GB1319768A - Machine tool for cutting a workpiece - Google Patents
Machine tool for cutting a workpieceInfo
- Publication number
- GB1319768A GB1319768A GB1319768DA GB1319768A GB 1319768 A GB1319768 A GB 1319768A GB 1319768D A GB1319768D A GB 1319768DA GB 1319768 A GB1319768 A GB 1319768A
- Authority
- GB
- United Kingdom
- Prior art keywords
- workpiece
- cutting
- cutter
- block
- blade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
- B24D5/126—Cut-off wheels having an internal cutting edge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Magnetic Bearings And Hydrostatic Bearings (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
1319768 Air bearing CAPLIN ENG CO Ltd 27 Oct 1970 [29 Oct 1969] 53043/69 Heading F2A [Also in Division B3] A machine for cutting wafers from a workpiece, such as a silicon rod 55, comprises a circular saw blade or cutter 32 in the form of an annulus having a cutting surface formed around its inner periphery and secured by a rim to a cutter support member 5 mounted for rotation in a fluid bearing, and a feed mechanism adapted to carry the workpiece and to index the workpiece towards the plane of the blade and to feed the workpiece repeatedly towards and away from the cutting surface. The machine has a bed-plate 2 adjustably carrying a carrier 4 having an internal frusto-conical surface 12 and a horizontal annular surface 13 which are spaced by a small gap from corresponding surfaces 8, 11 on the support member 5, air or other fluid being supplied from an inlet 22 to ports 16, 17 in the surfaces 12, 13, and being vented from an annular space 15 to ports 14. The support may be rotated by a belt engaging a surface 23 on the support which has an L-sectioned member 26 secured thereto for carrying the blade 32 which is clamped between members 28, 29. The feed mechanism consists of an arm 36 coupled by a block 37 to a shaft 38 rockable by a lever 40 and hydraulic motor 41. The block 37 is adjustable about the axis of a pivot 48 mounted on the shaft 38 and in the plane of the cutter, and the arm is rockable about a pivot 42 on the block 37 by a ram 43 moving a tapered block 44 over a pin 46 to disengage the workpiece from the blade during return movement after a cutting operation. The outer end of the arm has a plate 51 formed with arcuate guides 51a along which a plate 52 secured to a carrier for the workpiece is adjustable. The carrier has a vertical feed screw 54 for effecting the indexing movement of a mount 54a carrying the workpiece 55. A suction device 58 is rockable about a horizontal axis to transfer a cut wafer to a discharge point. An emergency air supply is automatically connected to the air bearing in the event of failure of a main supply and a brake may be provided to stop rotation of the cutter support member. The surfaces of the air bearing may be treated to prevent damage thereto should the surfaces contact one another.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB5304369 | 1969-10-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1319768A true GB1319768A (en) | 1973-06-06 |
Family
ID=10466409
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1319768D Expired GB1319768A (en) | 1969-10-29 | 1969-10-29 | Machine tool for cutting a workpiece |
Country Status (4)
Country | Link |
---|---|
CH (1) | CH528340A (en) |
DE (1) | DE2052896C2 (en) |
FR (1) | FR2066707A5 (en) |
GB (1) | GB1319768A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4209005A (en) * | 1977-12-22 | 1980-06-24 | Crouzet | Apparatus for cutting silicon having a pivoted work carriage utilizing an air bearing |
US4420909A (en) * | 1981-11-10 | 1983-12-20 | Silicon Technology Corporation | Wafering system |
US4949700A (en) * | 1987-12-17 | 1990-08-21 | Tokyou Seimitsu Co., Ltd. | Ingot support device in slicing apparatus |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2359096C3 (en) * | 1973-11-27 | 1982-01-28 | Siemens AG, 1000 Berlin und 8000 München | Process for sawing semiconductor wafers with little deflection |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3430318A (en) * | 1967-03-10 | 1969-03-04 | Babcock & Wilcox Co | Machine tools and instruments |
-
1969
- 1969-10-29 GB GB1319768D patent/GB1319768A/en not_active Expired
-
1970
- 1970-10-28 DE DE19702052896 patent/DE2052896C2/en not_active Expired
- 1970-10-29 CH CH1610070A patent/CH528340A/en not_active IP Right Cessation
- 1970-10-29 FR FR7039030A patent/FR2066707A5/fr not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4209005A (en) * | 1977-12-22 | 1980-06-24 | Crouzet | Apparatus for cutting silicon having a pivoted work carriage utilizing an air bearing |
US4420909A (en) * | 1981-11-10 | 1983-12-20 | Silicon Technology Corporation | Wafering system |
US4949700A (en) * | 1987-12-17 | 1990-08-21 | Tokyou Seimitsu Co., Ltd. | Ingot support device in slicing apparatus |
Also Published As
Publication number | Publication date |
---|---|
FR2066707A5 (en) | 1971-08-06 |
DE2052896A1 (en) | 1971-05-06 |
CH528340A (en) | 1972-09-30 |
DE2052896C2 (en) | 1982-02-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |