FR3044306B1 - METHOD FOR ENCAPSULATING A MICROELECTRONIC DEVICE WITH A VARIABLE DIMENSION RELEASE HOLE - Google Patents

METHOD FOR ENCAPSULATING A MICROELECTRONIC DEVICE WITH A VARIABLE DIMENSION RELEASE HOLE

Info

Publication number: FR3044306B1
Authority: FR; France
Prior art keywords: encapsulating; release hole; microelectronic device; variable dimension; dimension release
Prior art date: 2015-11-27
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

FR1561474A

Other languages

French (fr)

Other versions

FR3044306A1 (en

Inventor

Jean-Louis Pornin

Xavier Baillin

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Commissariat a lEnergie Atomique et aux Energies Alternatives CEA

Original Assignee

Commissariat a lEnergie Atomique CEA

Commissariat a lEnergie Atomique et aux Energies Alternatives CEA

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2015-11-27

Filing date

2015-11-27

Publication date

2017-12-15

2015-11-27 Application filed by Commissariat a lEnergie Atomique CEA, Commissariat a lEnergie Atomique et aux Energies Alternatives CEA filed Critical Commissariat a lEnergie Atomique CEA

2015-11-27 Priority to FR1561474A priority Critical patent/FR3044306B1/en

2016-11-21 Priority to US15/357,316 priority patent/US9896331B2/en

2016-11-24 Priority to EP16200506.0A priority patent/EP3173375B1/en

2016-11-25 Priority to CN201611067967.7A priority patent/CN107032294A/en

2017-06-02 Publication of FR3044306A1 publication Critical patent/FR3044306A1/en

2017-12-15 Application granted granted Critical

2017-12-15 Publication of FR3044306B1 publication Critical patent/FR3044306B1/en

Status Expired - Fee Related legal-status Critical Current

2035-11-27 Anticipated expiration legal-status Critical

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
- B81C1/00468—Releasing structures
- B81C1/00476—Releasing structures removing a sacrificial layer
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00325—Processes for packaging MEMS devices for reducing stress inside of the package structure
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/03—Static structures
- B81B2203/0315—Cavities
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0128—Processes for removing material
- B81C2201/013—Etching
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0161—Controlling physical properties of the material
- B81C2201/0163—Controlling internal stress of deposited layers
- B81C2201/017—Methods for controlling internal stress of deposited layers not provided for in B81C2201/0164 - B81C2201/0169
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/05—Temporary protection of devices or parts of the devices during manufacturing
- B81C2201/056—Releasing structures at the end of the manufacturing process
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0136—Growing or depositing of a covering layer
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0145—Hermetically sealing an opening in the lid
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0154—Moulding a cap over the MEMS device

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Micromachines (AREA)

FR1561474A 2015-11-27 2015-11-27 METHOD FOR ENCAPSULATING A MICROELECTRONIC DEVICE WITH A VARIABLE DIMENSION RELEASE HOLE Expired - Fee Related FR3044306B1 (en)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
FR1561474A FR3044306B1 (en)	2015-11-27	2015-11-27	METHOD FOR ENCAPSULATING A MICROELECTRONIC DEVICE WITH A VARIABLE DIMENSION RELEASE HOLE
US15/357,316 US9896331B2 (en)	2015-11-27	2016-11-21	Method for encapsulating a microelectronic device with a release hole of variable dimension
EP16200506.0A EP3173375B1 (en)	2015-11-27	2016-11-24	Method for packaging a microelectronic device with a release hole having a variable size
CN201611067967.7A CN107032294A (en)	2015-11-27	2016-11-25	A kind of encapsulating method with variable-sized release aperture for microelectronic component

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
FR1561474A FR3044306B1 (en)	2015-11-27	2015-11-27	METHOD FOR ENCAPSULATING A MICROELECTRONIC DEVICE WITH A VARIABLE DIMENSION RELEASE HOLE

Publications (2)

Publication Number	Publication Date
FR3044306A1 FR3044306A1 (en)	2017-06-02
FR3044306B1 true FR3044306B1 (en)	2017-12-15

Family

ID=55135408

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
FR1561474A Expired - Fee Related FR3044306B1 (en)	2015-11-27	2015-11-27	METHOD FOR ENCAPSULATING A MICROELECTRONIC DEVICE WITH A VARIABLE DIMENSION RELEASE HOLE

Country Status (4)

Country	Link
US (1)	US9896331B2 (en)
EP (1)	EP3173375B1 (en)
CN (1)	CN107032294A (en)
FR (1)	FR3044306B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP3640978A1 (en) *	2018-10-15	2020-04-22	IMEC vzw	A method for packaging semiconductor dies
DE102019120846B3 (en) *	2019-08-01	2020-12-10	RF360 Europe GmbH	Electrical component having a cavity and a method of making an electrical component having a cavity

