FR3109466B1 - Dispositif de support d’une puce électronique et procédé de fabrication correspondant - Google Patents
Dispositif de support d’une puce électronique et procédé de fabrication correspondant Download PDFInfo
- Publication number
- FR3109466B1 FR3109466B1 FR2003845A FR2003845A FR3109466B1 FR 3109466 B1 FR3109466 B1 FR 3109466B1 FR 2003845 A FR2003845 A FR 2003845A FR 2003845 A FR2003845 A FR 2003845A FR 3109466 B1 FR3109466 B1 FR 3109466B1
- Authority
- FR
- France
- Prior art keywords
- electronic chip
- supporting
- mounting face
- support substrate
- corresponding manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 6
- 239000003292 glue Substances 0.000 abstract 1
- 230000000284 resting effect Effects 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Die Bonding (AREA)
- Led Device Packages (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Dispositif électronique (DIS) comprenant un substrat de support (SS) comportant une face de montage (FM) et une puce électronique (PE) comportant une face arrière (FAR) collée sur la face de montage (FM) par un volume de colle (C), dans lequel le substrat de support (SS) comprend une pluralité d’éléments de calage (EC1A) faisant saillie sur la face de montage (FM) de façon à maintenir la puce en appui sur des zones de contact des éléments de calage (EC1A) dans une position parallèle à la face de montage (FM) du substrat de support (SS). Figure pour l’abrégé : Fig 1A
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR2003845A FR3109466B1 (fr) | 2020-04-16 | 2020-04-16 | Dispositif de support d’une puce électronique et procédé de fabrication correspondant |
US17/229,710 US11916353B2 (en) | 2020-04-16 | 2021-04-13 | Electronic chip support device and corresponding manufacturing method |
US18/408,149 US20240146019A1 (en) | 2020-04-16 | 2024-01-09 | Electronic chip support device and corresponding manufacturing method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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FR2003845A FR3109466B1 (fr) | 2020-04-16 | 2020-04-16 | Dispositif de support d’une puce électronique et procédé de fabrication correspondant |
FR2003845 | 2020-04-16 |
Publications (2)
Publication Number | Publication Date |
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FR3109466A1 FR3109466A1 (fr) | 2021-10-22 |
FR3109466B1 true FR3109466B1 (fr) | 2024-05-17 |
Family
ID=71784207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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FR2003845A Active FR3109466B1 (fr) | 2020-04-16 | 2020-04-16 | Dispositif de support d’une puce électronique et procédé de fabrication correspondant |
Country Status (2)
Country | Link |
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US (2) | US11916353B2 (fr) |
FR (1) | FR3109466B1 (fr) |
Family Cites Families (67)
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JPH02146757A (ja) | 1988-11-28 | 1990-06-05 | Mitsubishi Electric Corp | 半導体装置 |
JPH03149864A (ja) | 1989-11-07 | 1991-06-26 | Matsushita Electron Corp | リードフレーム |
US5214307A (en) | 1991-07-08 | 1993-05-25 | Micron Technology, Inc. | Lead frame for semiconductor devices having improved adhesive bond line control |
JPH0547988A (ja) | 1991-08-21 | 1993-02-26 | Sony Corp | 半導体装置 |
JPH05267362A (ja) | 1992-03-19 | 1993-10-15 | Hitachi Ltd | 半導体装置の実装構造 |
US7008301B1 (en) * | 1999-08-26 | 2006-03-07 | Advanced Micro Devices, Inc. | Polishing uniformity via pad conditioning |
US7388294B2 (en) * | 2003-01-27 | 2008-06-17 | Micron Technology, Inc. | Semiconductor components having stacked dice |
US7547978B2 (en) * | 2004-06-14 | 2009-06-16 | Micron Technology, Inc. | Underfill and encapsulation of semiconductor assemblies with materials having differing properties |
US7148560B2 (en) * | 2005-01-25 | 2006-12-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | IC chip package structure and underfill process |
JP2007142176A (ja) * | 2005-11-18 | 2007-06-07 | Seiko Epson Corp | 光モジュールの製造方法 |
US7880317B2 (en) * | 2005-11-22 | 2011-02-01 | Sony Corporation | Semiconductor device and method of manufacturing semiconductor device |
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2020
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US11916353B2 (en) | 2024-02-27 |
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