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GB0505680D0 - Apparatus and method for increased device lifetime in an organic electro-luminescent device - Google Patents

Apparatus and method for increased device lifetime in an organic electro-luminescent device

Info

Publication number
GB0505680D0
GB0505680D0 GBGB0505680.9A GB0505680A GB0505680D0 GB 0505680 D0 GB0505680 D0 GB 0505680D0 GB 0505680 A GB0505680 A GB 0505680A GB 0505680 D0 GB0505680 D0 GB 0505680D0
Authority
GB
United Kingdom
Prior art keywords
organic electro
increased
lifetime
luminescent device
luminescent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0505680.9A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cambridge Display Technology Ltd
Original Assignee
Cambridge Display Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cambridge Display Technology Ltd filed Critical Cambridge Display Technology Ltd
Priority to GBGB0505680.9A priority Critical patent/GB0505680D0/en
Publication of GB0505680D0 publication Critical patent/GB0505680D0/en
Priority to GB0718945A priority patent/GB2438800B8/en
Priority to PCT/GB2006/000968 priority patent/WO2006100444A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
GBGB0505680.9A 2005-03-22 2005-03-22 Apparatus and method for increased device lifetime in an organic electro-luminescent device Ceased GB0505680D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GBGB0505680.9A GB0505680D0 (en) 2005-03-22 2005-03-22 Apparatus and method for increased device lifetime in an organic electro-luminescent device
GB0718945A GB2438800B8 (en) 2005-03-22 2006-03-17 Apparatus and method for increased device lifetimein an organic electroluminescent device.
PCT/GB2006/000968 WO2006100444A1 (en) 2005-03-22 2006-03-17 Apparatus and method for increased device lifetime in an organic electro-luminescent device.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0505680.9A GB0505680D0 (en) 2005-03-22 2005-03-22 Apparatus and method for increased device lifetime in an organic electro-luminescent device

Publications (1)

Publication Number Publication Date
GB0505680D0 true GB0505680D0 (en) 2005-04-27

Family

ID=34531536

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB0505680.9A Ceased GB0505680D0 (en) 2005-03-22 2005-03-22 Apparatus and method for increased device lifetime in an organic electro-luminescent device
GB0718945A Expired - Fee Related GB2438800B8 (en) 2005-03-22 2006-03-17 Apparatus and method for increased device lifetimein an organic electroluminescent device.

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB0718945A Expired - Fee Related GB2438800B8 (en) 2005-03-22 2006-03-17 Apparatus and method for increased device lifetimein an organic electroluminescent device.

Country Status (2)

Country Link
GB (2) GB0505680D0 (en)
WO (1) WO2006100444A1 (en)

