GB1276675A - Continuous electro-plating apparatus - Google Patents

Abstract

1276675 Electro-plating metal strip MATSUSHITA ELECTRIC INDUSTRIAL CO Ltd 3 June 1969 [4 June 1968(2) 8 May 1969 (5)] 28097/69 Heading C7B A continuous plating apparatus comprises pretreatment baths, a plating bath and at least one after-treatment bath and drying means, with means for feeding the strip through the apparatus linearly in a horizontal direction with the web of the strip vertical. The various bath and drying means are provided with slits for linear passage of the strip and the plating bath has a pair of anode plates, one on each side of the run of the strip, parallel and in facing relationship thereto. In the embodiment described the strip passes through a vapour grease removal bath, an elctrolytic grease removal bath, a water washing bath, a pickling bath, a water washing bath, a plating bath, a water washing bath, a dryer and to a winder. In the electrolytic grease removing bath, Fig. 5, the strip 1 passes through an inner container 20 filled with liquid and having parrallel facing anodes 29 and liquid supply means 22. Liquid overflows from container 20 to an outer container having partitions 26, 26<SP>1</SP> and is removed through ducts 23. The strip passes through a series of aligned slits 27, 27<SP>1</SP>, 25 each having a sealing packing 28, 28<SP>1</SP>, 24. The plating bath, Fig. 10, has a feeding nozzle 36 through which electrolyte enters from pipes 37 to give a flow of electrolyte in the direction of movement of the strip 1. Facing anodes 42 are separated from the strip by perforated insulating plates 43. The electrolyte leaves the bath through drain 40 to a tank in which its ingrediants are replenished and its temperature and pH adjusted for recycling through pipes 37. The winder, Fig. 11 (not shown), is driven through a variable speed gear which also drives a pair of current collector rolls, Fig. 12 (not shown), between which the strip passes. The apparatus can be used for plating with copper, zinc, lead, nickel or tin. In examples plating baths containing (a) high concentrations of nickel sulphate, nickel chloride and boric acid and (b) stannous salphate, sulphuric acid, cresol sulphonic acid, formalin and crythorbic acid or its sodium salt, are referred to.