GB1293648A - Addition of metal ions to electrolytic plating baths - Google Patents
Addition of metal ions to electrolytic plating bathsInfo
- Publication number
- GB1293648A GB1293648A GB27417/70A GB2741770A GB1293648A GB 1293648 A GB1293648 A GB 1293648A GB 27417/70 A GB27417/70 A GB 27417/70A GB 2741770 A GB2741770 A GB 2741770A GB 1293648 A GB1293648 A GB 1293648A
- Authority
- GB
- United Kingdom
- Prior art keywords
- plating
- cell
- metal ions
- anode
- separated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Automation & Control Theory (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
1293648 Electro-plating AUSTRALIAN IRON & STEEL PTY Ltd 5 June 1970 [6 June 1969] 27417/70 Heading C7B A controlled addition of metal ions to electrolyte used in electro-plating is effected by dissolving electrolytically an anode of the plating metal in a cell containing at least two compartments separated by an ion exchange membrane, and adding the resulting metal ions to the plating electrolyte, the addition taking place independantly of the metal plating process. As shown dissolution cell 5 comprises an anode compartment 9 containing a soluble anode 13 separated by an ionexchange membrane 10 from cathode compartment 8 containing cathode 12 and stirrer 11; the metalion containing anolyte being circulated via pipe 6 to plating cell 3, and exhausted plating electrolyte being returned to the dissolution cell via pipe 7 by means of pump 4. The dissolution cell may be integral of the plating cell, the anode compartment being formed by the main plating bath, separated by an ion-exchange membrane from an appended cathode compartment.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU5611769 | 1969-06-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1293648A true GB1293648A (en) | 1972-10-18 |
Family
ID=3741739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB27417/70A Expired GB1293648A (en) | 1969-06-06 | 1970-06-05 | Addition of metal ions to electrolytic plating baths |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS4825617B1 (en) |
BE (1) | BE751590A (en) |
DE (1) | DE2027793A1 (en) |
FR (1) | FR2049165B1 (en) |
GB (1) | GB1293648A (en) |
ZA (1) | ZA703750B (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997015704A2 (en) * | 1995-10-26 | 1997-05-01 | Lea Ronal Gmbh | Electroplating plant |
EP1029954A1 (en) * | 1998-09-08 | 2000-08-23 | Ebara Corporation | Substrate plating device |
CN101935862A (en) * | 2010-08-17 | 2011-01-05 | 苏州铨笠电镀挂具有限公司 | Cation generating device |
CN101962796A (en) * | 2010-08-17 | 2011-02-02 | 苏州铨笠电镀挂具有限公司 | Method for sustainably complementing metallic cations in plating solution |
US9303329B2 (en) | 2013-11-11 | 2016-04-05 | Tel Nexx, Inc. | Electrochemical deposition apparatus with remote catholyte fluid management |
CN112714803A (en) * | 2018-08-27 | 2021-04-27 | 叶涛 | Plating solution production and regeneration process and device for insoluble anode acid copper electroplating |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51101726U (en) * | 1975-02-13 | 1976-08-16 | ||
DE2713392C2 (en) * | 1977-03-23 | 1981-11-12 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Process for the preparation of metal complex solutions |
GB2058409A (en) * | 1979-09-07 | 1981-04-08 | Nat Res Dev | Controlling ph or ion concentration of a stream |
FR2479856A1 (en) * | 1980-04-04 | 1981-10-09 | Electricite De France | Regeneration of metal plating soln. - using cell contg. anodic membrane and soluble metal anode |
NL8602730A (en) * | 1986-10-30 | 1988-05-16 | Hoogovens Groep Bv | METHOD FOR ELECTROLYTIC TINNING TIN USING AN INSOLUBLE ANODE. |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB310099A (en) * | 1928-01-26 | 1929-04-25 | George Lawton | Electro copper (or other metal similarly deposited) lined hollow drill steel, for goldmining and similar purposes |
FR1522251A (en) * | 1966-12-26 | 1968-04-26 | Plating process with and without electrolysis | |
US3486992A (en) * | 1967-02-15 | 1969-12-30 | Cincinnati Milling Machine Co | Process for electrolytic oxidation of thallium or cerium salts |
-
1970
- 1970-06-03 ZA ZA703750A patent/ZA703750B/en unknown
- 1970-06-05 FR FR7020846A patent/FR2049165B1/fr not_active Expired
- 1970-06-05 JP JP45048374A patent/JPS4825617B1/ja active Pending
- 1970-06-05 DE DE19702027793 patent/DE2027793A1/en active Pending
- 1970-06-05 BE BE751590D patent/BE751590A/en unknown
- 1970-06-05 GB GB27417/70A patent/GB1293648A/en not_active Expired
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997015704A2 (en) * | 1995-10-26 | 1997-05-01 | Lea Ronal Gmbh | Electroplating plant |
WO1997015704A3 (en) * | 1995-10-26 | 1997-07-10 | Lea Ronal Gmbh | Electroplating plant |
EP1029954A1 (en) * | 1998-09-08 | 2000-08-23 | Ebara Corporation | Substrate plating device |
EP1029954A4 (en) * | 1998-09-08 | 2006-07-12 | Ebara Corp | Substrate plating device |
CN101935862A (en) * | 2010-08-17 | 2011-01-05 | 苏州铨笠电镀挂具有限公司 | Cation generating device |
CN101962796A (en) * | 2010-08-17 | 2011-02-02 | 苏州铨笠电镀挂具有限公司 | Method for sustainably complementing metallic cations in plating solution |
US9303329B2 (en) | 2013-11-11 | 2016-04-05 | Tel Nexx, Inc. | Electrochemical deposition apparatus with remote catholyte fluid management |
CN112714803A (en) * | 2018-08-27 | 2021-04-27 | 叶涛 | Plating solution production and regeneration process and device for insoluble anode acid copper electroplating |
Also Published As
Publication number | Publication date |
---|---|
BE751590A (en) | 1970-11-16 |
ZA703750B (en) | 1971-01-27 |
DE2027793A1 (en) | 1970-12-10 |
FR2049165B1 (en) | 1975-01-10 |
JPS4825617B1 (en) | 1973-07-30 |
FR2049165A1 (en) | 1971-03-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |