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GB1129608A - Wiping contact - Google Patents

Wiping contact

Info

Publication number
GB1129608A
GB1129608A GB52244/65A GB5224465A GB1129608A GB 1129608 A GB1129608 A GB 1129608A GB 52244/65 A GB52244/65 A GB 52244/65A GB 5224465 A GB5224465 A GB 5224465A GB 1129608 A GB1129608 A GB 1129608A
Authority
GB
United Kingdom
Prior art keywords
contact
plug
aperture
dec
mated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB52244/65A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FCI USA LLC
Original Assignee
Burndy Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burndy Corp filed Critical Burndy Corp
Publication of GB1129608A publication Critical patent/GB1129608A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/26—Pin or blade contacts for sliding co-operation on one side only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/28—Contacts for sliding cooperation with identically-shaped contact, e.g. for hermaphroditic coupling devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/42—Securing in a demountable manner
    • H01R13/428—Securing in a demountable manner by resilient locking means on the contact members; by locking means on resilient contact members
    • H01R13/432—Securing in a demountable manner by resilient locking means on the contact members; by locking means on resilient contact members by stamped-out resilient tongue snapping behind shoulder in base or case

Landscapes

  • Connector Housings Or Holding Contact Members (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

1,129,608. Two-part couplings. BURNDY CORP. 9 Dec., 1965 [16 Dec., 1964], No. 52244/65. Heading H2E. In an electrical connectors in which an array of plug-shaped portions 50 extends from an insulating base 44, slots in the sides of the plug portions each house a blade contact 10, having a pair ofoppositely-directed resilient. retaining tongues 21 and 14 which, when the contact is passed through an aperture 42 in the base, engage opposed walls 56, 52 of a recess 46 in the plug portion. Each contact may be formed from a slotted sheet metal strip folded to produce two parallel parts (10a and 10b), Figs. 1 and 2 (not shown), movement of the part (10a) being limited by embracing arms (22) and a backstop (20) extending from the part (10b). Ears (24, 24a) are crimped to the bared end (30) of a conductor (32) and around its insulation. The contact can be released by disengaging the tongues from the recesses with tools inserted in an aperture 58 in the top of the plug or in the aperture 42. The connector can be mated with, and bolted to, a similar unit, flanges on the connector bases abutting to enclose the mated contacts.
GB52244/65A 1964-12-16 1965-12-09 Wiping contact Expired GB1129608A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US418749A US3337838A (en) 1964-12-16 1964-12-16 Wiping contact

Publications (1)

Publication Number Publication Date
GB1129608A true GB1129608A (en) 1968-10-09

Family

ID=23659428

Family Applications (1)

Application Number Title Priority Date Filing Date
GB52244/65A Expired GB1129608A (en) 1964-12-16 1965-12-09 Wiping contact

Country Status (5)

Country Link
US (1) US3337838A (en)
BE (1) BE673642A (en)
FR (1) FR1457947A (en)
GB (1) GB1129608A (en)
NL (1) NL151852B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995024747A1 (en) * 1994-03-11 1995-09-14 The Panda Project Semiconductor chip affording a high-density external interface
WO1995024748A1 (en) * 1994-03-11 1995-09-14 Crane Stanford W Jr High-density electrical interconnect system
US5575688A (en) * 1992-12-01 1996-11-19 Crane, Jr.; Stanford W. High-density electrical interconnect system
US5634821A (en) * 1992-12-01 1997-06-03 Crane, Jr.; Stanford W. High-density electrical interconnect system
US5812797A (en) * 1994-03-11 1998-09-22 The Panda Project Computer having a high density connector system

