GB202207670D0 - Industrial monitoring apparatus with integrated computer - Google Patents
Industrial monitoring apparatus with integrated computerInfo
- Publication number
- GB202207670D0 GB202207670D0 GBGB2207670.7A GB202207670A GB202207670D0 GB 202207670 D0 GB202207670 D0 GB 202207670D0 GB 202207670 A GB202207670 A GB 202207670A GB 202207670 D0 GB202207670 D0 GB 202207670D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- monitoring apparatus
- integrated computer
- industrial monitoring
- industrial
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000012544 monitoring process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB2207670.7A GB202207670D0 (en) | 2022-05-25 | 2022-05-25 | Industrial monitoring apparatus with integrated computer |
PCT/EP2023/063507 WO2023227485A1 (en) | 2022-05-25 | 2023-05-19 | Industrial monitoring apparatus with integrated computer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB2207670.7A GB202207670D0 (en) | 2022-05-25 | 2022-05-25 | Industrial monitoring apparatus with integrated computer |
Publications (1)
Publication Number | Publication Date |
---|---|
GB202207670D0 true GB202207670D0 (en) | 2022-07-06 |
Family
ID=82220602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB2207670.7A Ceased GB202207670D0 (en) | 2022-05-25 | 2022-05-25 | Industrial monitoring apparatus with integrated computer |
Country Status (2)
Country | Link |
---|---|
GB (1) | GB202207670D0 (en) |
WO (1) | WO2023227485A1 (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202010014108U1 (en) * | 2010-10-08 | 2010-12-02 | Congatec Ag | Heat spreader with mechanically secured heat coupling element |
US8537540B2 (en) * | 2010-11-02 | 2013-09-17 | Technology Advancement Group, Inc. | Field serviceable CPU module |
TWM505164U (en) * | 2015-03-02 | 2015-07-11 | Adlink Technology Inc | Single-board computer locking structure performing heat dissipation by thermal conduction |
US9807905B2 (en) * | 2015-11-25 | 2017-10-31 | General Electric Company | Adapter cooling apparatus and method for modular computing devices |
US10681800B1 (en) * | 2019-04-22 | 2020-06-09 | Adlink Technology Inc. | Thermal module mounting structure |
CN110080766B (en) * | 2019-04-30 | 2024-03-01 | 中国矿业大学 | Comprehensive mining working face coal-rock interface identification device and method |
-
2022
- 2022-05-25 GB GBGB2207670.7A patent/GB202207670D0/en not_active Ceased
-
2023
- 2023-05-19 WO PCT/EP2023/063507 patent/WO2023227485A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2023227485A1 (en) | 2023-11-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AT | Applications terminated before publication under section 16(1) |