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GB1515156A - Transcalent semiconductor device - Google Patents

Transcalent semiconductor device

Info

Publication number
GB1515156A
GB1515156A GB4442475A GB4442475A GB1515156A GB 1515156 A GB1515156 A GB 1515156A GB 4442475 A GB4442475 A GB 4442475A GB 4442475 A GB4442475 A GB 4442475A GB 1515156 A GB1515156 A GB 1515156A
Authority
GB
United Kingdom
Prior art keywords
metal
wafer
semi
transcalent
metal walls
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4442475A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/534,879 external-priority patent/US3946429A/en
Priority claimed from US05/539,850 external-priority patent/US3984861A/en
Application filed by RCA Corp filed Critical RCA Corp
Publication of GB1515156A publication Critical patent/GB1515156A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/0241—Structural association of a fuse and another component or apparatus
    • H01H2085/0283—Structural association with a semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

1515156 Semi-conductor devices RCA CORPORATION 28 Oct 1975 [20 Dec 1974 9 Jan 1975] 44424/75 Heading H1K A semi-conductor device comprises a semiconductor wafer 10 bonded to metal walls 28, 30 of heat pipes 20, 22, the metal walls 28, 30 being 500-1000 microns thick and conforming to the surfaces of the wafer 10 to which they are tightly bonded with a solid metal bond. The device may be a Si thyristor and the metal walls may be Cu, Ag, Mo or W. The wafer 10 may be protected by an annular enclosure formed by cylindrical metal and ceramic parts (54, 56, 58, 60), Fig. 1 (not shown), and the heat pipes 20, 22 may have cooling fins (48, 52).
GB4442475A 1974-12-20 1975-10-28 Transcalent semiconductor device Expired GB1515156A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US05/534,879 US3946429A (en) 1974-12-20 1974-12-20 Self-fusing transcalent electrical device
US05/539,850 US3984861A (en) 1975-01-09 1975-01-09 Transcallent semiconductor device

Publications (1)

Publication Number Publication Date
GB1515156A true GB1515156A (en) 1978-06-21

Family

ID=27064628

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4442475A Expired GB1515156A (en) 1974-12-20 1975-10-28 Transcalent semiconductor device

Country Status (1)

Country Link
GB (1) GB1515156A (en)

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee