FR3107611B1 - Ecran d’affichage à résolution multiple et procédé de réalisation - Google Patents
Ecran d’affichage à résolution multiple et procédé de réalisation Download PDFInfo
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- FR3107611B1 FR3107611B1 FR2001862A FR2001862A FR3107611B1 FR 3107611 B1 FR3107611 B1 FR 3107611B1 FR 2001862 A FR2001862 A FR 2001862A FR 2001862 A FR2001862 A FR 2001862A FR 3107611 B1 FR3107611 B1 FR 3107611B1
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- 238000004519 manufacturing process Methods 0.000 title abstract 3
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/001—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes using specific devices not provided for in groups G09G3/02 - G09G3/36, e.g. using an intermediate record carrier such as a film slide; Projection systems; Display of non-alphanumerical information, solely or in combination with alphanumerical information, e.g. digital display on projected diapositive as background
- G09G3/002—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes using specific devices not provided for in groups G09G3/02 - G09G3/36, e.g. using an intermediate record carrier such as a film slide; Projection systems; Display of non-alphanumerical information, solely or in combination with alphanumerical information, e.g. digital display on projected diapositive as background to project the image of a two-dimensional display, such as an array of light emitting or modulating elements or a CRT
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/011—Arrangements for interaction with the human body, e.g. for user immersion in virtual reality
- G06F3/013—Eye tracking input arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0439—Pixel structures
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2340/00—Aspects of display data processing
- G09G2340/04—Changes in size, position or resolution of an image
- G09G2340/0407—Resolution change, inclusive of the use of different resolutions for different screen areas
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2354/00—Aspects of interface with display user
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Human Computer Interaction (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
- Transforming Electric Information Into Light Information (AREA)
Abstract
Titre Ecran d’affichage à résolution multiple et procédé de réalisation. L’invention concerne un écran (10) d’affichage destiné à afficher une image de résolution multiple et comprenant une pluralité de pixels (110, 120) répartis sur un support (100), ledit écran (10) étant caractérisé en ce qu’il comprend une première zone (11) d’une face (101) du support (100) présentant une première densité de pixels (110) permettant d’afficher une première partie de l’image avec une première résolution, et une deuxième zone (12) de la face (101) du support (100) présentant une deuxième densité de pixels (120) strictement supérieure à ladite première densité, permettant d’afficher une deuxième partie de l’image avec une deuxième résolution. L’invention concerne également un système d’affichage comprenant un tel écran et un procédé de fabrication de cet écran. Figure pour l’abrégé : Fig. 3A
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR2001862A FR3107611B1 (fr) | 2020-02-26 | 2020-02-26 | Ecran d’affichage à résolution multiple et procédé de réalisation |
PCT/EP2021/054659 WO2021170708A1 (fr) | 2020-02-26 | 2021-02-25 | Ecran d'affichage à résolution multiple et procédé de réalisation |
EP21706962.4A EP4111499A1 (fr) | 2020-02-26 | 2021-02-25 | Ecran d'affichage à résolution multiple et procédé de réalisation |
US17/802,305 US12094377B2 (en) | 2020-02-26 | 2021-02-25 | Multiple resolution display screen and production method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR2001862A FR3107611B1 (fr) | 2020-02-26 | 2020-02-26 | Ecran d’affichage à résolution multiple et procédé de réalisation |
FR2001862 | 2020-02-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3107611A1 FR3107611A1 (fr) | 2021-08-27 |
FR3107611B1 true FR3107611B1 (fr) | 2022-03-04 |
