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FR2865575B1 - Procede pour emballer des pastilles semi-conductrices et structure de pastille semi-conductrice ainsi obtenue - Google Patents

Procede pour emballer des pastilles semi-conductrices et structure de pastille semi-conductrice ainsi obtenue

Info

Publication number
FR2865575B1
FR2865575B1 FR0550168A FR0550168A FR2865575B1 FR 2865575 B1 FR2865575 B1 FR 2865575B1 FR 0550168 A FR0550168 A FR 0550168A FR 0550168 A FR0550168 A FR 0550168A FR 2865575 B1 FR2865575 B1 FR 2865575B1
Authority
FR
France
Prior art keywords
semiconductor
pastille
pellets
packaging
pellet structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0550168A
Other languages
English (en)
Other versions
FR2865575A1 (fr
Inventor
Kurt Weiblen
Hubert Benzel
Stefan Pinter
Roland Guenschel
Frieder Haag
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2865575A1 publication Critical patent/FR2865575A1/fr
Application granted granted Critical
Publication of FR2865575B1 publication Critical patent/FR2865575B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0051—Packages or encapsulation for reducing stress inside of the package structure between the package lid and the substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0154—Moulding a cap over the MEMS device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Die Bonding (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
FR0550168A 2004-01-23 2005-01-20 Procede pour emballer des pastilles semi-conductrices et structure de pastille semi-conductrice ainsi obtenue Expired - Fee Related FR2865575B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102004003413A DE102004003413A1 (de) 2004-01-23 2004-01-23 Verfahren zum Verpacken von Halbleiterchips und entsprechende Halbleiterchipanordnung

Publications (2)

Publication Number Publication Date
FR2865575A1 FR2865575A1 (fr) 2005-07-29
FR2865575B1 true FR2865575B1 (fr) 2008-07-25

Family

ID=34716725

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0550168A Expired - Fee Related FR2865575B1 (fr) 2004-01-23 2005-01-20 Procede pour emballer des pastilles semi-conductrices et structure de pastille semi-conductrice ainsi obtenue

Country Status (4)

Country Link
US (1) US20050186703A1 (fr)
JP (1) JP2005210131A (fr)
DE (1) DE102004003413A1 (fr)
FR (1) FR2865575B1 (fr)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI327769B (en) * 2006-12-29 2010-07-21 Ind Tech Res Inst A packaging structure of pressure sensor and a method therefor
US7557417B2 (en) 2007-02-21 2009-07-07 Infineon Technologies Ag Module comprising a semiconductor chip comprising a movable element
DE102007008518A1 (de) * 2007-02-21 2008-08-28 Infineon Technologies Ag Modul mit einem ein bewegliches Element umfassenden Halbleiterchip
TWI341014B (en) * 2007-05-30 2011-04-21 Ind Tech Res Inst A device structure with preformed ring and method therefor
US20090134481A1 (en) * 2007-11-28 2009-05-28 Analog Devices, Inc. Molded Sensor Package and Assembly Method
CN101468787B (zh) * 2007-12-28 2011-05-04 财团法人工业技术研究院 电声感知微机电系统的超薄型封装结构
DE102008011943B4 (de) * 2008-02-29 2012-04-26 Robert Bosch Gmbh Sensoranordnung zur Differenzdruckmessung
DE102008017871B4 (de) 2008-04-09 2014-09-25 Hella Kgaa Hueck & Co. Drucksensormodul und Verfahren zu seiner Herstellung
DE102008002307A1 (de) * 2008-06-09 2009-12-10 Robert Bosch Gmbh Herstellungsverfahren für ein mikromechanisches Bauelement, entsprechender Bauelementverbund und entsprechendes mikromechanisches Bauelement
CN101337652B (zh) * 2008-08-11 2011-08-10 美新半导体（无锡）有限公司 传感器元件接触表面的封装结构及其封装方法
DE102008044177A1 (de) 2008-11-28 2010-06-02 Robert Bosch Gmbh Verfahren zur Herstellung eines mikromechanischen Bauelements sowie mit dem Verfahren hergestelltes Bauelement bzw. dessen Verwendung
US8124953B2 (en) * 2009-03-12 2012-02-28 Infineon Technologies Ag Sensor device having a porous structure element
JP5295388B2 (ja) * 2009-12-25 2013-09-18 アルプス電気株式会社 フォースセンサ及びその製造方法
US8338208B2 (en) * 2009-12-31 2012-12-25 Texas Instruments Incorporated Micro-electro-mechanical system having movable element integrated into leadframe-based package
JP5445196B2 (ja) * 2010-02-10 2014-03-19 セイコーエプソン株式会社 応力検出素子、触覚センサー、および把持装置
DE102010001759B4 (de) * 2010-02-10 2017-12-14 Robert Bosch Gmbh Mikromechanisches System und Verfahren zum Herstellen eines mikromechanischen Systems
DE102010002463A1 (de) * 2010-03-01 2011-09-01 Robert Bosch Gmbh Mikromechanisches Drucksensorelement und Verfahren zu dessen Herstellung
DE102010064120B4 (de) * 2010-12-23 2023-05-25 Robert Bosch Gmbh Bauteil und Verfahren zu dessen Herstellung
DE102010064108A1 (de) * 2010-12-23 2012-06-28 Robert Bosch Gmbh Verfahren zur Verpackung eines Sensorchips und dermaßen hergestelltes Bauteil
EP2481703B1 (fr) * 2011-01-27 2020-07-01 Sensirion AG Protection de capteur
DE102011017824A1 (de) 2011-04-29 2012-10-31 Endress + Hauser Gmbh + Co. Kg Hochtemperaturdruckmessaufnehmer
DE102011075260B4 (de) * 2011-05-04 2012-12-06 Robert Bosch Gmbh MEMS-Mikrofon
DE102011075822B4 (de) * 2011-05-13 2016-07-14 Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. Vorrichtung zur kapazitiven Druckbestimmung
US8884413B2 (en) * 2012-08-31 2014-11-11 Freescale Semiconductor, Inc. Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufacture
ITTO20130539A1 (it) * 2013-06-28 2014-12-29 Stmicroelectronics International N V Dispositivo mems incorporante un percorso fluidico e relativo procedimento di fabbricazione
US9527728B2 (en) * 2013-07-22 2016-12-27 Texas Instruments Incorporated Integrated circuit package and method
US9628918B2 (en) * 2013-11-25 2017-04-18 Infineon Technologies Ag Semiconductor device and a method for forming a semiconductor device
US9013013B1 (en) 2013-12-06 2015-04-21 Infineon Technologies Ag Pressure sensor package having a stacked die arrangement
DE102014208100A1 (de) * 2014-04-29 2015-10-29 Robert Bosch Gmbh Sensoranordnung
DE102014014103A1 (de) * 2014-09-30 2016-03-31 Hella Kgaa Hueck & Co. Sensormodul zur Messung eines Druckes eines Fluides mit mindestens einer auf einem Schaltungsträger angeordneten elektronischen Schaltung, insbesondere einem integrierten Schaltkreis und mindestens einem Druckmesschip
DE102015211778A1 (de) * 2015-06-25 2016-12-29 Robert Bosch Gmbh Verfahren zur Herstellung einer mikromechanischen Struktur sowie ein Bauelement mit dieser mikromechanischen Struktur
JP6520636B2 (ja) * 2015-10-16 2019-05-29 株式会社デンソー 物理量センササブアセンブリおよび物理量測定装置
EP3396329A1 (fr) * 2017-04-28 2018-10-31 Sensirion AG Emballage de capteur
CN111133768A (zh) * 2017-09-21 2020-05-08 美商楼氏电子有限公司 具有进入保护的麦克风中的提升mems器件
US11302611B2 (en) * 2018-11-28 2022-04-12 Texas Instruments Incorporated Semiconductor package with top circuit and an IC with a gap over the IC
EP3855049A1 (fr) * 2020-01-23 2021-07-28 Continental Automotive GmbH Élément d'étanchéité pour un module de capteur de pression pour véhicule automobile et module de capteur de pression
DE102022206385A1 (de) 2022-06-24 2024-01-04 Robert Bosch Gesellschaft mit beschränkter Haftung Mikromechanische Sensorvorrichtung und entsprechendes Herstellungsverfahren

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5029479A (en) * 1988-08-15 1991-07-09 Imo Industries, Inc. Differential pressure transducers
US5591679A (en) * 1995-04-12 1997-01-07 Sensonor A/S Sealed cavity arrangement method
US6534340B1 (en) * 1998-11-18 2003-03-18 Analog Devices, Inc. Cover cap for semiconductor wafer devices
US6229190B1 (en) * 1998-12-18 2001-05-08 Maxim Integrated Products, Inc. Compensated semiconductor pressure sensor
US6255728B1 (en) * 1999-01-15 2001-07-03 Maxim Integrated Products, Inc. Rigid encapsulation package for semiconductor devices
DE19929026B4 (de) * 1999-06-25 2011-02-24 Robert Bosch Gmbh Verfahren zur Herstellung eines Drucksensors
DE19929028A1 (de) * 1999-06-25 2000-12-28 Bosch Gmbh Robert Verfahren zur Herstellung eines Drucksensors
US6420208B1 (en) * 2000-09-14 2002-07-16 Motorola, Inc. Method of forming an alternative ground contact for a semiconductor die

Also Published As

Publication number Publication date
US20050186703A1 (en) 2005-08-25
JP2005210131A (ja) 2005-08-04
FR2865575A1 (fr) 2005-07-29
DE102004003413A1 (de) 2005-08-11

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Effective date: 20140930