[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

GB2159763B - Process for sticking adhesive tape on thin article - Google Patents

Process for sticking adhesive tape on thin article

Info

Publication number
GB2159763B
GB2159763B GB08414433A GB8414433A GB2159763B GB 2159763 B GB2159763 B GB 2159763B GB 08414433 A GB08414433 A GB 08414433A GB 8414433 A GB8414433 A GB 8414433A GB 2159763 B GB2159763 B GB 2159763B
Authority
GB
United Kingdom
Prior art keywords
adhesive tape
sticking adhesive
thin article
article
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08414433A
Other versions
GB2159763A (en
GB8414433D0 (en
Inventor
Kenji Ohnishi
Minoru Ametani
Kozo Nomura
Keigo Funakoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to GB08414433A priority Critical patent/GB2159763B/en
Publication of GB8414433D0 publication Critical patent/GB8414433D0/en
Publication of GB2159763A publication Critical patent/GB2159763A/en
Application granted granted Critical
Publication of GB2159763B publication Critical patent/GB2159763B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
    • B65C1/00—Labelling flat essentially-rigid surfaces
    • B65C1/02—Affixing labels to one flat surface of articles, e.g. of packages, of flat bands
    • B65C1/025—Affixing labels to one flat surface of articles, e.g. of packages, of flat bands the label being picked up by the article to be labelled, i.e. the labelling head remaining stationary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
    • B65C9/00—Details of labelling machines or apparatus
    • B65C9/08—Label feeding
    • B65C9/18—Label feeding from strips, e.g. from rolls
    • B65C9/1865—Label feeding from strips, e.g. from rolls the labels adhering on a backing strip
    • B65C9/1869—Label feeding from strips, e.g. from rolls the labels adhering on a backing strip and being transferred directly from the backing strip onto the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
    • B65C9/00—Details of labelling machines or apparatus
    • B65C9/26—Devices for applying labels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H01L2221/6839—Separation by peeling using peeling wedge or knife or bar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
GB08414433A 1984-06-06 1984-06-06 Process for sticking adhesive tape on thin article Expired GB2159763B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08414433A GB2159763B (en) 1984-06-06 1984-06-06 Process for sticking adhesive tape on thin article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08414433A GB2159763B (en) 1984-06-06 1984-06-06 Process for sticking adhesive tape on thin article

Publications (3)

Publication Number Publication Date
GB8414433D0 GB8414433D0 (en) 1984-07-11
GB2159763A GB2159763A (en) 1985-12-11
GB2159763B true GB2159763B (en) 1987-11-18

Family

ID=10562008

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08414433A Expired GB2159763B (en) 1984-06-06 1984-06-06 Process for sticking adhesive tape on thin article

Country Status (1)

Country Link
GB (1) GB2159763B (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104554955A (en) * 2014-12-01 2015-04-29 广州三拓识别技术有限公司 Full-automatic bottle support film laminating method and equipment
CN106586080A (en) * 2016-11-30 2017-04-26 芜湖立创包装有限公司 Film sticking method for packaging barrel
CN107963263A (en) * 2017-12-21 2018-04-27 南京联信自动化科技有限公司 Vacuum automatic film pasting system
CN108790182A (en) * 2017-04-26 2018-11-13 住友化学株式会社 Laminating apparatus
CN111591503A (en) * 2020-05-20 2020-08-28 刘海光 High-efficient tectorial membrane device of aluminum alloy plate
CN111591502A (en) * 2020-05-07 2020-08-28 刘海光 Film pasting equipment for packaging aluminum plate

