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FR3004262B1 - METHOD OF INVESTIGATING THE TEMPERATURE RELIABILITY OF AN ELECTRONIC COMPONENT - Google Patents

METHOD OF INVESTIGATING THE TEMPERATURE RELIABILITY OF AN ELECTRONIC COMPONENT

Info

Publication number
FR3004262B1
FR3004262B1 FR1353184A FR1353184A FR3004262B1 FR 3004262 B1 FR3004262 B1 FR 3004262B1 FR 1353184 A FR1353184 A FR 1353184A FR 1353184 A FR1353184 A FR 1353184A FR 3004262 B1 FR3004262 B1 FR 3004262B1
Authority
FR
France
Prior art keywords
investigating
electronic component
temperature reliability
reliability
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1353184A
Other languages
French (fr)
Other versions
FR3004262A1 (en
Inventor
Florent Miller
Sebastien Morand
Florian Moliere
Thomas Santini
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Airbus Group SAS
Original Assignee
European Aeronautic Defence and Space Company EADS France
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by European Aeronautic Defence and Space Company EADS France filed Critical European Aeronautic Defence and Space Company EADS France
Priority to FR1353184A priority Critical patent/FR3004262B1/en
Priority to EP14712244.4A priority patent/EP2984494A1/en
Priority to PCT/EP2014/055257 priority patent/WO2014166701A1/en
Publication of FR3004262A1 publication Critical patent/FR3004262A1/en
Application granted granted Critical
Publication of FR3004262B1 publication Critical patent/FR3004262B1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
    • G01R31/2858—Measuring of material aspects, e.g. electro-migration [EM], hot carrier injection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR1353184A 2013-04-09 2013-04-09 METHOD OF INVESTIGATING THE TEMPERATURE RELIABILITY OF AN ELECTRONIC COMPONENT Expired - Fee Related FR3004262B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR1353184A FR3004262B1 (en) 2013-04-09 2013-04-09 METHOD OF INVESTIGATING THE TEMPERATURE RELIABILITY OF AN ELECTRONIC COMPONENT
EP14712244.4A EP2984494A1 (en) 2013-04-09 2014-03-17 Method for studying the temperature reliability of en electronic component
PCT/EP2014/055257 WO2014166701A1 (en) 2013-04-09 2014-03-17 Method for studying the temperature reliability of en electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1353184A FR3004262B1 (en) 2013-04-09 2013-04-09 METHOD OF INVESTIGATING THE TEMPERATURE RELIABILITY OF AN ELECTRONIC COMPONENT

Publications (2)

Publication Number Publication Date
FR3004262A1 FR3004262A1 (en) 2014-10-10
FR3004262B1 true FR3004262B1 (en) 2015-05-15

Family

ID=49274731

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1353184A Expired - Fee Related FR3004262B1 (en) 2013-04-09 2013-04-09 METHOD OF INVESTIGATING THE TEMPERATURE RELIABILITY OF AN ELECTRONIC COMPONENT

Country Status (3)

Country Link
EP (1) EP2984494A1 (en)
FR (1) FR3004262B1 (en)
WO (1) WO2014166701A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114152863B (en) * 2021-11-27 2023-12-08 北京工业大学 Intelligent temperature-controllable GaN power cycle experiment device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6078183A (en) * 1998-03-03 2000-06-20 Sandia Corporation Thermally-induced voltage alteration for integrated circuit analysis
US6483326B1 (en) * 1999-08-10 2002-11-19 Advanced Micro Devices, Inc. Localized heating for defect isolation during die operation
FR2959018B1 (en) * 2010-04-20 2012-08-31 European Aeronautic Defence & Space Co Eads France METHODS AND DEVICES FOR CONDUCTING AN INTEGRATED CIRCUIT

Also Published As

Publication number Publication date
WO2014166701A1 (en) 2014-10-16
FR3004262A1 (en) 2014-10-10
EP2984494A1 (en) 2016-02-17

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