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GB1105068A - Improvements in or relating to printed circuits - Google Patents

Improvements in or relating to printed circuits

Info

Publication number
GB1105068A
GB1105068A GB4533965A GB4533965A GB1105068A GB 1105068 A GB1105068 A GB 1105068A GB 4533965 A GB4533965 A GB 4533965A GB 4533965 A GB4533965 A GB 4533965A GB 1105068 A GB1105068 A GB 1105068A
Authority
GB
United Kingdom
Prior art keywords
board
baseboard
wiring
interconnection
oct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4533965A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB1105068A publication Critical patent/GB1105068A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/092—Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

1,105,068. Printed circuits. HITACHI SEISAKUSHO-KABUSHIKI KAISHA. 26 Oct., 1965 [31 Oct., 1964], No. 45339/65. Heading H1R. A multi-layer printed-circuit board, Fig. 3, comprises a baseboard N of metal such as iron, the surfaces of which are covered with a film Co of metal of high electrical and thermal conductivity, e.g. copper, gold, to provide a good ground layer and to improve heat dissipation from the board. Alternate layers of insulation I1, I1a, I2, I2a and conductive wiring C1, C1a, C2, C2a are deposited as by evaporation or screening on both sides of the baseboard. A hole H drilled through the baseboard provides for interconnection between wiring on different sides of the board, and for connection to the ground layer Co, insulation I1 &c., being omitted where such connection is desired; interconnection between wiring at different levels on the same side of the board may be similarly effected. Thin film components such as resistors and capacitors may be deposited where required. To improve heat dissipation, the edges of the baseboard N, and even a portion of its major surfaces near a connector edge, may be kept free from an insulating coating (Figs. 7a, 7b, not shown) and channels for the passage of cooling fluid may be formed in the board parallel to its major surfaces (Fig. 7c, not shown).
GB4533965A 1964-10-31 1965-10-26 Improvements in or relating to printed circuits Expired GB1105068A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6170364 1964-10-31

Publications (1)

Publication Number Publication Date
GB1105068A true GB1105068A (en) 1968-03-06

Family

ID=13178851

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4533965A Expired GB1105068A (en) 1964-10-31 1965-10-26 Improvements in or relating to printed circuits

Country Status (1)

Country Link
GB (1) GB1105068A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3573557A (en) * 1970-02-06 1971-04-06 Us Army Printed circuit provided with cooling means
US3739469A (en) * 1971-12-27 1973-06-19 Ibm Multilayer printed circuit board and method of manufacture
US4170819A (en) * 1978-04-10 1979-10-16 International Business Machines Corporation Method of making conductive via holes in printed circuit boards
EP0057842A2 (en) * 1981-02-09 1982-08-18 The Boeing Company Printing wiring board substrates for ceramic chip carriers
US4495378A (en) * 1980-09-22 1985-01-22 Siemens Aktiengesellschaft Heat-removing circuit boards
US4791248A (en) * 1987-01-22 1988-12-13 The Boeing Company Printed wire circuit board and its method of manufacture
EP0385258A2 (en) * 1989-02-28 1990-09-05 Hans Havenith Circuitry cancelling potential differences and for signal linearisation
US5067047A (en) * 1990-05-11 1991-11-19 At&T Bell Laboratories Circuit pack with inboard jet cooling
US5142441A (en) * 1988-02-25 1992-08-25 Alcatel N.V. Circuit board with cooling device
US5268812A (en) * 1991-08-26 1993-12-07 Sun Microsystems, Inc. Cooling multi-chip modules using embedded heat pipes
US5754403A (en) * 1989-09-29 1998-05-19 Texas Instruments Incorporated Constraining core for surface mount technology
US6529377B1 (en) * 2001-09-05 2003-03-04 Microelectronic & Computer Technology Corporation Integrated cooling system

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3573557A (en) * 1970-02-06 1971-04-06 Us Army Printed circuit provided with cooling means
US3739469A (en) * 1971-12-27 1973-06-19 Ibm Multilayer printed circuit board and method of manufacture
DE2261120A1 (en) * 1971-12-27 1973-07-12 Ibm LAMINATED CIRCUIT CARDS MADE FROM SEVERAL INSULATION PLATES PRINTED WITH CIRCUIT PATTERNS
US4170819A (en) * 1978-04-10 1979-10-16 International Business Machines Corporation Method of making conductive via holes in printed circuit boards
US4495378A (en) * 1980-09-22 1985-01-22 Siemens Aktiengesellschaft Heat-removing circuit boards
EP0057842A2 (en) * 1981-02-09 1982-08-18 The Boeing Company Printing wiring board substrates for ceramic chip carriers
EP0057842A3 (en) * 1981-02-09 1984-03-21 The Boeing Company Printing wiring board substrates for ceramic chip carriers
US4791248A (en) * 1987-01-22 1988-12-13 The Boeing Company Printed wire circuit board and its method of manufacture
US5142441A (en) * 1988-02-25 1992-08-25 Alcatel N.V. Circuit board with cooling device
EP0385258A2 (en) * 1989-02-28 1990-09-05 Hans Havenith Circuitry cancelling potential differences and for signal linearisation
EP0385258A3 (en) * 1989-02-28 1992-07-08 Hans Havenith Circuitry cancelling potential differences and for signal linearisation
US5754403A (en) * 1989-09-29 1998-05-19 Texas Instruments Incorporated Constraining core for surface mount technology
US5067047A (en) * 1990-05-11 1991-11-19 At&T Bell Laboratories Circuit pack with inboard jet cooling
US5268812A (en) * 1991-08-26 1993-12-07 Sun Microsystems, Inc. Cooling multi-chip modules using embedded heat pipes
US6529377B1 (en) * 2001-09-05 2003-03-04 Microelectronic & Computer Technology Corporation Integrated cooling system
USRE40618E1 (en) 2001-09-05 2009-01-06 Stovokor Technology Llc Integrated cooling system

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