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3685136D1 (en) * 1985-02-07 1992-06-11 Fujitsu Ltd METHOD AND DEVICE FOR ATTACHING A STRIP OR FILM TO A SEMICONDUCTOR DISC.
JPS6443458A (en) * 1987-08-11 1989-02-15 Nitto Denko Corp Stick cutter for tacky tape with respect to thin board
DE3941424A1 (en) * 1989-12-15 1991-06-20 Kurz Leonhard Fa METHOD FOR TRANSFERRING A DECOR FROM A PRINTED FILM TO A FLAT-SUBSTRATE SUBSTRATE AND DEVICE FOR IMPLEMENTING THE METHOD
JPH04336428A (en) * 1991-05-13 1992-11-24 Nitto Denko Corp Wafer tape adhering and peeling apparatus
FR2713627B1 (en) * 1993-12-07 1997-09-12 Saint Gobain Vitrage METHOD AND DEVICE FOR THE MANUFACTURE OF ASYMMETRICAL LAMINATED GLAZING BY CALENDERING
KR970002433B1 (en) * 1993-12-31 1997-03-05 삼성전자 주식회사 Attaching method of masking film and the apparatus thereof
FR2722618B1 (en) * 1994-07-13 1996-08-14 Sylea Sa INSTALLATION FOR DISTRIBUTING PATONS OF PLASTIC ADHESIVE MATERIAL AND TOOL FOR LAYING SAID PATONS IN ELECTRICAL CONNECTOR HOUSING ELEMENTS
ES2132836T3 (en) * 1996-03-20 1999-08-16 Sucesores De Luigi Fieramonte PROCEDURE FOR APPLYING AN ALUMINUM SHEET ON THE EXTERIOR SURFACE OF A REFRIGERATOR CONTAINER, AND COMPOSITE TAPE.
JP3339467B2 (en) * 1999-06-09 2002-10-28 ソニー株式会社 Functional film sticking apparatus and functional film sticking method
FR2796619B1 (en) * 1999-07-20 2001-09-14 Etik Ouest DEVICE FOR TAKING AND LAYING LABELS
JP3837320B2 (en) * 2001-11-07 2006-10-25 リンテック株式会社 Optical disc laminating device
ITBO20020144A1 (en) * 2002-03-22 2003-09-22 Ica Spa IMPROVEMENTS IN THE DEVICES TO APPLY ADHESIVE LABELS
DE10311267B4 (en) * 2003-03-14 2006-11-02 Daimlerchrysler Ag Method and apparatus for the automated application of paint film on body parts and use of a stretched pressure-sensitive adhesive tape thereby
DE102004005959B4 (en) * 2004-02-02 2006-12-07 Wölfle, Dieter System and method for applying a self-adhesive label to an object
JP2015067283A (en) * 2013-09-27 2015-04-13 シャープ株式会社 Tape sticking device
CN103803115B (en) * 2014-02-19 2015-10-07 苏州博众精工科技有限公司 One gets film film pasting mechanism automatically
CN104943899B (en) * 2015-05-11 2017-04-12 北京邮电大学 Method and system for sticking films to mobile phones
CN105501514B (en) * 2015-11-27 2017-11-17 山东大学 The application method of pad pasting external member
CN105836198A (en) * 2016-02-23 2016-08-10 徐秀珍 Automatic covering film production equipment for label instructions

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3663343A (en) * 1970-05-11 1972-05-16 By Buk Co Composite pressure sensitive adhesive sheet structure and process of making the same
BE762689A (en) * 1970-11-19 1971-07-16 Electro Seal Corp METHOD AND APPARATUS FOR APPLYING THERMOPLASTIC ADHESIVE MATERIAL

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104554955A (en) * 2014-12-01 2015-04-29 广州三拓识别技术有限公司 Full-automatic bottle support film laminating method and equipment
CN106586080A (en) * 2016-11-30 2017-04-26 芜湖立创包装有限公司 Film sticking method for packaging barrel
CN108790182A (en) * 2017-04-26 2018-11-13 住友化学株式会社 Laminating apparatus
CN107963263A (en) * 2017-12-21 2018-04-27 南京联信自动化科技有限公司 Vacuum automatic film pasting system
CN111591502A (en) * 2020-05-07 2020-08-28 刘海光 Film pasting equipment for packaging aluminum plate
CN111591502B (en) * 2020-05-07 2021-12-28 力同铝业(山东)有限公司 Film pasting equipment for packaging aluminum plate
CN111591503A (en) * 2020-05-20 2020-08-28 刘海光 High-efficient tectorial membrane device of aluminum alloy plate
CN111591503B (en) * 2020-05-20 2021-11-30 山东智领新材料有限公司 High-efficient tectorial membrane device of aluminum alloy plate

Also Published As

Publication number Publication date
GB2159763A (en) 1985-12-11
GB8414433D0 (en) 1984-07-11

Similar Documents

Publication Publication Date Title
GB2159763B (en) Process for sticking adhesive tape on thin article
GB2103513B (en) Adhesive tape and process for its production
GB2157193B (en) Process for peeling protective film off a thin article
EP0202938A3 (en) Microbubble-filled article such as a pressure-sensitive adhesive tape
EP0180434A3 (en) Removable pressure-sensitive adhesive tape
AU576122B2 (en) Article carrier
AU614229B2 (en) Process for making a unified pressure-sensitive adhesive tape
AU2753888A (en) Radiation-curable coating for thermoplastic substrates
EP0307509A3 (en) Sticking and cutoff device for adhesive tape for thin articles
DE3163922D1 (en) Pressure-sensitive adhesive tape
DE3560118D1 (en) Device for sticking an adhesive tape to the edge of a plate, especially of a metal plate
GB2108008B (en) Adhesive tape
AU549134B2 (en) Label fastener
EP0305161A3 (en) Unified pressure-sensitive adhesive tape
GB2208390B (en) Thin film deposition process
GB8707322D0 (en) Thin film deposition process
AU4632885A (en) Apple labeling process
JPS6487682A (en) Adhesive tape
GB8402176D0 (en) Adhesive tapes
EP0079519A3 (en) Adhesive tape
AU2930584A (en) Multiple-connector adhesive tape
EP0287306A3 (en) Removable pressure-sensitive adhesive tape
AU558213B2 (en) Article carrier
AU560835B2 (en) Tape fastener
GB8602637D0 (en) Thin films

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19920606