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5035375Y1 (en) * 1969-10-07 1975-10-15
US3697926A (en) * 1970-07-23 1972-10-10 Molex Products Co Plural circuit board connecting arrangement and terminal therefor
US5308258A (en) * 1993-01-29 1994-05-03 International Business Machines Corporation Planar modular interconnect system
US5330372A (en) * 1993-05-13 1994-07-19 Minnesota Mining And Manufacturing Company High-density connector
US5821457A (en) * 1994-03-11 1998-10-13 The Panda Project Semiconductor die carrier having a dielectric epoxy between adjacent leads
US5824950A (en) * 1994-03-11 1998-10-20 The Panda Project Low profile semiconductor die carrier
US5543586A (en) * 1994-03-11 1996-08-06 The Panda Project Apparatus having inner layers supporting surface-mount components
US6339191B1 (en) * 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US5576931A (en) * 1994-05-03 1996-11-19 The Panda Project Computer with two fans and two air circulation areas
US6247972B1 (en) 1997-08-14 2001-06-19 Silicon Bandwidth, Inc. Electrical connector assembly with a female electrical connector having internal flexible contact arm
US6078102A (en) * 1998-03-03 2000-06-20 Silicon Bandwidth, Inc. Semiconductor die package for mounting in horizontal and upright configurations
US6141869A (en) 1998-10-26 2000-11-07 Silicon Bandwidth, Inc. Apparatus for and method of manufacturing a semiconductor die carrier
US7333699B2 (en) * 2005-12-12 2008-02-19 Raytheon Sarcos, Llc Ultra-high density connector
US7626123B2 (en) * 2005-12-12 2009-12-01 Raytheon Sarcos, Llc Electrical microfilament to circuit interface
US7603153B2 (en) * 2005-12-12 2009-10-13 Sterling Investments Lc Multi-element probe array
US8057240B2 (en) * 2010-03-23 2011-11-15 Tyco Electronics Corporation Circuit board for an electrical connector assembly
USD727268S1 (en) 2012-04-13 2015-04-21 Fci Americas Technology Llc Vertical electrical connector
USD718253S1 (en) 2012-04-13 2014-11-25 Fci Americas Technology Llc Electrical cable connector
US9257778B2 (en) 2012-04-13 2016-02-09 Fci Americas Technology High speed electrical connector
CN114175410B (en) * 2019-07-25 2024-05-31 富加宜（美国）有限责任公司 Safe, stable and compact connector

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2384273A (en) * 1939-08-09 1945-09-04 H A Douglas Mfg Co Electrical connection means
US2457703A (en) * 1946-11-23 1948-12-28 Gen Railway Signal Co Plugboard arrangement
US2691147A (en) * 1951-04-02 1954-10-05 Gen Electric Terminal block
NL97384C (en) * 1958-02-14
NL249711A (en) * 1959-03-23
US3160459A (en) * 1961-02-17 1964-12-08 Burndy Corp Connector for printed circuit boards

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5967850A (en) * 1992-12-01 1999-10-19 Crane, Jr.; Stanford W. High-density electrical interconnect system
US6203347B1 (en) 1992-12-01 2001-03-20 Silicon Bandwidth Inc. High-density electrical interconnect system
US5951320A (en) * 1992-12-01 1999-09-14 Crane, Jr.; Stanford W. Electrical interconnect system with wire receiving portion
US5575688A (en) * 1992-12-01 1996-11-19 Crane, Jr.; Stanford W. High-density electrical interconnect system
US5634821A (en) * 1992-12-01 1997-06-03 Crane, Jr.; Stanford W. High-density electrical interconnect system
US5641309A (en) * 1992-12-01 1997-06-24 Crane, Jr.; Stanford W. High-density electrical interconnect system
US6554651B2 (en) 1992-12-01 2003-04-29 Stanford W. Crane, Jr. High-density electrical interconnect system
US6097086A (en) * 1994-03-11 2000-08-01 Silicon Bandwidth, Inc. Semiconductor chip carrier including an interconnect component interface
US7803020B2 (en) 1994-03-11 2010-09-28 Crane Jr Stanford W Backplane system having high-density electrical connectors
US7103753B2 (en) 1994-03-11 2006-09-05 Silicon Bandwith Inc. Backplane system having high-density electrical connectors
US5812797A (en) * 1994-03-11 1998-09-22 The Panda Project Computer having a high density connector system
US6073229A (en) * 1994-03-11 2000-06-06 The Panda Project Computer system having a modular architecture
WO1995024747A1 (en) * 1994-03-11 1995-09-14 The Panda Project Semiconductor chip affording a high-density external interface
WO1995024748A1 (en) * 1994-03-11 1995-09-14 Crane Stanford W Jr High-density electrical interconnect system
US6577003B1 (en) 1994-03-11 2003-06-10 Silicon Bandwidth, Inc. Semiconductor chip carrier affording a high-density external interface
US6574726B2 (en) 1994-03-11 2003-06-03 Silicon Bandwidth, Inc. Modular architecture for high bandwidth computers
US5696027A (en) * 1994-03-11 1997-12-09 The Panda Project Method of manufacturing a semiconductor chip carrier affording a high-density external interface
US5541449A (en) * 1994-03-11 1996-07-30 The Panda Project Semiconductor chip carrier affording a high-density external interface
US7183646B2 (en) 1994-03-11 2007-02-27 Silicon Bandwidth, Inc. Semiconductor chip carrier affording a high-density external interface
US5892280A (en) * 1994-03-11 1999-04-06 Crane, Jr.; Stanford W. Semiconductor chip carrier affording a high-density external interface

Also Published As

Publication number Publication date
BE673642A (en) 1966-06-13
US3337838A (en) 1967-08-22
DE1515526A1 (en) 1969-11-13
NL6516153A (en) 1966-06-17
FR1457947A (en) 1966-11-04
DE1515526B2 (en) 1972-06-15
NL151852B (en) 1976-12-15

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