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FR2901546B1 - Procede et dispositif de depollution d'environnement confine - Google Patents

Procede et dispositif de depollution d'environnement confine

Info

Publication number
FR2901546B1
FR2901546B1 FR0604668A FR0604668A FR2901546B1 FR 2901546 B1 FR2901546 B1 FR 2901546B1 FR 0604668 A FR0604668 A FR 0604668A FR 0604668 A FR0604668 A FR 0604668A FR 2901546 B1 FR2901546 B1 FR 2901546B1
Authority
FR
France
Prior art keywords
determining
confined environment
confined
environment
determining confined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0604668A
Other languages
English (en)
Other versions
FR2901546A1 (fr
Inventor
Arnaud Favre
Bertrand Bellet
Roland Bernard
Xavier Metais
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pfeiffer Vacuum SAS
Original Assignee
Alcatel CIT SA
Alcatel SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR0604668A priority Critical patent/FR2901546B1/fr
Application filed by Alcatel CIT SA, Alcatel SA filed Critical Alcatel CIT SA
Priority to JP2009511561A priority patent/JP5274450B2/ja
Priority to US12/227,587 priority patent/US8151816B2/en
Priority to PCT/FR2007/051328 priority patent/WO2007135347A1/fr
Priority to SG2011037074A priority patent/SG172620A1/en
Priority to CN2007800270992A priority patent/CN101501817B/zh
Priority to EP07766098A priority patent/EP2030222A1/fr
Priority to KR1020087031317A priority patent/KR101202551B1/ko
Publication of FR2901546A1 publication Critical patent/FR2901546A1/fr
Application granted granted Critical
Publication of FR2901546B1 publication Critical patent/FR2901546B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0402—Cleaning, repairing, or assembling
    • Y10T137/0419—Fluid cleaning or flushing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/6416—With heating or cooling of the system
    • Y10T137/6579—Circulating fluid in heat exchange relationship

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Secondary Cells (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)
  • Chemical Vapour Deposition (AREA)
FR0604668A 2006-05-24 2006-05-24 Procede et dispositif de depollution d'environnement confine Active FR2901546B1 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FR0604668A FR2901546B1 (fr) 2006-05-24 2006-05-24 Procede et dispositif de depollution d'environnement confine
US12/227,587 US8151816B2 (en) 2006-05-24 2007-05-24 Method and device for removing pollution from a confined environment
PCT/FR2007/051328 WO2007135347A1 (fr) 2006-05-24 2007-05-24 Procede et dispositif de depollution d'environnement confine
SG2011037074A SG172620A1 (en) 2006-05-24 2007-05-24 Method and device for removing pollution from a confined environment
JP2009511561A JP5274450B2 (ja) 2006-05-24 2007-05-24 密閉環境から汚染を除去するための方法および装置
CN2007800270992A CN101501817B (zh) 2006-05-24 2007-05-24 用于从限定的环境去除污染的方法和装置
EP07766098A EP2030222A1 (fr) 2006-05-24 2007-05-24 Procede et dispositif de depollution d'environnement confine
KR1020087031317A KR101202551B1 (ko) 2006-05-24 2007-05-24 밀폐 환경으로부터 오염을 제거하는 방법 및 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0604668A FR2901546B1 (fr) 2006-05-24 2006-05-24 Procede et dispositif de depollution d'environnement confine

Publications (2)

Publication Number Publication Date
FR2901546A1 FR2901546A1 (fr) 2007-11-30
FR2901546B1 true FR2901546B1 (fr) 2010-10-15

Family

ID=37595457

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0604668A Active FR2901546B1 (fr) 2006-05-24 2006-05-24 Procede et dispositif de depollution d'environnement confine

Country Status (8)

Country Link
US (1) US8151816B2 (fr)
EP (1) EP2030222A1 (fr)
JP (1) JP5274450B2 (fr)
KR (1) KR101202551B1 (fr)
CN (1) CN101501817B (fr)
FR (1) FR2901546B1 (fr)
SG (1) SG172620A1 (fr)
WO (1) WO2007135347A1 (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2920046A1 (fr) * 2007-08-13 2009-02-20 Alcatel Lucent Sas Procede de post-traitement d'un support de transport pour le convoyage et le stockage atmospherique de substrats semi-conducteurs, et station de post-traitement pour la mise en oeuvre d'un tel procede
FR2940322B1 (fr) * 2008-12-19 2011-02-11 Alcatel Lucent Procede de descente en pression dans un sas de chargement et de dechargement et equipement associe
FR2954583B1 (fr) 2009-12-18 2017-11-24 Alcatel Lucent Procede et dispositif de pilotage de fabrication de semi conducteurs par mesure de contamination
FR2961946B1 (fr) 2010-06-29 2012-08-03 Alcatel Lucent Dispositif de traitement pour boites de transport et de stockage
CN102431727A (zh) * 2011-08-04 2012-05-02 上海华力微电子有限公司 氟化氩光掩模盒运送装置和方法
KR101372448B1 (ko) * 2013-02-01 2014-03-11 나노세미콘(주) 진공 및 가압을 이용한 잔류가스 및 이물질 제거장치
NL2010471C2 (en) * 2013-03-18 2014-09-24 Levitech B V Substrate processing apparatus.
CN104162523B (zh) * 2013-05-16 2016-04-27 宝山钢铁股份有限公司 X荧光光谱仪真空分光室的残留油污水汽的清除方法
WO2017212841A1 (fr) * 2016-06-08 2017-12-14 村田機械株式会社 Dispositif et procédé de stockage de récipients
KR102377504B1 (ko) * 2016-11-24 2022-03-23 에스케이하이닉스 주식회사 반도체 웨이퍼 제조 시스템 및 제어 방법
JP6880913B2 (ja) * 2017-03-28 2021-06-02 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
US10388547B2 (en) * 2017-06-23 2019-08-20 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for processing substrates
KR101841925B1 (ko) * 2017-07-28 2018-03-26 크린팩토메이션 주식회사 웨이퍼 내장 풉에 대한 지상 퍼지 스테이션
CN108414612A (zh) * 2018-01-25 2018-08-17 中国科学院光电研究院 一种准分子激光器放电腔气体的检测方法及模块
CN110797278B (zh) * 2018-08-01 2022-05-27 北京北方华创微电子装备有限公司 微环境的压力控制系统及其控制方法、半导体处理设备
CN110127151B (zh) * 2019-04-09 2021-07-20 广东省第二人民医院（广东省卫生应急医院） 一种用于去除透析用品包装中消毒气体的方法及装置
CN113692383B (zh) * 2019-04-17 2024-07-05 伊科斯克有限公司 一种用于包装一张或多张动物皮的方法和封装
US11545379B2 (en) * 2020-07-31 2023-01-03 Nanya Technology Corporation System and method for controlling semiconductor manufacturing equipment
CN115527825A (zh) * 2021-06-25 2022-12-27 中微半导体设备(上海)股份有限公司 一种用于等离子体处理设备的检测装置及等离子体处理设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786387A (ja) * 1993-06-30 1995-03-31 Sony Corp ウエハボツクス
JPH08213446A (ja) * 1994-12-08 1996-08-20 Tokyo Electron Ltd 処理装置
JPH10178089A (ja) * 1996-12-18 1998-06-30 Sony Corp ウェハボックスおよびこれを載置するテーブルと台車
US6984361B2 (en) * 1997-12-23 2006-01-10 Cosmed Group, Inc. Use of continuous flow of Ox to control biological pathogens in mail and shipping parcels
US6558622B1 (en) * 1999-05-04 2003-05-06 Steris Corporation Sub-critical fluid cleaning and antimicrobial decontamination system and process
US6228330B1 (en) * 1999-06-08 2001-05-08 The Regents Of The University Of California Atmospheric-pressure plasma decontamination/sterilization chamber
JP2000353738A (ja) * 1999-06-11 2000-12-19 Sony Corp 密閉コンテナ、保管装置および電子部品搬送システム、ならびに電子部品の保管および搬送方法
JP2000353728A (ja) * 1999-06-11 2000-12-19 Kan Electronics Co Ltd ウエハー基板型プローブカード
JP3925918B2 (ja) * 2002-09-30 2007-06-06 正 上村 Ｆｏｕｐ内ガス置換装置

Also Published As

Publication number Publication date
FR2901546A1 (fr) 2007-11-30
US8151816B2 (en) 2012-04-10
KR20090017633A (ko) 2009-02-18
US20090263216A1 (en) 2009-10-22
EP2030222A1 (fr) 2009-03-04
CN101501817A (zh) 2009-08-05
KR101202551B1 (ko) 2012-11-19
WO2007135347A1 (fr) 2007-11-29
SG172620A1 (en) 2011-07-28
CN101501817B (zh) 2013-10-16
JP2009538000A (ja) 2009-10-29
JP5274450B2 (ja) 2013-08-28

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