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US7109092B2 (en) 2003-05-19 2006-09-19 Ziptronix, Inc. Method of room temperature covalent bonding
US7485968B2 (en) 2005-08-11 2009-02-03 Ziptronix, Inc. 3D IC method and device
DE102006061943B4 (en) * 2006-12-29 2023-03-30 Pictiva Displays International Limited Light Emitting Device
US8830695B2 (en) 2007-01-25 2014-09-09 Osram Opto Semiconductors Gmbh Encapsulated electronic device
US8735219B2 (en) 2012-08-30 2014-05-27 Ziptronix, Inc. Heterogeneous annealing method and device
US20150262902A1 (en) 2014-03-12 2015-09-17 Invensas Corporation Integrated circuits protected by substrates with cavities, and methods of manufacture
US11069734B2 (en) 2014-12-11 2021-07-20 Invensas Corporation Image sensor device
CN104979373A (en) * 2015-05-26 2015-10-14 京东方科技集团股份有限公司 Substrate for display and display device
US9741620B2 (en) 2015-06-24 2017-08-22 Invensas Corporation Structures and methods for reliable packages
US9953941B2 (en) 2015-08-25 2018-04-24 Invensas Bonding Technologies, Inc. Conductive barrier direct hybrid bonding
US9852988B2 (en) 2015-12-18 2017-12-26 Invensas Bonding Technologies, Inc. Increased contact alignment tolerance for direct bonding
US10446532B2 (en) 2016-01-13 2019-10-15 Invensas Bonding Technologies, Inc. Systems and methods for efficient transfer of semiconductor elements
US10204893B2 (en) 2016-05-19 2019-02-12 Invensas Bonding Technologies, Inc. Stacked dies and methods for forming bonded structures
US10446487B2 (en) 2016-09-30 2019-10-15 Invensas Bonding Technologies, Inc. Interface structures and methods for forming same
US10580735B2 (en) 2016-10-07 2020-03-03 Xcelsis Corporation Stacked IC structure with system level wiring on multiple sides of the IC die
US10002844B1 (en) 2016-12-21 2018-06-19 Invensas Bonding Technologies, Inc. Bonded structures
TWI782939B (en) 2016-12-29 2022-11-11 美商英帆薩斯邦德科技有限公司 Bonded structures with integrated passive component
CN106784381B (en) * 2016-12-30 2019-04-19 固安翌光科技有限公司 A kind of encapsulating structure and the OLED device using encapsulating structure encapsulation
JP7030825B2 (en) 2017-02-09 2022-03-07 インヴェンサス ボンディング テクノロジーズ インコーポレイテッド Joined structure
US10629577B2 (en) 2017-03-16 2020-04-21 Invensas Corporation Direct-bonded LED arrays and applications
US10508030B2 (en) 2017-03-21 2019-12-17 Invensas Bonding Technologies, Inc. Seal for microelectronic assembly
US10784191B2 (en) 2017-03-31 2020-09-22 Invensas Bonding Technologies, Inc. Interface structures and methods for forming same
US10879212B2 (en) 2017-05-11 2020-12-29 Invensas Bonding Technologies, Inc. Processed stacked dies
US10217720B2 (en) 2017-06-15 2019-02-26 Invensas Corporation Multi-chip modules formed using wafer-level processing of a reconstitute wafer
US10840205B2 (en) 2017-09-24 2020-11-17 Invensas Bonding Technologies, Inc. Chemical mechanical polishing for hybrid bonding
US11380597B2 (en) * 2017-12-22 2022-07-05 Invensas Bonding Technologies, Inc. Bonded structures
US10923408B2 (en) 2017-12-22 2021-02-16 Invensas Bonding Technologies, Inc. Cavity packages
US11169326B2 (en) 2018-02-26 2021-11-09 Invensas Bonding Technologies, Inc. Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
US11056348B2 (en) 2018-04-05 2021-07-06 Invensas Bonding Technologies, Inc. Bonding surfaces for microelectronics
US11004757B2 (en) 2018-05-14 2021-05-11 Invensas Bonding Technologies, Inc. Bonded structures
US11276676B2 (en) 2018-05-15 2022-03-15 Invensas Bonding Technologies, Inc. Stacked devices and methods of fabrication
CN112585740A (en) 2018-06-13 2021-03-30 伊文萨思粘合技术公司 TSV as a pad
US11393779B2 (en) 2018-06-13 2022-07-19 Invensas Bonding Technologies, Inc. Large metal pads over TSV
WO2020010056A1 (en) 2018-07-03 2020-01-09 Invensas Bonding Technologies, Inc. Techniques for joining dissimilar materials in microelectronics
US11462419B2 (en) 2018-07-06 2022-10-04 Invensas Bonding Technologies, Inc. Microelectronic assemblies
US11158606B2 (en) 2018-07-06 2021-10-26 Invensas Bonding Technologies, Inc. Molded direct bonded and interconnected stack
US11515291B2 (en) 2018-08-28 2022-11-29 Adeia Semiconductor Inc. Integrated voltage regulator and passive components
US11011494B2 (en) 2018-08-31 2021-05-18 Invensas Bonding Technologies, Inc. Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics
US11158573B2 (en) 2018-10-22 2021-10-26 Invensas Bonding Technologies, Inc. Interconnect structures
WO2020150159A1 (en) 2019-01-14 2020-07-23 Invensas Bonding Technologies, Inc. Bonded structures
US11901281B2 (en) 2019-03-11 2024-02-13 Adeia Semiconductor Bonding Technologies Inc. Bonded structures with integrated passive component
US11296053B2 (en) 2019-06-26 2022-04-05 Invensas Bonding Technologies, Inc. Direct bonded stack structures for increased reliability and improved yield in microelectronics
CN110429206B (en) * 2019-08-07 2021-11-23 京东方科技集团股份有限公司 Packaging cover plate, display device, display panel and packaging method of display panel
US12080672B2 (en) 2019-09-26 2024-09-03 Adeia Semiconductor Bonding Technologies Inc. Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive
CN111048686A (en) * 2019-11-19 2020-04-21 Tcl华星光电技术有限公司 Display device and packaging method adopting same
US11762200B2 (en) 2019-12-17 2023-09-19 Adeia Semiconductor Bonding Technologies Inc. Bonded optical devices
WO2021188846A1 (en) 2020-03-19 2021-09-23 Invensas Bonding Technologies, Inc. Dimension compensation control for directly bonded structures
US11631647B2 (en) 2020-06-30 2023-04-18 Adeia Semiconductor Bonding Technologies Inc. Integrated device packages with integrated device die and dummy element
US11728273B2 (en) 2020-09-04 2023-08-15 Adeia Semiconductor Bonding Technologies Inc. Bonded structure with interconnect structure
US11764177B2 (en) 2020-09-04 2023-09-19 Adeia Semiconductor Bonding Technologies Inc. Bonded structure with interconnect structure
US11264357B1 (en) 2020-10-20 2022-03-01 Invensas Corporation Mixed exposure for large die

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WO1999035681A1 (en) * 1998-01-07 1999-07-15 Fed Corporation Assembly for and method of packaging integrated display devices
US6081071A (en) * 1998-05-18 2000-06-27 Motorola, Inc. Electroluminescent apparatus and methods of manufacturing and encapsulating
US6888307B2 (en) * 2001-08-21 2005-05-03 Universal Display Corporation Patterned oxygen and moisture absorber for organic optoelectronic device structures
TWI299632B (en) * 2001-09-28 2008-08-01 Sanyo Electric Co
JP3977669B2 (en) * 2002-03-07 2007-09-19 双葉電子工業株式会社 Organic EL device
US6998648B2 (en) * 2003-08-25 2006-02-14 Universal Display Corporation Protected organic electronic device structures incorporating pressure sensitive adhesive and desiccant
JP4534064B2 (en) * 2003-08-27 2010-09-01 奇美電子股▲ふん▼有限公司 Manufacturing method of organic EL display

Also Published As

Publication number Publication date
GB0718945D0 (en) 2007-11-07
GB2438800B (en) 2010-09-22
GB2438800A8 (en) 2011-01-26
GB2438800B8 (en) 2011-01-26
GB2438800A (en) 2007-12-05
WO2006100444A1 (en) 2006-09-28

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)