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FR2713830B1 - Composant conducteur pour transporter des signaux électriques et procédé pour la réalisation d'un tel composant. - Google Patents

Composant conducteur pour transporter des signaux électriques et procédé pour la réalisation d'un tel composant.

Info

Publication number
FR2713830B1
FR2713830B1 FR9414865A FR9414865A FR2713830B1 FR 2713830 B1 FR2713830 B1 FR 2713830B1 FR 9414865 A FR9414865 A FR 9414865A FR 9414865 A FR9414865 A FR 9414865A FR 2713830 B1 FR2713830 B1 FR 2713830B1
Authority
FR
France
Prior art keywords
component
producing
electrical signals
transporting electrical
conductive component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9414865A
Other languages
English (en)
Other versions
FR2713830A1 (fr
Inventor
William J Mcginley
John R Cannon
William J Green
Richard P Zanardo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Methode Electronics Inc
Original Assignee
Methode Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Methode Electronics Inc filed Critical Methode Electronics Inc
Publication of FR2713830A1 publication Critical patent/FR2713830A1/fr
Application granted granted Critical
Publication of FR2713830B1 publication Critical patent/FR2713830B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H01R13/035—Plated dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/04—Pins or blades for co-operation with sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/931—Conductive coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Liquid Crystal Substances (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
FR9414865A 1993-12-09 1994-12-09 Composant conducteur pour transporter des signaux électriques et procédé pour la réalisation d'un tel composant. Expired - Fee Related FR2713830B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US16415093A 1993-12-09 1993-12-09

Publications (2)

Publication Number Publication Date
FR2713830A1 FR2713830A1 (fr) 1995-06-16
FR2713830B1 true FR2713830B1 (fr) 1998-04-03

Family

ID=22593199

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9414865A Expired - Fee Related FR2713830B1 (fr) 1993-12-09 1994-12-09 Composant conducteur pour transporter des signaux électriques et procédé pour la réalisation d'un tel composant.

Country Status (10)

Country Link
US (2) US5599595A (fr)
JP (1) JPH0850967A (fr)
KR (1) KR100339767B1 (fr)
CN (1) CN1110046A (fr)
DE (1) DE4443410A1 (fr)
FR (1) FR2713830B1 (fr)
GB (1) GB2284566B (fr)
IE (1) IE940943A1 (fr)
MX (1) MX9409531A (fr)
TW (1) TW349320B (fr)

Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5546281A (en) 1995-01-13 1996-08-13 Methode Electronics, Inc. Removable optoelectronic transceiver module with potting box
US5717533A (en) 1995-01-13 1998-02-10 Methode Electronics Inc. Removable optoelectronic module
US6220878B1 (en) 1995-10-04 2001-04-24 Methode Electronics, Inc. Optoelectronic module with grounding means
KR0155877B1 (ko) * 1995-09-12 1998-12-15 이대원 다층 회로기판 및 그 제조방법
US5873751A (en) * 1995-12-07 1999-02-23 Methode Electronics, Inc. Circuitized insulator
US5955703A (en) * 1996-02-28 1999-09-21 Methode Electronics, Inc. Circuitized electrical cable and method of assembling same
US6074728A (en) * 1996-09-11 2000-06-13 Samsung Aerospace Industries, Ltd. Multi-layered circuit substrate
US6106336A (en) * 1997-09-24 2000-08-22 Intel Corporation Computer system including a co-planar processor connector and thermal spacer
JP2004506309A (ja) 1997-12-31 2004-02-26 エルパック（ユーエスエー）、インコーポレイテッド モールドされた電子パッケージ、製作方法およびシールディング方法
US6160714A (en) * 1997-12-31 2000-12-12 Elpac (Usa), Inc. Molded electronic package and method of preparation
US6939447B2 (en) * 1998-04-06 2005-09-06 Tdao Limited Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
GB2336161B (en) 1998-04-06 2003-03-26 John Michael Lowe Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
US6000954A (en) * 1998-04-15 1999-12-14 Methode Electronics, Inc. Two piece pin connector
US6179627B1 (en) 1998-04-22 2001-01-30 Stratos Lightwave, Inc. High speed interface converter module
US6203333B1 (en) 1998-04-22 2001-03-20 Stratos Lightwave, Inc. High speed interface converter module
US6102742A (en) * 1998-06-30 2000-08-15 Methode Electronics, Inc. Electrical connector having variable resistance contacts
US6471805B1 (en) * 1998-11-05 2002-10-29 Sarnoff Corporation Method of forming metal contact pads on a metal support substrate
US6265051B1 (en) 1998-11-20 2001-07-24 3Com Corporation Edge connectors for printed circuit boards comprising conductive ink
US6021050A (en) * 1998-12-02 2000-02-01 Bourns, Inc. Printed circuit boards with integrated passive components and method for making same
TW419141U (en) * 1998-12-28 2001-01-11 Hon Hai Prec Ind Co Ltd Assembly and connection apparatus of electrical connector
US6867948B1 (en) * 1999-01-22 2005-03-15 Seagate Technology Llc Disc drives having flexible circuits with liquid crystal polymer dielectric
US6157548A (en) * 1999-03-25 2000-12-05 Illinois Tool Works Inc. Electrically shielded housing
US6220873B1 (en) 1999-08-10 2001-04-24 Stratos Lightwave, Inc. Modified contact traces for interface converter
US6203387B1 (en) 1999-10-21 2001-03-20 Stratos Lightwave, Inc. Solderable metallized plastic contact
US6359056B1 (en) 2000-01-27 2002-03-19 Kodak Polychrome Graphics Llc Printing plate and method to prepare a printing plate
US6200146B1 (en) 2000-02-23 2001-03-13 Itt Manufacturing Enterprises, Inc. Right angle connector
US6491545B1 (en) * 2000-05-05 2002-12-10 Molex Incorporated Modular shielded coaxial cable connector
US6305946B1 (en) * 2000-05-18 2001-10-23 Hon Hai Precision Ind. Co., Ltd. Power connector combining signal connection
JP3972354B2 (ja) * 2000-10-17 2007-09-05 セイコーエプソン株式会社 アクティブマトリクス基板及び液晶表示装置の製造方法
US6340314B1 (en) * 2000-12-21 2002-01-22 Hon Hai Precision Ind. Co., Ltd. Electrical adapter
US7018239B2 (en) 2001-01-22 2006-03-28 Molex Incorporated Shielded electrical connector
KR20030085088A (ko) * 2001-04-06 2003-11-01 에프씨아이 인쇄 회로의 표면 실장용 커넥터 및 제조 방법
JP4744724B2 (ja) * 2001-05-24 2011-08-10 第一電子工業株式会社 電子部品
ATE338358T1 (de) 2001-06-13 2006-09-15 Molex Inc Mehrfachhochgeschwindigkeitssteck- verbinder
US6974765B2 (en) * 2001-09-27 2005-12-13 Intel Corporation Encapsulation of pin solder for maintaining accuracy in pin position
DE10314716A1 (de) * 2003-03-31 2004-10-14 Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG Elektrisches Anschlusselement
US7086868B2 (en) * 2003-12-09 2006-08-08 Xytrans, Inc. Board-to-board connector
US20050227096A1 (en) * 2004-04-06 2005-10-13 Phil Harding Emulsion with discontinouous phase including particle sol
DE102004056702B3 (de) * 2004-04-22 2006-03-02 Semikron Elektronik Gmbh & Co. Kg Verfahren zur Befestigung von elektronischen Bauelementen auf einem Substrat
FR2871621A1 (fr) * 2004-06-10 2005-12-16 Fci Sa Connecteur electrique muni d'au moins un contact electrique et procede de fabrication d'un tel connecteur
US7172347B1 (en) * 2004-09-07 2007-02-06 Finisar Corporation Optoelectronic arrangement with a pluggable optoelectronic module and an electrical connector to be mounted on a host-printed circuit board and electrical connector
US7037114B1 (en) * 2005-01-21 2006-05-02 Cleveland Medical Devices Inc. Low profile electro-mechanical connector
CN100420049C (zh) * 2005-02-02 2008-09-17 银河制版印刷有限公司 发光二极管模块的基板结构
US7354794B2 (en) * 2005-02-18 2008-04-08 Lexmark International, Inc. Printed conductive connectors
JPWO2006093155A1 (ja) * 2005-03-01 2008-08-07 松下電器産業株式会社 基板間接続コネクタ及び基板間接続コネクタを用いた回路基板装置
US7166913B2 (en) * 2005-04-19 2007-01-23 International Business Machines Corporation Heat dissipation for heat generating element of semiconductor device and related method
US8048510B2 (en) * 2005-09-21 2011-11-01 Whirlpool Corporation Liner with electrical pathways
US7316507B2 (en) 2005-11-03 2008-01-08 Covidien Ag Electronic thermometer with flex circuit location
US7473102B2 (en) * 2006-03-31 2009-01-06 International Business Machines Corporation Space transforming land grid array interposers
US7758350B2 (en) * 2007-04-26 2010-07-20 Teka Interconnection Systems Electrical connector with solder retention means for assembly
US7749170B2 (en) 2007-05-22 2010-07-06 Tyco Healthcare Group Lp Multiple configurable electronic thermometer
JP4875595B2 (ja) * 2007-11-16 2012-02-15 三共化成株式会社 導電回路を有する合成樹脂製のばね
US8496377B2 (en) * 2007-12-31 2013-07-30 Covidien Lp Thermometer having molded probe component
KR100974092B1 (ko) * 2008-05-30 2010-08-04 삼성전기주식회사 탄소나노튜브를 포함하는 도전성 페이스트 및 이를 이용한인쇄회로기판
US7744376B2 (en) * 2008-06-03 2010-06-29 Tyco Electronics Corporation Socket connector with power blade
WO2012151371A2 (fr) * 2011-05-03 2012-11-08 Cardioinsight Technologies, Inc. Résistance à haute tension pour un connecteur fixé à une carte de circuit imprimé
TWI449273B (zh) * 2011-05-04 2014-08-11 Hon Hai Prec Ind Co Ltd 電連接器及其組裝方法
US8727809B2 (en) * 2011-09-06 2014-05-20 Samtec, Inc. Center conductor with surrounding shield and edge card connector with same
US8961228B2 (en) * 2012-02-29 2015-02-24 Tyco Electronics Corporation Electrical connector having shielded differential pairs
CN106415944A (zh) * 2014-04-23 2017-02-15 泰科电子公司 具有屏蔽帽和屏蔽端子的电连接器
DE102014010628A1 (de) * 2014-07-21 2016-01-21 Krallmann Kunststoffverarbeitung Gmbh Kunststoff-Bauteil mit zumindest einem elektrischen Kontaktelement und Verfahren zu seiner Herstellung
DE102014221306A1 (de) * 2014-10-21 2016-04-21 Robert Bosch Gmbh Schaltungsträger und Schaltungsmodul
KR101673706B1 (ko) * 2014-12-02 2016-11-07 현대자동차주식회사 피메일 커넥터 및 그 제조 방법
DE102015105852B4 (de) * 2015-04-16 2019-10-31 Erni Production Gmbh & Co. Kg Steckvorrichtung
DE102015221100A1 (de) * 2015-10-28 2017-05-04 Zf Friedrichshafen Ag Steckverbindung mit einem Stecker und einer Buchse als elektronische Schnittstelle
JP6415654B1 (ja) * 2017-07-28 2018-10-31 イリソ電子工業株式会社 電子部品
US12024356B2 (en) * 2022-09-29 2024-07-02 Apothecary Products, Llc Multiple compartment container and methods

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3088087A (en) * 1960-06-27 1963-04-30 Honeywell Regulator Co Electrical apparatus
US3016508A (en) * 1960-10-24 1962-01-09 Prec Connectors Inc Printed circuit electrical connectors
US3341806A (en) * 1965-10-23 1967-09-12 Sperry Rand Corp Connector device
DE3020645C2 (de) * 1980-05-30 1983-01-20 Siemens AG, 1000 Berlin und 8000 München Flüssigkristallanzeige und Verfahren zu ihrer Herstellung
FR2490059A1 (fr) * 1980-09-09 1982-03-12 Serras Paulet Edouard Circuit imprime et son procede de fabrication
US4386814A (en) * 1981-08-17 1983-06-07 Amp Incorporated Kit for converting a panel opening to a shielded pin receptacle
US4881902A (en) * 1984-09-21 1989-11-21 E. I. Du Pont De Nemours And Company Electrical terminator device
JP2581543B2 (ja) * 1986-07-04 1997-02-12 エビナ電化工業 株式会社 メッキした全芳香族系ポリエステル液晶ポリマ−成形品の製造法
JPS6332881A (ja) * 1986-07-25 1988-02-12 日本テキサス・インスツルメンツ株式会社 Ｉｃソケツト
JPS62222604A (ja) * 1987-02-03 1987-09-30 アルプス電気株式会社 回路板の形成方法
DE3884546T3 (de) * 1987-10-02 2000-03-23 Polyplastics Co. Ltd., Osaka Verfahren zur Oberflächenbehandlung von Gegenständen aus flüssigkristallinem Polyesterharz.
US4811165A (en) * 1987-12-07 1989-03-07 Motorola, Inc. Assembly for circuit modules
JPH01246775A (ja) * 1988-03-29 1989-10-02 Nec Corp コネクタ
US4850899A (en) * 1988-06-20 1989-07-25 Maynard Scott D Connector for interfacing a disk drive with a computer
JPH0729585Y2 (ja) * 1989-02-27 1995-07-05 任天堂株式会社 Ｅｍｉ対策用回路基板の接続構造
US4912772A (en) * 1989-03-06 1990-03-27 International Business Machines Corporation Connector and circuit package apparatus for pin array circuit module and circuit board
US4921453A (en) * 1989-04-13 1990-05-01 Ici Americas Inc. Molded complaint springs
JP2781890B2 (ja) * 1989-05-02 1998-07-30 オムロン株式会社 電磁継電器のベースの製造方法
US4932888A (en) * 1989-06-16 1990-06-12 Augat Inc. Multi-row box connector
US5044992A (en) * 1989-10-20 1991-09-03 The Charles Stark Draper Laboratory Printed circuit injection molded connector with removable bifurcated contacts capable of high temperature exposure
US4969842A (en) * 1989-11-30 1990-11-13 Amp Incorporated Molded electrical connector having integral spring contact beams
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US4997376A (en) * 1990-03-23 1991-03-05 Amp Incorporated Paired contact electrical connector system
US5147209A (en) * 1990-04-16 1992-09-15 Mckenzie Socket Technology, Inc. Intermediary adapter-connector
JP2542216Y2 (ja) * 1990-05-10 1997-07-23 東洋通信機株式会社 電流センサの検出部構造
US5085015A (en) * 1990-06-26 1992-02-04 E. I. Du Pont De Nemours And Company Process for improving the surface of liquid crystal polymers
US5037332A (en) * 1990-08-07 1991-08-06 Itt Corporation Intermodule electrical coupling
JPH0488689U (fr) * 1990-12-18 1992-07-31
JPH04357692A (ja) * 1991-03-27 1992-12-10 Gunze Ltd 薄膜ヒータ及びその製造方法
EP0512438B1 (fr) * 1991-05-09 1999-09-08 Molex Incorporated Assemblages de connecteurs électriques
US5137462A (en) * 1991-08-13 1992-08-11 Amp Incorporated Adapter for stacking connector assembly
US5145381A (en) * 1991-08-22 1992-09-08 Amp Incorporated Wedge driven elastomeric connector
JPH05283842A (ja) * 1992-03-31 1993-10-29 Hitachi Cable Ltd パターン状金属層を有するプラスチック成形品の製造方法
JP2724077B2 (ja) * 1992-09-28 1998-03-09 ポリプラスチックス株式会社 成形品表面に導電回路を形成する方法
US5338221A (en) * 1993-06-09 1994-08-16 Molex Incorporated Electrical connector for high density ribbon cable
US5395250A (en) * 1994-01-21 1995-03-07 The Whitaker Corporation Low profile board to board connector
JPH0831527A (ja) * 1994-07-04 1996-02-02 Whitaker Corp:The 基板用コネクタ

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IE940943A1 (en) 1995-06-14
GB9424531D0 (en) 1995-01-25
KR100339767B1 (ko) 2002-11-30
GB2284566B (en) 1998-05-06
FR2713830A1 (fr) 1995-06-16
DE4443410A1 (de) 1995-06-14
KR950021891A (ko) 1995-07-26
CN1110046A (zh) 1995-10-11
US5599595A (en) 1997-02-04
TW349320B (en) 1999-01-01
US5688146A (en) 1997-11-18
MX9409531A (es) 1997-01-31
GB2284566A (en) 1995-06-14
JPH0850967A (ja) 1996-02-20

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