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GB201003067D0 - Plasma-polymerized polymer coating - Google Patents

Plasma-polymerized polymer coating

Info

Publication number
GB201003067D0
GB201003067D0 GBGB1003067.4A GB201003067A GB201003067D0 GB 201003067 D0 GB201003067 D0 GB 201003067D0 GB 201003067 A GB201003067 A GB 201003067A GB 201003067 D0 GB201003067 D0 GB 201003067D0
Authority
GB
United Kingdom
Prior art keywords
plasma
polymer coating
polymerized polymer
polymerized
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB1003067.4A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semblant Global Ltd
Original Assignee
Semblant Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semblant Ltd filed Critical Semblant Ltd
Priority to GBGB1003067.4A priority Critical patent/GB201003067D0/en
Publication of GB201003067D0 publication Critical patent/GB201003067D0/en
Priority to EP11705228A priority patent/EP2539392A1/en
Priority to PCT/GB2011/000238 priority patent/WO2011104500A1/en
Priority to KR1020127024623A priority patent/KR101778820B1/en
Priority to JP2012554405A priority patent/JP6085480B2/en
Priority to CN2011800107855A priority patent/CN102791779A/en
Priority to CN201610837103.2A priority patent/CN106916331A/en
Priority to BR112012021172A priority patent/BR112012021172A2/en
Priority to TW100106073A priority patent/TWI547221B/en
Priority to US13/527,305 priority patent/US8995146B2/en
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/16—Chemical modification with polymerisable compounds
    • C08J7/18—Chemical modification with polymerisable compounds using wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/28—Treatment by wave energy or particle radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Led Device Packages (AREA)
  • Polymerisation Methods In General (AREA)
  • Non-Insulated Conductors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Physical Vapour Deposition (AREA)
GBGB1003067.4A 2010-02-23 2010-02-23 Plasma-polymerized polymer coating Ceased GB201003067D0 (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
GBGB1003067.4A GB201003067D0 (en) 2010-02-23 2010-02-23 Plasma-polymerized polymer coating
BR112012021172A BR112012021172A2 (en) 2010-02-23 2011-02-21 plasma polymer polymer coating
JP2012554405A JP6085480B2 (en) 2010-02-23 2011-02-21 Plasma polymer coating
PCT/GB2011/000238 WO2011104500A1 (en) 2010-02-23 2011-02-21 Plasma-polymerized polymer coating
KR1020127024623A KR101778820B1 (en) 2010-02-23 2011-02-21 Plasma-polymerized polymer coating
EP11705228A EP2539392A1 (en) 2010-02-23 2011-02-21 Plasma-polymerized polymer coating
CN2011800107855A CN102791779A (en) 2010-02-23 2011-02-21 Plasma-polymerized polymer coating
CN201610837103.2A CN106916331A (en) 2010-02-23 2011-02-21 The polymer coating of plasma polymerization
TW100106073A TWI547221B (en) 2010-02-23 2011-02-23 Printed circuit board and method for preparing the same
US13/527,305 US8995146B2 (en) 2010-02-23 2012-06-19 Electrical assembly and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB1003067.4A GB201003067D0 (en) 2010-02-23 2010-02-23 Plasma-polymerized polymer coating

Publications (1)

Publication Number Publication Date
GB201003067D0 true GB201003067D0 (en) 2010-04-07

Family

ID=42114258

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB1003067.4A Ceased GB201003067D0 (en) 2010-02-23 2010-02-23 Plasma-polymerized polymer coating

Country Status (8)

Country Link
EP (1) EP2539392A1 (en)
JP (1) JP6085480B2 (en)
KR (1) KR101778820B1 (en)
CN (2) CN102791779A (en)
BR (1) BR112012021172A2 (en)
GB (1) GB201003067D0 (en)
TW (1) TWI547221B (en)
WO (1) WO2011104500A1 (en)

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JP5693515B2 (en) * 2012-01-10 2015-04-01 エイチズィーオー・インコーポレーテッド Electronic device with internal water-resistant coating
IN2014DN06838A (en) * 2012-03-06 2015-05-22 Semblant Ltd
GB2510213A (en) * 2012-08-13 2014-07-30 Europlasma Nv Forming a protective polymer coating on a component
US10086584B2 (en) 2012-12-13 2018-10-02 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
US10014177B2 (en) 2012-12-13 2018-07-03 Corning Incorporated Methods for processing electronic devices
US9340443B2 (en) 2012-12-13 2016-05-17 Corning Incorporated Bulk annealing of glass sheets
TWI617437B (en) 2012-12-13 2018-03-11 康寧公司 Facilitated processing for controlling bonding between sheet and carrier
GB201305500D0 (en) * 2013-03-26 2013-05-08 Semblant Ltd Coated electrical assembly
US10510576B2 (en) 2013-10-14 2019-12-17 Corning Incorporated Carrier-bonding methods and articles for semiconductor and interposer processing
CN103701963B (en) * 2013-12-30 2017-05-10 惠州Tcl移动通信有限公司 Waterproof treatment method for mobile terminal and mobile terminal
JP2017518954A (en) 2014-04-09 2017-07-13 コーニング インコーポレイテッド Substrate article modified with device and method of manufacturing the same
CN104320920B (en) * 2014-10-13 2017-05-10 北京卫星制造厂 Electronic product coating method based on low internal stress
US11167532B2 (en) 2015-05-19 2021-11-09 Corning Incorporated Articles and methods for bonding sheets with carriers
GB2557043A (en) * 2015-06-09 2018-06-13 P2I Ltd Coating
GB2539231B (en) * 2015-06-10 2017-08-23 Semblant Ltd Coated electrical assembly
KR102524620B1 (en) 2015-06-26 2023-04-21 코닝 인코포레이티드 Methods and articles including sheets and carriers
GB201601221D0 (en) * 2016-01-22 2016-03-09 Semblant Ltd Coated electrical assembly
JP6750252B2 (en) * 2016-02-29 2020-09-02 日亜化学工業株式会社 Method for manufacturing light emitting device
TW201825623A (en) 2016-08-30 2018-07-16 美商康寧公司 Siloxane plasma polymers for sheet bonding
TWI810161B (en) 2016-08-31 2023-08-01 美商康寧公司 Articles of controllably bonded sheets and methods for making same
GB201621177D0 (en) * 2016-12-13 2017-01-25 Semblant Ltd Protective coating
CN110730995A (en) * 2017-07-03 2020-01-24 阿维科斯公司 Solid electrolyte capacitor comprising a nanocoating
EP3649660A4 (en) 2017-07-03 2021-04-21 AVX Corporation Solid electrolytic capacitor assembly
CN111372772A (en) 2017-08-18 2020-07-03 康宁股份有限公司 Temporary bonding using polycationic polymers
CN107587120B (en) * 2017-08-23 2018-12-18 江苏菲沃泰纳米科技有限公司 A kind of preparation method of the high insulating nano protective coating with modulated structure
CN107686986B (en) * 2017-08-23 2018-12-18 江苏菲沃泰纳米科技有限公司 A kind of preparation method of the organic silicon nano protective coating of modulated structure
US11389825B2 (en) 2017-08-23 2022-07-19 Jiangsu Favored Nanotechnology Co., LTD Methods for preparing nano-protective coating with a modulation structure
CN107587119B (en) * 2017-08-23 2018-11-13 江苏菲沃泰纳米科技有限公司 A kind of preparation method of the high insulating rigid nano protecting coating of composite construction
CN109686672A (en) * 2017-10-18 2019-04-26 上海稷以科技有限公司 The method of protective layer and the product of surface formation matcoveredn are formed in body surface
JP7431160B2 (en) 2017-12-15 2024-02-14 コーニング インコーポレイテッド Methods for processing substrates and manufacturing articles including bonded sheets
CN109686802A (en) * 2018-11-09 2019-04-26 惠州凯珑光电有限公司 A kind of packaging technology of electronic component and mould group
CN110665768B (en) * 2019-07-26 2022-04-26 江苏菲沃泰纳米科技股份有限公司 Waterproof nano film and preparation method, application and product thereof
KR102362271B1 (en) * 2019-10-16 2022-02-14 이정훈 Protective coating composition for circuit boards
WO2021249156A1 (en) * 2020-06-09 2021-12-16 江苏菲沃泰纳米科技股份有限公司 Protective coating and preparation method therefor

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63311793A (en) * 1987-06-12 1988-12-20 Sumitomo Electric Ind Ltd Manufacture of flexible wiring board
JPS6489389A (en) * 1987-09-29 1989-04-03 Sumitomo Electric Industries Manufacture of flexible printed wiring board
JPH06244316A (en) * 1993-02-19 1994-09-02 Sony Corp Semiconductor device, manufacturing method and manufacturing apparatus
FR2726151B1 (en) * 1994-10-25 1996-11-29 Europ Composants Electron METHOD AND DEVICE FOR HERMETIC PROTECTION OF ELECTRONIC CIRCUIT
DE10114897A1 (en) * 2001-03-26 2002-10-24 Infineon Technologies Ag Electronic component
CN1770340A (en) * 2004-11-05 2006-05-10 力毅国际有限公司 Insulation structure of electronic element and forming method thereof
GB0703172D0 (en) * 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
CN105744751B (en) * 2008-08-18 2019-06-18 赛姆布兰特有限公司 Halo-hydrocarbon polymer coating
GB2462824A (en) * 2008-08-18 2010-02-24 Crombie 123 Ltd Printed circuit board encapsulation

Also Published As

Publication number Publication date
BR112012021172A2 (en) 2016-05-17
KR20120129993A (en) 2012-11-28
KR101778820B1 (en) 2017-09-14
CN102791779A (en) 2012-11-21
WO2011104500A1 (en) 2011-09-01
TW201204203A (en) 2012-01-16
EP2539392A1 (en) 2013-01-02
TWI547221B (en) 2016-08-21
JP2013527973A (en) 2013-07-04
JP6085480B2 (en) 2017-02-22
CN106916331A (en) 2017-07-04

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Legal Events

Date Code Title Description
COOA Change in applicant's name or ownership of the application

Owner name: SEMBLANT GLOBAL LIMITED

Free format text: FORMER OWNER: SEMBLANT LIMITED

AT Applications terminated before publication under section 16(1)