-10-21 | Tamura Seisakusho Co Ltd | Wave soldering device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057944B2 (en) * | 1982-05-07 | 1985-12-17 | 権士 近藤 | Jet solder bath |
-
1985
- 1985-10-02 JP JP60219956A patent/JPS6281264A/en active Pending
-
1986
- 1986-05-01 KR KR1019860003424A patent/KR870004649A/en not_active Application Discontinuation
- 1986-09-23 GB GB8622861A patent/GB2181084B/en not_active Expired
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992019416A1 (en) * | 1991-05-08 | 1992-11-12 | Peter Philip Andrew Lymn | Solder leveller |
| US5507882A (en) * | 1994-02-28 | 1996-04-16 | Delco Electronics Corporation | Low residue water-based soldering flux and process for soldering with same |
| US6066197A (en) * | 1995-07-11 | 2000-05-23 | Delphi Technologies, Inc. | Coatings and methods, especially for circuit boards |
| EP0761361A1 (en) * | 1995-09-08 | 1997-03-12 | Ford Motor Company | Apparatus for cooling printed circuit boards in wave soldering |
| US5685475A (en) * | 1995-09-08 | 1997-11-11 | Ford Motor Company | Apparatus for cooling printed circuit boards in wave soldering |
| EP0827800A1 (en) * | 1996-09-09 | 1998-03-11 | LYMN, Peter Philip Andrew | Solder leveller |
| US6786385B1 (en) * | 1997-09-08 | 2004-09-07 | Fujitsu Limited | Semiconductor device with gold bumps, and method and apparatus of producing the same |
| EP1033197A2 (en) * | 1999-02-22 | 2000-09-06 | Senju Metal Industry Co., Ltd. | Method and apparatus for soldering printed circuit boards and cooling mechanism for a soldering apparatus |
| EP1033197A3 (en) * | 1999-02-22 | 2002-01-23 | Senju Metal Industry Co., Ltd. | Method and apparatus for soldering printed circuit boards and cooling mechanism for a soldering apparatus |
| EP1439020A2 (en) * | 1999-02-22 | 2004-07-21 | Senju Metal Industry Co., Ltd. | Method and apparatus for soldering printed circuit boards and cooling mechanism for a soldering apparatus |
| EP1439020A3 (en) * | 1999-02-22 | 2004-08-04 | Senju Metal Industry Co., Ltd. | Method and apparatus for soldering printed circuit boards and cooling mechanism for a soldering apparatus |
| CN100425382C (en) * | 2005-06-17 | 2008-10-15 | 杨国金 | Jetting flow welding method and its apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| KR870004649A (en) | 1987-05-11 |
| JPS6281264A (en) | 1987-04-14 |
| GB2181084B (en) | 1989-09-13 |
| GB8622861D0 (en) | 1986-10-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |