FR2711820B1 - Système d'inspection optique automatique à base pondérée de données de transmission. - Google Patents
Système d'inspection optique automatique à base pondérée de données de transmission.Info
- Publication number
- FR2711820B1 FR2711820B1 FR9412826A FR9412826A FR2711820B1 FR 2711820 B1 FR2711820 B1 FR 2711820B1 FR 9412826 A FR9412826 A FR 9412826A FR 9412826 A FR9412826 A FR 9412826A FR 2711820 B1 FR2711820 B1 FR 2711820B1
- Authority
- FR
- France
- Prior art keywords
- transmission data
- data based
- automatic transmission
- inspection system
- optical inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005540 biological transmission Effects 0.000 title 1
- 238000007689 inspection Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 title 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/0006—Industrial image inspection using a design-rule based approach
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Biochemistry (AREA)
- Immunology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Quality & Reliability (AREA)
- General Health & Medical Sciences (AREA)
- Theoretical Computer Science (AREA)
- Pathology (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- General Engineering & Computer Science (AREA)
- Image Processing (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Image Analysis (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/143,434 US5517234A (en) | 1993-10-26 | 1993-10-26 | Automatic optical inspection system having a weighted transition database |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2711820A1 FR2711820A1 (fr) | 1995-05-05 |
FR2711820B1 true FR2711820B1 (fr) | 1996-06-28 |
Family
ID=22504061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9412826A Expired - Fee Related FR2711820B1 (fr) | 1993-10-26 | 1994-10-26 | Système d'inspection optique automatique à base pondérée de données de transmission. |
Country Status (5)
Country | Link |
---|---|
US (2) | US5517234A (fr) |
JP (1) | JP2733202B2 (fr) |
DE (1) | DE4438278C2 (fr) |
FR (1) | FR2711820B1 (fr) |
GB (1) | GB2283317B (fr) |
Families Citing this family (68)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5638465A (en) * | 1994-06-14 | 1997-06-10 | Nippon Telegraph And Telephone Corporation | Image inspection/recognition method, method of generating reference data for use therein, and apparatuses therefor |
AUPN462995A0 (en) * | 1995-08-07 | 1995-08-31 | Mikoh Technology Limited | Optical memory data detector and authenticator |
US5739846A (en) * | 1996-02-05 | 1998-04-14 | Universal Instruments Corporation | Method of inspecting component placement accuracy for each first selected circuit board to be assembled of a batch |
US6366358B1 (en) * | 1996-10-09 | 2002-04-02 | Dai Nippon Printing Co., Ltd. | Method and apparatus for detecting stripe defects of printed matter |
US5999636A (en) * | 1997-10-10 | 1999-12-07 | Printprobe Technology, Llc | Apparatus and process for inspecting print material |
AU3956899A (en) * | 1998-05-29 | 1999-12-20 | Matsushita Electric Works Ltd. | Image processing inspection apparatus |
US6324298B1 (en) | 1998-07-15 | 2001-11-27 | August Technology Corp. | Automated wafer defect inspection system and a process of performing such inspection |
IT1306273B1 (it) * | 1998-07-30 | 2001-06-04 | Antonio Messina | Procedimento ed apparato per il controllo di qualita' di una linea diproduzione |
EP1044431A1 (fr) * | 1998-08-18 | 2000-10-18 | Koninklijke Philips Electronics N.V. | Appareil permettant d'obtenir un signal de commande de luminosite optimale dans une image radiologique du tissu pulmonaire |
US6529622B1 (en) * | 1998-10-30 | 2003-03-04 | General Electric Company | Method and apparatus for identifying defective regions in a discrete pixel detector |
US7106895B1 (en) * | 1999-05-05 | 2006-09-12 | Kla-Tencor | Method and apparatus for inspecting reticles implementing parallel processing |
US6577757B1 (en) | 1999-07-28 | 2003-06-10 | Intelligent Reasoning Systems, Inc. | System and method for dynamic image recognition |
EP1101438B1 (fr) * | 1999-11-18 | 2006-10-18 | Fuji Photo Film Co., Ltd. | Procédé et dispositif d'acquisition d'images fluorescentes |
CA2296143A1 (fr) | 2000-01-18 | 2001-07-18 | 9071 9410 Quebec Inc. | Systeme d'inspection optique |
US6603542B1 (en) | 2000-06-14 | 2003-08-05 | Qc Optics, Inc. | High sensitivity optical inspection system and method for detecting flaws on a diffractive surface |
US7075565B1 (en) | 2000-06-14 | 2006-07-11 | Landrex Technologies Co., Ltd. | Optical inspection system |
US6678043B1 (en) * | 2000-10-31 | 2004-01-13 | Gerard H. Vurens | Methods and apparatus for surface analysis |