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
FR2864340B1 (en) *	2003-12-19	2006-03-24	Commissariat Energie Atomique	MICRO COMPONENT COMPRISING A HERMETIC MICROCAVITY AND METHOD OF MANUFACTURING SUCH MICROCOMPONENT
FR2901264B1 (en) *	2006-05-22	2008-10-10	Commissariat Energie Atomique	MICRO COMPONENT HAVING A CAVITY DELIMITED BY A COVER WITH IMPROVED MECHANICAL RESISTANCE
EP1908727A1 (en)	2006-10-03	2008-04-09	Seiko Epson Corporation	Wafer-level MEMS package and manufacturing method thereof
FR2933390B1 (en) *	2008-07-01	2010-09-03	Commissariat Energie Atomique	METHOD FOR ENCAPSULATING A MICROELECTRONIC DEVICE BY A GETTER MATERIAL
FR2948928B1 (en) *	2009-08-06	2012-02-24	Commissariat Energie Atomique	MICROCAVITE STRUCTURE AND ENCAPSULATION STRUCTURE OF A MICROELECTRONIC DEVICE
KR101096548B1 (en) *	2009-11-06	2011-12-20	주식회사 비에스이	Mems microphone and manufacturing method of the same
FR2955999B1 (en) *	2010-02-04	2012-04-20	Commissariat Energie Atomique	METHOD FOR ENCAPSULATING A MICROCOMPONENT WITH A MECHANICALLY REINFORCED COVER
FR2986901B1 (en) *	2012-02-15	2015-07-03	Commissariat Energie Atomique	MICROELECTRONIC SUBSTRATE COMPRISING A LAYER OF ORGANIC MATERIAL ENTERREE
US9102517B2 (en)	2012-08-22	2015-08-11	International Business Machines Corporation	Semiconductor structures provided within a cavity and related design structures
US20140147955A1 (en) *	2012-11-29	2014-05-29	Agency For Science, Technology And Research	Method of encapsulating a micro-electromechanical (mems) device

2015
- 2015-11-27 FR FR1561474A patent/FR3044306B1/en not_active Expired - Fee Related
2016
- 2016-11-21 US US15/357,316 patent/US9896331B2/en active Active
- 2016-11-24 EP EP16200506.0A patent/EP3173375B1/en not_active Not-in-force
- 2016-11-25 CN CN201611067967.7A patent/CN107032294A/en active Pending

Also Published As

Publication number	Publication date
EP3173375B1 (en)	2018-11-14
EP3173375A1 (en)	2017-05-31
US9896331B2 (en)	2018-02-20
CN107032294A (en)	2017-08-11
FR3044306A1 (en)	2017-06-02
US20170152137A1 (en)	2017-06-01

Publication	Publication Date	Title
FR2994332B1 (en)	2015-05-15	METHOD FOR ENCAPSULATING A MICROELECTRONIC DEVICE
GB2540013B (en)	2020-03-25	A package for a semiconductor device
GB2585509B (en)	2021-07-07	Method for manufacturing light-emitting device
EP3089223C0 (en)	2024-05-01	A semi-conductor device
FR3007403B1 (en)	2016-08-05	METHOD FOR PRODUCING A MECHANICALLY AUTONOMOUS MICROELECTRONIC DEVICE
GB2556845B (en)	2021-06-09	Stabilized shoulder mount for electronic device
GB2540843B (en)	2020-02-26	A package for a semiconductor device
GB2568407B (en)	2022-02-23	Intelligent electronic device
FR3003086B1 (en)	2018-03-16	SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
FR3020977B1 (en)	2017-07-28	NACELLE FOR PARALLEL ROBOT FOR ACTING ON AN OBJECT
FR3029173B1 (en)	2018-03-23	DEVICE AND METHOD FOR UNLOCKING A FEEDING DEVICE
AU358394S (en)	2014-10-22	Deployment tool for an encapsulation device
FR3002685B1 (en)	2016-06-24	METHOD FOR PRODUCING A MICROELECTRONIC DEVICE
PL3420142T3 (en)	2021-11-29	Device for compacting a substrate
FR3006108B1 (en)	2016-12-02	METHOD FOR MANUFACTURING A PHOTOSENSITIVE DEVICE
FR3044306B1 (en)	2017-12-15	METHOD FOR ENCAPSULATING A MICROELECTRONIC DEVICE WITH A VARIABLE DIMENSION RELEASE HOLE
FR3023058B1 (en)	2017-09-29	METHOD FOR PRODUCING A MICROELECTRONIC DEVICE
FR3042909B1 (en)	2017-12-15	METHOD FOR ENCAPSULATING A MICROELECTRONIC COMPONENT
FR3029015B1 (en)	2018-03-02	OPTOELECTRONIC DEVICE WITH THREE-DIMENSIONAL SEMICONDUCTOR ELEMENTS AND METHOD FOR MANUFACTURING THE SAME
HK1250281A1 (en)	2018-12-07	A method for manufacturing a semiconductor device
FR3025074B1 (en)	2018-03-09	IMPROVED OPENING PACKAGE DEVICE
FR3039966B1 (en)	2018-02-09	DEVICE FOR FORMING AN ANDAIN
FR3040822B1 (en)	2018-02-23	METHOD FOR MANUFACTURING ELECTRONIC JUNCTION DEVICE AND DEVICE THEREOF
FR3043395B1 (en)	2017-11-10	MICROELECTRONIC DEVICE
FR3043088B1 (en)	2017-11-17	STAGE THERMOLYSIS DEVICE

Legal Events

Date	Code	Title	Description
2016-11-30	PLFP	Fee payment	Year of fee payment: 2
2017-06-02	PLSC	Publication of the preliminary search report	Effective date: 20170602
2017-11-30	PLFP	Fee payment	Year of fee payment: 3
2018-11-29	PLFP	Fee payment	Year of fee payment: 4
2020-10-16	ST	Notification of lapse	Effective date: 20200914