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FR2936096B1 - Procede de fabrication d'objets portatifs sans contact - Google Patents

Procede de fabrication d'objets portatifs sans contact

Info

Publication number
FR2936096B1
FR2936096B1 FR0805015A FR0805015A FR2936096B1 FR 2936096 B1 FR2936096 B1 FR 2936096B1 FR 0805015 A FR0805015 A FR 0805015A FR 0805015 A FR0805015 A FR 0805015A FR 2936096 B1 FR2936096 B1 FR 2936096B1
Authority
FR
France
Prior art keywords
manufacturing non
portable objects
contact portable
contact
objects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0805015A
Other languages
English (en)
Other versions
FR2936096A1 (fr
Inventor
Yannick Grasset
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to FR0805015A priority Critical patent/FR2936096B1/fr
Priority to EP09740171A priority patent/EP2324498A1/fr
Priority to PCT/FR2009/001091 priority patent/WO2010029233A1/fr
Priority to US13/063,629 priority patent/US8409928B2/en
Publication of FR2936096A1 publication Critical patent/FR2936096A1/fr
Application granted granted Critical
Publication of FR2936096B1 publication Critical patent/FR2936096B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
FR0805015A 2008-09-12 2008-09-12 Procede de fabrication d'objets portatifs sans contact Expired - Fee Related FR2936096B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR0805015A FR2936096B1 (fr) 2008-09-12 2008-09-12 Procede de fabrication d'objets portatifs sans contact
EP09740171A EP2324498A1 (fr) 2008-09-12 2009-09-14 Procede de fabrication d'objets portatifs sans contact
PCT/FR2009/001091 WO2010029233A1 (fr) 2008-09-12 2009-09-14 Procede de fabrication d'objets portatifs sans contact
US13/063,629 US8409928B2 (en) 2008-09-12 2009-09-14 Method for making contactless portable objects

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0805015A FR2936096B1 (fr) 2008-09-12 2008-09-12 Procede de fabrication d'objets portatifs sans contact

Publications (2)

Publication Number Publication Date
FR2936096A1 FR2936096A1 (fr) 2010-03-19
FR2936096B1 true FR2936096B1 (fr) 2011-01-28

Family

ID=40467299

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0805015A Expired - Fee Related FR2936096B1 (fr) 2008-09-12 2008-09-12 Procede de fabrication d'objets portatifs sans contact

Country Status (4)

Country Link
US (1) US8409928B2 (fr)
EP (1) EP2324498A1 (fr)
FR (1) FR2936096B1 (fr)
WO (1) WO2010029233A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2927441B1 (fr) * 2008-02-13 2011-06-17 Yannick Grasset Objet sans contact a circuit integre connecte aux bornes d'un circuit par couplage capacitif
FR3001070B1 (fr) * 2013-01-17 2016-05-06 Inside Secure Systeme d'antenne pour microcircuit sans contact
EP3089079B1 (fr) * 2014-11-07 2020-08-05 Murata Manufacturing Co., Ltd. Ruban porteur ainsi que procédé de fabrication de celui-ci, et procédé de fabrication d'étiquette rfid

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59501555D1 (de) * 1995-04-20 1998-04-09 Fuba Automotive Gmbh Flachantennen-Anordnung
KR0175267B1 (ko) * 1995-09-30 1999-04-01 김광호 회전운동을 하는 픽업 툴을 구비하는 다이 본딩 장치
US5786979A (en) * 1995-12-18 1998-07-28 Douglass; Barry G. High density inter-chip connections by electromagnetic coupling
US6421013B1 (en) * 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
JP2003523700A (ja) * 2000-02-14 2003-08-05 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ トランスポンダおよびアプライアンス
DE10133588A1 (de) 2001-07-11 2002-09-05 Infineon Technologies Ag Anordnung eines Chips und einer Leiterstruktur
US6900536B1 (en) * 2002-04-26 2005-05-31 Celis Semiconductor Corporation Method for producing an electrical circuit
US7224280B2 (en) * 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
WO2005008726A2 (fr) * 2003-07-09 2005-01-27 Newport Corporation Machine de puce a bosse
JP4672384B2 (ja) * 2004-04-27 2011-04-20 大日本印刷株式会社 Ｉｃタグ付シートの製造方法、ｉｃタグ付シートの製造装置、ｉｃタグ付シート、ｉｃチップの固定方法、ｉｃチップの固定装置、およびｉｃタグ
US7500307B2 (en) * 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
CA2603118A1 (fr) * 2005-03-29 2006-10-05 Symbol Technologies, Inc. Articles intelligents d'identification de radiofrequences (rfid)
US7687327B2 (en) * 2005-07-08 2010-03-30 Kovio, Inc, Methods for manufacturing RFID tags and structures formed therefrom
WO2007030768A2 (fr) * 2005-09-09 2007-03-15 Delaware Capital Formation, Inc. Procede et appareil d'insertion de bandes/inserts
FR2894714B1 (fr) * 2005-12-13 2008-02-29 K Sa As Procede de connexion d'une puce electronique sur un dispositif d'identification radiofrequence
US7612676B2 (en) * 2006-12-05 2009-11-03 The Hong Kong University Of Science And Technology RFID tag and antenna
CH698718B1 (de) * 2007-01-31 2009-10-15 Oerlikon Assembly Equipment Ag Vorrichtung für die Montage eines Flipchips auf einem Substrat.
FR2917534B1 (fr) 2007-06-15 2009-10-02 Ask Sa Procede de connexion d'une puce electronique sur un dispositif d'identification radiofrequence
FR2927441B1 (fr) 2008-02-13 2011-06-17 Yannick Grasset Objet sans contact a circuit integre connecte aux bornes d'un circuit par couplage capacitif
US8102021B2 (en) * 2008-05-12 2012-01-24 Sychip Inc. RF devices

Also Published As

Publication number Publication date
FR2936096A1 (fr) 2010-03-19
EP2324498A1 (fr) 2011-05-25
WO2010029233A1 (fr) 2010-03-18
US8409928B2 (en) 2013-04-02
US20110171783A1 (en) 2011-07-14

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Legal Events

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Year of fee payment: 8

ST Notification of lapse

Effective date: 20170531