GB1259212A - - Google Patents
Info
- Publication number
- GB1259212A GB1259212A GB1259212DA GB1259212A GB 1259212 A GB1259212 A GB 1259212A GB 1259212D A GB1259212D A GB 1259212DA GB 1259212 A GB1259212 A GB 1259212A
- Authority
- GB
- United Kingdom
- Prior art keywords
- bore
- pin
- region
- light
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 abstract 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 abstract 1
- 229910052582 BN Inorganic materials 0.000 abstract 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 abstract 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 abstract 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 abstract 1
- 238000005553 drilling Methods 0.000 abstract 1
- 238000005401 electroluminescence Methods 0.000 abstract 1
- 238000010894 electron beam technology Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 230000000873 masking effect Effects 0.000 abstract 1
- 238000012986 modification Methods 0.000 abstract 1
- 230000004048 modification Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 239000012780 transparent material Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Led Devices (AREA)
- Light Receiving Elements (AREA)
Abstract
1,259,212. Electroluminescence. INTERNATIONAL BUSINESS MACHINES CORP. 30 June, 1969 [1 July, 1968], No. 32969/69. Heading C4S. [Also in Division H1] Electrical contact to a region of one conductivity type defining an electro-optically active junction in a body of the opposite conductivity type is achieved by means of a pin mounted in a bore passing into the region from a planar face of the body, the pin extending out of the body at the face. The device may be a photovoltaic detector or a photo-emissive diode or laser. The light emission or reception occurs at a second planar face so that the light path is not blocked by the contact to the region. An N-type body 23<SP>1</SP> contains an array of devices 22 each comprising a P-type region 27 contacted by a pin 28 which is a tight fit in a bore 25 to provide a pressure contact, Fig. 5. In modifications the pin extends to the top surface of the wafer where it is provided with a head of such dimensions that the light path is not blocked, Fig. 6 (not shown), a headed pin is soldered into the bore, Fig. 7 (not shown), and a wire is soldered in the bore, Fig. 8 (not shown). The PN junction shape may be inverted relative to that shown or may comprise a straight cylinder, Fig. 17 (not shown), and the bore may extend halfway only through the body, Figs. 9b and d (not shown). If the pin is provided with a head this may be of transparent material. The junction may be so arranged that the light is emitted from the edge of the body, Fig. 18 (not shown). The devices are made by forming the bore in the body by masking and etching or by electron beam drilling, and then photomasking and diffusing to form the region surrounding the bore. The starting body may comprise an epitaxial layer on a substrate of the same conductivity type. The surface through which the light passes may be lapped or polished to improve the light transmission and the face through which the contact pins extend may be coated with an opaque material such as beryllium oxide or boron nitride. The semi-conductor material may be GaAs, or GaAlAs utilizing Te and Zn as the N- and P-type impurities.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US74156168A | 1968-07-01 | 1968-07-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1259212A true GB1259212A (en) | 1972-01-05 |
Family
ID=24981226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1259212D Expired GB1259212A (en) | 1968-07-01 | 1969-06-30 |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE1932065A1 (en) |
FR (1) | FR2012024A1 (en) |
GB (1) | GB1259212A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2197984A (en) * | 1986-11-21 | 1988-06-02 | Marconi Co Ltd | Cadmium mercury telluride photodiode |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2102590A5 (en) * | 1970-08-11 | 1972-04-07 | Radiotechnique Compelec | |
FR2523369B1 (en) * | 1982-03-12 | 1985-11-29 | Telecommunications Sa | MATRIX INFRARED DETECTOR |
GB2203894B (en) * | 1987-03-03 | 1990-11-21 | Fumio Inaba | Surface emission type semiconductor light-emitting device |
-
1969
- 1969-06-04 FR FR6918093A patent/FR2012024A1/fr not_active Withdrawn
- 1969-06-25 DE DE19691932065 patent/DE1932065A1/en active Pending
- 1969-06-30 GB GB1259212D patent/GB1259212A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2197984A (en) * | 1986-11-21 | 1988-06-02 | Marconi Co Ltd | Cadmium mercury telluride photodiode |
GB2197984B (en) * | 1986-11-21 | 1991-02-20 | Marconi Co Ltd | Cadmium mercury telluride photodiode |
Also Published As
Publication number | Publication date |
---|---|
FR2012024A1 (en) | 1970-03-13 |
DE1932065A1 (en) | 1970-01-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |