GB202100255D0 - Radio frequency module - Google Patents
Radio frequency moduleInfo
- Publication number
- GB202100255D0 GB202100255D0 GBGB2100255.5A GB202100255A GB202100255D0 GB 202100255 D0 GB202100255 D0 GB 202100255D0 GB 202100255 A GB202100255 A GB 202100255A GB 202100255 D0 GB202100255 D0 GB 202100255D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- radio frequency
- frequency module
- module
- radio
- frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/12—Hollow waveguides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/12—Hollow waveguides
- H01P3/121—Hollow waveguides integrated in a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/12—Hollow waveguides
- H01P3/14—Hollow waveguides flexible
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Waveguide Aerials (AREA)
- Microwave Amplifiers (AREA)
- Transceivers (AREA)
- Waveguide Connection Structure (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB2100255.5A GB202100255D0 (en) | 2021-01-08 | 2021-01-08 | Radio frequency module |
PCT/EP2022/050260 WO2022148835A1 (en) | 2021-01-08 | 2022-01-07 | Radio frequency module |
EP22700738.2A EP4275247B1 (en) | 2021-01-08 | 2022-01-07 | Radio frequency module |
US18/271,272 US20240304973A1 (en) | 2021-01-08 | 2022-01-07 | Radio frequency module |
GB2311891.2A GB2617525B (en) | 2021-01-08 | 2022-01-07 | Radio frequency module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB2100255.5A GB202100255D0 (en) | 2021-01-08 | 2021-01-08 | Radio frequency module |
Publications (1)
Publication Number | Publication Date |
---|---|
GB202100255D0 true GB202100255D0 (en) | 2021-02-24 |
Family
ID=74667729
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB2100255.5A Ceased GB202100255D0 (en) | 2021-01-08 | 2021-01-08 | Radio frequency module |
GB2311891.2A Active GB2617525B (en) | 2021-01-08 | 2022-01-07 | Radio frequency module |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2311891.2A Active GB2617525B (en) | 2021-01-08 | 2022-01-07 | Radio frequency module |
Country Status (4)
Country | Link |
---|---|
US (1) | US20240304973A1 (en) |
EP (1) | EP4275247B1 (en) |
GB (2) | GB202100255D0 (en) |
WO (1) | WO2022148835A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024151832A1 (en) * | 2023-01-12 | 2024-07-18 | The Penn State Research Foundation | Deployable electromagnetic waveguides |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU1374399A1 (en) * | 1986-03-13 | 1988-02-15 | Предприятие П/Я В-8828 | Mixer with phase suppression of mirror reception channel |
US5929728A (en) * | 1997-06-25 | 1999-07-27 | Hewlett-Packard Company | Imbedded waveguide structures for a microwave circuit package |
SE513586C2 (en) * | 1998-05-12 | 2000-10-02 | Ericsson Telefon Ab L M | Method of producing an antenna structure and antenna structure prepared by said method |
JP4825756B2 (en) * | 2007-08-29 | 2011-11-30 | 日立オートモティブシステムズ株式会社 | High frequency module |
JP4827825B2 (en) * | 2007-12-03 | 2011-11-30 | 日立オートモティブシステムズ株式会社 | High frequency module |
KR101316657B1 (en) * | 2009-03-31 | 2013-10-10 | 쿄세라 코포레이션 | Circuit board, high frequency module, and radar apparatus |
US8912860B2 (en) * | 2009-09-08 | 2014-12-16 | Siklu Communication ltd. | Millimeter-wave bare IC mounted within a laminated PCB and usable in a waveguide transition |
-
2021
- 2021-01-08 GB GBGB2100255.5A patent/GB202100255D0/en not_active Ceased
-
2022
- 2022-01-07 EP EP22700738.2A patent/EP4275247B1/en active Active
- 2022-01-07 GB GB2311891.2A patent/GB2617525B/en active Active
- 2022-01-07 WO PCT/EP2022/050260 patent/WO2022148835A1/en active Application Filing
- 2022-01-07 US US18/271,272 patent/US20240304973A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
EP4275247A1 (en) | 2023-11-15 |
US20240304973A1 (en) | 2024-09-12 |
GB2617525A (en) | 2023-10-11 |
WO2022148835A1 (en) | 2022-07-14 |
EP4275247B1 (en) | 2024-10-02 |
GB202311891D0 (en) | 2023-09-13 |
GB2617525B (en) | 2024-09-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AT | Applications terminated before publication under section 16(1) |