[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

FR2940697B1 - VIGNETTE FOR A MICROCIRCUIT CARD, MODULE AND CARD - Google Patents

VIGNETTE FOR A MICROCIRCUIT CARD, MODULE AND CARD

Info

Publication number
FR2940697B1
FR2940697B1 FR0859086A FR0859086A FR2940697B1 FR 2940697 B1 FR2940697 B1 FR 2940697B1 FR 0859086 A FR0859086 A FR 0859086A FR 0859086 A FR0859086 A FR 0859086A FR 2940697 B1 FR2940697 B1 FR 2940697B1
Authority
FR
France
Prior art keywords
card
vignette
module
microcircuit
microcircuit card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0859086A
Other languages
French (fr)
Other versions
FR2940697A1 (en
Inventor
Julien Fortel
Mourad Laknin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemia France SAS
Original Assignee
Oberthur Technologies SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oberthur Technologies SA filed Critical Oberthur Technologies SA
Priority to FR0859086A priority Critical patent/FR2940697B1/en
Publication of FR2940697A1 publication Critical patent/FR2940697A1/en
Application granted granted Critical
Publication of FR2940697B1 publication Critical patent/FR2940697B1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)
FR0859086A 2008-12-26 2008-12-26 VIGNETTE FOR A MICROCIRCUIT CARD, MODULE AND CARD Expired - Fee Related FR2940697B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0859086A FR2940697B1 (en) 2008-12-26 2008-12-26 VIGNETTE FOR A MICROCIRCUIT CARD, MODULE AND CARD

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0859086A FR2940697B1 (en) 2008-12-26 2008-12-26 VIGNETTE FOR A MICROCIRCUIT CARD, MODULE AND CARD

Publications (2)

Publication Number Publication Date
FR2940697A1 FR2940697A1 (en) 2010-07-02
FR2940697B1 true FR2940697B1 (en) 2011-06-17

Family

ID=40957801

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0859086A Expired - Fee Related FR2940697B1 (en) 2008-12-26 2008-12-26 VIGNETTE FOR A MICROCIRCUIT CARD, MODULE AND CARD

Country Status (1)

Country Link
FR (1) FR2940697B1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5255430A (en) * 1992-10-08 1993-10-26 Atmel Corporation Method of assembling a module for a smart card
JP4299414B2 (en) * 1999-10-12 2009-07-22 富士通マイクロエレクトロニクス株式会社 Combination card, IC card module, and combination card manufacturing method
ATE424009T1 (en) * 2003-08-05 2009-03-15 Nxp Bv MODULE WITH AT LEAST TWO PAIRS OF MODULE CONNECTION PLATES
EP1804200B1 (en) * 2005-12-30 2009-04-08 Incard SA IC card with improved printed circuit

Also Published As

Publication number Publication date
FR2940697A1 (en) 2010-07-02

Similar Documents

Publication Publication Date Title
FR2915011B1 (en) CHIP CARD WITH DOUBLE COMMUNICATION INTERFACE
FR2890212B1 (en) ELECTRONIC MODULE WITH A DOUBLE COMMUNICATION INTERFACE, IN PARTICULAR FOR A CHIP CARD
DE602006008422D1 (en) RFID reader / writer
DE602006016547D1 (en) RFID reader architecture
EP2202844A4 (en) Sim card ic module and sim card
DK1958127T3 (en) SMART CARD
EP2406718A4 (en) Secure card access module for integrated circuit card applications
BRPI0923446A2 (en) coupling lenses, illuminating device and electronic device.
EP2254076A4 (en) Tag information processing device
BRPI0906554A2 (en) Financial Transaction Card, and, Financial Transaction Card
DE602007008650D1 (en) RFID reader
FR2968432B1 (en) METHOD FOR INPUTTING A MODULE IN A MICROCIRCUIT CARD
FR2954546B1 (en) "MULTI-APPLICATION CHIP CARD WITH BIOMETRIC VALIDATION."
DE502007004647D1 (en) Tamper-proof card reader
DE602007013156D1 (en) card reader
DE602006020677D1 (en) card reader
BRPI0904807A2 (en) Card reader
FR2976382B1 (en) MICROCIRCUIT MODULE AND CHIP CARD COMPRISING THE SAME
FR2937448B1 (en) MODULE, MICROCIRCUIT CARD AND CORRESPONDING MANUFACTURING METHOD.
FR2917871B1 (en) SECURE INSERT, IN PARTICULAR FOR A CHIP CARD
FR2915010B1 (en) MICROELECTRONIC MODULE WITH A DOUBLE COMMUNICATION INTERFACE, IN PARTICULAR FOR A CHIP CARD.
FR2946824B1 (en) ELECTRONIC ENTITY AND MICROCIRCUIT CARD FOR ELECTRONIC ENTITY.
FR2942561B1 (en) MICROCIRCUIT CARD HOLDER, MICROCIRCUIT CARD COMPRISING SUCH A SUPPORT.
FR2940697B1 (en) VIGNETTE FOR A MICROCIRCUIT CARD, MODULE AND CARD
IS8558A (en) Electronic scratch cards

Legal Events

Date Code Title Description
GC Lien (pledge) constituted

Effective date: 20140115

PLFP Fee payment

Year of fee payment: 8

PLFP Fee payment

Year of fee payment: 9

PLFP Fee payment

Year of fee payment: 10

PLFP Fee payment

Year of fee payment: 12

ST Notification of lapse

Effective date: 20210806