Family
ID=70228319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR2001862A Active FR3107611B1 (fr) | 2020-02-26 | 2020-02-26 | Ecran d’affichage à résolution multiple et procédé de réalisation |
Country Status (4)
Country | Link |
---|---|
US (1) | US12094377B2 (fr) |
EP (1) | EP4111499A1 (fr) |
FR (1) | FR3107611B1 (fr) |
WO (1) | WO2021170708A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113903759B (zh) * | 2021-12-09 | 2022-03-25 | 武汉市聚芯微电子有限责任公司 | 半导体结构、感光装置以及感光系统 |
KR20230174355A (ko) * | 2022-06-20 | 2023-12-28 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제어방법 |
Family Cites Families (25)
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US8698859B2 (en) * | 2010-10-19 | 2014-04-15 | Blackberry Limited | Display screen having regions of differing pixel density |
KR20150073539A (ko) * | 2013-12-23 | 2015-07-01 | 삼성전자주식회사 | 전자장치의 입력 감지장치 및 방법 |
FR3044467B1 (fr) | 2015-11-26 | 2018-08-10 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dalle lumineuse et procede de fabrication d'une telle dalle lumineuse |
US10475370B2 (en) * | 2016-02-17 | 2019-11-12 | Google Llc | Foveally-rendered display |
JP2018060980A (ja) * | 2016-10-07 | 2018-04-12 | キヤノン株式会社 | 撮像表示装置及びウェアラブルデバイス |
CN110023881B (zh) * | 2016-12-01 | 2022-07-08 | 昆山云英谷电子科技有限公司 | 基于区域的显示数据处理和传输 |
US9711114B1 (en) | 2016-12-01 | 2017-07-18 | Varjo Technologies Oy | Display apparatus and method of displaying using projectors |
WO2018169243A1 (fr) * | 2017-03-13 | 2018-09-20 | 서울반도체주식회사 | Procédé de fabrication de dispositif d'affichage |
US20180269266A1 (en) * | 2017-03-16 | 2018-09-20 | Intel Corporation | Foveated displays for virtual and augmented reality |
EP3602181A4 (fr) * | 2017-03-27 | 2020-05-13 | Avegant Corp. | Dispositif d'affichage fovéal orientable |
KR102441042B1 (ko) * | 2017-06-22 | 2022-09-07 | 삼성디스플레이 주식회사 | 헤드 마운트 디스플레이 시스템 |
KR102369934B1 (ko) * | 2017-06-23 | 2022-03-03 | 삼성전자주식회사 | 칩 실장장치 및 이를 이용한 칩 실장방법 |
JP6680274B2 (ja) * | 2017-06-27 | 2020-04-15 | 日亜化学工業株式会社 | 発光装置及び樹脂付リードフレーム |
US10565943B2 (en) * | 2017-06-27 | 2020-02-18 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Device and method for reducing power consumption of liquid crystal display, and liquid crystal display |
US10768515B2 (en) * | 2017-12-12 | 2020-09-08 | Tectus Corporation | Method for manufacturing ultra-dense LED projector using thinned gallium nitride |
US10503007B1 (en) * | 2018-02-27 | 2019-12-10 | Facebook Technologies, Llc | Directional color conversion using photonic crystals with quantum dots |
EP3804347B1 (fr) * | 2018-06-04 | 2023-10-25 | Boe Technology Group Co., Ltd. | Procédé de traitement de données d'image à largeur de bande de transmission réduite pour un affichage |
US10996769B2 (en) * | 2018-06-11 | 2021-05-04 | Tectus Corporation | Contact lens-based eye tracking |
CN110619813B (zh) * | 2018-06-20 | 2021-05-14 | 京东方科技集团股份有限公司 | 显示基板、其驱动方法、显示装置及高精度金属掩模版 |
US10502963B1 (en) * | 2018-07-16 | 2019-12-10 | Facebook Technologies, Llc | Immersed fresnel structure with curable liquid polymer |
CN110838505B (zh) * | 2018-08-15 | 2020-11-06 | 云谷(固安)科技有限公司 | 显示结构和显示装置 |
KR20200059481A (ko) * | 2018-11-21 | 2020-05-29 | (주) 씨제이케이어소시에이츠 | 정보 표시 장치 |
TWI688804B (zh) * | 2018-12-13 | 2020-03-21 | 友達光電股份有限公司 | 顯示面板 |
US11158690B1 (en) * | 2019-02-21 | 2021-10-26 | Facebook Technologies, Llc | Low cost micro OLED structure and method |
US11009766B2 (en) * | 2019-06-28 | 2021-05-18 | Intel Corporation | Foveated virtual reality near eye displays |
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2020
- 2020-02-26 FR FR2001862A patent/FR3107611B1/fr active Active
-
2021
- 2021-02-25 US US17/802,305 patent/US12094377B2/en active Active
- 2021-02-25 EP EP21706962.4A patent/EP4111499A1/fr active Pending
- 2021-02-25 WO PCT/EP2021/054659 patent/WO2021170708A1/fr unknown
Also Published As
Publication number | Publication date |
---|---|
WO2021170708A1 (fr) | 2021-09-02 |
US12094377B2 (en) | 2024-09-17 |
EP4111499A1 (fr) | 2023-01-04 |
FR3107611A1 (fr) | 2021-08-27 |
US20230097333A1 (en) | 2023-03-30 |
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