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GB1241169A - Improvements relating to printed circuits - Google Patents

Improvements relating to printed circuits

Info

Publication number
GB1241169A
GB1241169A GB4301667A GB4301667A GB1241169A GB 1241169 A GB1241169 A GB 1241169A GB 4301667 A GB4301667 A GB 4301667A GB 4301667 A GB4301667 A GB 4301667A GB 1241169 A GB1241169 A GB 1241169A
Authority
GB
United Kingdom
Prior art keywords
region
layers
etched
exist
areas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4301667A
Inventor
James Bond
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Allard Way Holdings Ltd
Original Assignee
Elliott Brothers London Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elliott Brothers London Ltd filed Critical Elliott Brothers London Ltd
Priority to GB4301667A priority Critical patent/GB1241169A/en
Publication of GB1241169A publication Critical patent/GB1241169A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09109—Locally detached layers, e.g. in multilayer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

1,241,169. Printed circuits. ELLIOTT BROS. (LONDON) Ltd. 13 Sept., 1968 [21 Sept., 1967], No. 43016/67. Heading H1R. In order to satisfactorily bend a flexible printed circuit comprising at least three superimposed layers the layers of material in the region of the bend are formed such that when the printed circuit is bent no layers overlap at any point along the apex of the bend. A multilayer printed circuit comprising four superimposed alternate layers of insulating material 3, 5 and nickel 2, 4 is bent in the region 6. In accordance with the invention nickel conductors of layer 2 are etched so that only areas 7 exist in region 6, layer 3 is etched so that only areas 8 exist in region 6, nickel conductors of layer 4 are etched so that only areas 9 exist in region 6 and layer 5 is etched so that only areas 10 exist in region 6. The printed circuit is then bent along region 6 whereby no layers overlap along the apex of the bend the layers of insulating material being of such area at region 6 to have sufficient strength to control any resilience of the insulating material in the region.
GB4301667A 1967-09-21 1967-09-21 Improvements relating to printed circuits Expired GB1241169A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4301667A GB1241169A (en) 1967-09-21 1967-09-21 Improvements relating to printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4301667A GB1241169A (en) 1967-09-21 1967-09-21 Improvements relating to printed circuits

Publications (1)

Publication Number Publication Date
GB1241169A true GB1241169A (en) 1971-07-28

Family

ID=10426965

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4301667A Expired GB1241169A (en) 1967-09-21 1967-09-21 Improvements relating to printed circuits

Country Status (1)

Country Link
GB (1) GB1241169A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3302993A1 (en) * 1982-01-30 1983-08-11 Nippon Mektron, Ltd., Tokyo FLEXIBLE CIRCUIT BOARD OR TRAIN
DE3405804A1 (en) * 1984-02-17 1985-08-22 Siemens AG, 1000 Berlin und 8000 München Film wiring for electrical engineering apparatuses, especially for electrical information technology
US4716259A (en) * 1985-02-01 1987-12-29 Canon Kabushiki Kaisha Both-side flexible printed circuit board
DE3723413A1 (en) * 1987-07-15 1989-01-26 Leitron Leiterplatten METHOD FOR PRODUCING PRINTED CIRCUITS
DE3925157A1 (en) * 1989-07-28 1991-02-07 Siemens Ag CONNECTORS FOR PCB
GB2263817A (en) * 1992-01-29 1993-08-04 Mecanismos Aux Ind Process for the production of service boxes for vehicles
EP1009080A1 (en) * 1998-12-02 2000-06-14 Framatome Connectors International A bent multilayer arrangement for conductor rails

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3302993A1 (en) * 1982-01-30 1983-08-11 Nippon Mektron, Ltd., Tokyo FLEXIBLE CIRCUIT BOARD OR TRAIN
DE3405804A1 (en) * 1984-02-17 1985-08-22 Siemens AG, 1000 Berlin und 8000 München Film wiring for electrical engineering apparatuses, especially for electrical information technology
US4716259A (en) * 1985-02-01 1987-12-29 Canon Kabushiki Kaisha Both-side flexible printed circuit board
DE3723413A1 (en) * 1987-07-15 1989-01-26 Leitron Leiterplatten METHOD FOR PRODUCING PRINTED CIRCUITS
DE3925157A1 (en) * 1989-07-28 1991-02-07 Siemens Ag CONNECTORS FOR PCB
GB2263817A (en) * 1992-01-29 1993-08-04 Mecanismos Aux Ind Process for the production of service boxes for vehicles
GB2263817B (en) * 1992-01-29 1995-08-23 Mecanismos Aux Ind Improved process for the production of service boxes
EP1009080A1 (en) * 1998-12-02 2000-06-14 Framatome Connectors International A bent multilayer arrangement for conductor rails

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