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GB1385191A - Alloys - Google Patents

Alloys

Info

Publication number
GB1385191A
GB1385191A GB1398571A GB1398571A GB1385191A GB 1385191 A GB1385191 A GB 1385191A GB 1398571 A GB1398571 A GB 1398571A GB 1398571 A GB1398571 A GB 1398571A GB 1385191 A GB1385191 A GB 1385191A
Authority
GB
United Kingdom
Prior art keywords
alloys
weight
brazing
heading
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1398571A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOC Group Ltd
Original Assignee
British Oxigen Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by British Oxigen Ltd filed Critical British Oxigen Ltd
Priority to GB1398571A priority Critical patent/GB1385191A/en
Priority to AU42002/72A priority patent/AU458789B2/en
Publication of GB1385191A publication Critical patent/GB1385191A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/282—Zn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)

Abstract

1385191 Cu-Mn-Zn alloys BRITISH OXYGEN CO Ltd 8 May 1972 [10 May 1971] 13985/71 Heading C7A An alloy, suitable for brazing, soldering or welding, consists, in per cent by weight, of:- and has a weight ratio Cu:Mn of 20:1 to 0.4:1.
GB1398571A 1971-05-10 1971-05-10 Alloys Expired GB1385191A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB1398571A GB1385191A (en) 1971-05-10 1971-05-10 Alloys
AU42002/72A AU458789B2 (en) 1971-05-10 1972-05-08 Alloys

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1398571A GB1385191A (en) 1971-05-10 1971-05-10 Alloys

Publications (1)

Publication Number Publication Date
GB1385191A true GB1385191A (en) 1975-02-26

Family

ID=10032931

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1398571A Expired GB1385191A (en) 1971-05-10 1971-05-10 Alloys

Country Status (2)

Country Link
AU (1) AU458789B2 (en)
GB (1) GB1385191A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3977869A (en) * 1975-08-14 1976-08-31 Eutectic Corporation Indium-containing, low silver copper-base filler metal
EP0058206B1 (en) * 1980-09-01 1985-10-16 Mitsubishi Materials Corporation Cu-ag base alloy brazing filler material
US4587097A (en) * 1984-06-22 1986-05-06 Allied Corporation Homogeneous low melting temperature brazing filler metal for joining ferrous and non-ferrous alloys
GB2168078A (en) * 1984-11-16 1986-06-11 Univ Bradford Brazing alloy
WO1999002299A1 (en) * 1997-07-10 1999-01-21 Euromat Gmbh Solder braze alloy
WO2001034860A1 (en) * 1999-11-08 2001-05-17 Euromat Gesellschaft Für Werkstofftechnologie Und Transfer Mbh Soldering alloy
US7806994B2 (en) 2004-05-04 2010-10-05 S-Bond Technologies, Llc Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3977869A (en) * 1975-08-14 1976-08-31 Eutectic Corporation Indium-containing, low silver copper-base filler metal
EP0058206B1 (en) * 1980-09-01 1985-10-16 Mitsubishi Materials Corporation Cu-ag base alloy brazing filler material
US4587097A (en) * 1984-06-22 1986-05-06 Allied Corporation Homogeneous low melting temperature brazing filler metal for joining ferrous and non-ferrous alloys
GB2168078A (en) * 1984-11-16 1986-06-11 Univ Bradford Brazing alloy
WO1999002299A1 (en) * 1997-07-10 1999-01-21 Euromat Gmbh Solder braze alloy
US6367683B1 (en) 1997-07-10 2002-04-09 Materials Resources International Solder braze alloy
WO2001034860A1 (en) * 1999-11-08 2001-05-17 Euromat Gesellschaft Für Werkstofftechnologie Und Transfer Mbh Soldering alloy
US7806994B2 (en) 2004-05-04 2010-10-05 S-Bond Technologies, Llc Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium

Also Published As

Publication number Publication date
AU458789B2 (en) 1975-03-06
AU4200272A (en) 1973-11-15

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee