FR2844733B1 - Procede de mise a disposition de billes ou preformes en vue de leur prehension et depose de facon individuelle - Google Patents
Procede de mise a disposition de billes ou preformes en vue de leur prehension et depose de facon individuelleInfo
- Publication number
- FR2844733B1 FR2844733B1 FR0211887A FR0211887A FR2844733B1 FR 2844733 B1 FR2844733 B1 FR 2844733B1 FR 0211887 A FR0211887 A FR 0211887A FR 0211887 A FR0211887 A FR 0211887A FR 2844733 B1 FR2844733 B1 FR 2844733B1
- Authority
- FR
- France
- Prior art keywords
- preforms
- gripping
- individual removal
- providing balls
- balls
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0211887A FR2844733B1 (fr) | 2002-09-25 | 2002-09-25 | Procede de mise a disposition de billes ou preformes en vue de leur prehension et depose de facon individuelle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0211887A FR2844733B1 (fr) | 2002-09-25 | 2002-09-25 | Procede de mise a disposition de billes ou preformes en vue de leur prehension et depose de facon individuelle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2844733A1 FR2844733A1 (fr) | 2004-03-26 |
| FR2844733B1 true FR2844733B1 (fr) | 2005-05-06 |
Family
ID=31970999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR0211887A Expired - Fee Related FR2844733B1 (fr) | 2002-09-25 | 2002-09-25 | Procede de mise a disposition de billes ou preformes en vue de leur prehension et depose de facon individuelle |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2844733B1 (fr) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2440615A1 (fr) * | 1978-11-03 | 1980-05-30 | Thomson Csf | Procede de fabrication de bossages metalliques calibres sur un film support et film support comportant de tels bossages |
| FR2766618B1 (fr) * | 1997-07-22 | 2000-12-01 | Commissariat Energie Atomique | Procede de fabrication d'un film conducteur anisotrope a inserts conducteurs |
| FR2782439B1 (fr) * | 1998-08-13 | 2000-09-15 | Bull Sa | Outillage amovible pour la realisation de bossages, conducteurs electriques, sur des composants electroniques |
| FR2785140B1 (fr) * | 1998-10-27 | 2007-04-20 | Novatec Sa Soc | Dispositif de mise a disposition de billes ou de preformes pour la fabrication de connexions a billes |
-
2002
- 2002-09-25 FR FR0211887A patent/FR2844733B1/fr not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| FR2844733A1 (fr) | 2004-03-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |
Effective date: 20150529 |