US6658361B1 (en) * | 2001-10-10 | 2003-12-02 | Lsi Logic Corporation | Heaviest only fail potential |
US7085431B2 (en) * | 2001-11-13 | 2006-08-01 | Mitutoyo Corporation | Systems and methods for reducing position errors in image correlation systems during intra-reference-image displacements |
GB2389178B (en) * | 2001-12-31 | 2004-10-27 | Orbotech Ltd | Method for inspecting patterns |
US7031543B2 (en) * | 2002-01-02 | 2006-04-18 | Xerox Corporation | Grayscale image de-speckle algorithm |
US7092584B2 (en) * | 2002-01-04 | 2006-08-15 | Time Warner Entertainment Company Lp | Registration of separations |
US6947607B2 (en) | 2002-01-04 | 2005-09-20 | Warner Bros. Entertainment Inc. | Reduction of differential resolution of separations |
US6920624B2 (en) * | 2002-01-17 | 2005-07-19 | Seagate Technology, Llc | Methodology of creating an object database from a Gerber file |
US7167185B1 (en) | 2002-03-22 | 2007-01-23 | Kla- Tencor Technologies Corporation | Visualization of photomask databases |
US20040010444A1 (en) * | 2002-04-18 | 2004-01-15 | Photon Dynamics, Inc. | Automated infrared printed circuit board failure diagnostic system |
DE10335312A1 (de) * | 2003-08-01 | 2005-02-24 | Asys Automatisierungssysteme Gmbh | Erstellen von Testmustern zur Nachkontrolle |
WO2005047815A1 (fr) * | 2003-11-12 | 2005-05-26 | Kabushiki Kaisha Koe Etec | Dispositif d'essai visuel d'un filetage male |
US20050190959A1 (en) * | 2004-02-26 | 2005-09-01 | Kohler James P. | Drill hole inspection method for printed circuit board fabrication |
US7215808B2 (en) * | 2004-05-04 | 2007-05-08 | Kla-Tencor Technologies Corporation | High throughout image for processing inspection images |
US7990413B2 (en) * | 2004-11-04 | 2011-08-02 | Rockwell Automation Technologies, Inc. | Camera sensor job selection method |
JP5122737B2 (ja) * | 2005-10-03 | 2013-01-16 | 株式会社名南製作所 | 木材の検査方法及び装置及びプログラム |
US8284394B2 (en) * | 2006-02-09 | 2012-10-09 | Kla-Tencor Technologies Corp. | Methods and systems for determining a characteristic of a wafer |
US8280649B2 (en) * | 2006-06-27 | 2012-10-02 | Nec Corporation | Board or electronic component warp analyzing method, board or electronic component warp analyzing system and board or electronic component warp analyzing program |
CN100573315C (zh) * | 2007-04-04 | 2009-12-23 | 鸿富锦精密工业(深圳)有限公司 | 相机模块污点测试系统及方法 |
US7951697B1 (en) | 2007-06-20 | 2011-05-31 | Amkor Technology, Inc. | Embedded die metal etch stop fabrication method and structure |
US7923645B1 (en) * | 2007-06-20 | 2011-04-12 | Amkor Technology, Inc. | Metal etch stop fabrication method and structure |
US8078303B2 (en) * | 2007-07-03 | 2011-12-13 | Southwire Company | Electronic supervisor |
US8611639B2 (en) * | 2007-07-30 | 2013-12-17 | Kla-Tencor Technologies Corp | Semiconductor device property extraction, generation, visualization, and monitoring methods |
US7958626B1 (en) | 2007-10-25 | 2011-06-14 | Amkor Technology, Inc. | Embedded passive component network substrate fabrication method |
US8862582B2 (en) * | 2007-11-15 | 2014-10-14 | At&T Intellectual Property I, L.P. | System and method of organizing images |
IL188825A0 (en) * | 2008-01-16 | 2008-11-03 | Orbotech Ltd | Inspection of a substrate using multiple cameras |
US20110175997A1 (en) * | 2008-01-23 | 2011-07-21 | Cyberoptics Corporation | High speed optical inspection system with multiple illumination imagery |
US7912658B2 (en) * | 2008-05-28 | 2011-03-22 | Kla-Tencor Corp. | Systems and methods for determining two or more characteristics of a wafer |
KR101647010B1 (ko) * | 2008-06-19 | 2016-08-10 | 케이엘에이-텐코어 코오포레이션 | 웨이퍼의 하나 이상의 특성들을 결정하기 위한 컴퓨터-구현 방법들, 컴퓨터-판독 가능 매체, 및 시스템들 |
US8269960B2 (en) * | 2008-07-24 | 2012-09-18 | Kla-Tencor Corp. | Computer-implemented methods for inspecting and/or classifying a wafer |
US8144973B2 (en) * | 2009-03-24 | 2012-03-27 | Orbotech Ltd. | Multi-modal imaging |
US8260030B2 (en) * | 2009-03-30 | 2012-09-04 | Koh Young Technology Inc. | Inspection method |
JP5407632B2 (ja) * | 2009-07-22 | 2014-02-05 | 富士通株式会社 | プリント基板試験支援装置、プリント基板試験支援方法、及びプリント基板試験支援プログラム |
US8339449B2 (en) * | 2009-08-07 | 2012-12-25 | Globalfoundries Singapore Pte. Ltd. | Defect monitoring in semiconductor device fabrication |
US8872912B2 (en) * | 2009-09-22 | 2014-10-28 | Cyberoptics Corporation | High speed distributed optical sensor inspection system |
US8670031B2 (en) * | 2009-09-22 | 2014-03-11 | Cyberoptics Corporation | High speed optical inspection system with camera array and compact, integrated illuminator |
US8894259B2 (en) * | 2009-09-22 | 2014-11-25 | Cyberoptics Corporation | Dark field illuminator with large working area |
US8388204B2 (en) * | 2009-09-22 | 2013-03-05 | Cyberoptics Corporation | High speed, high resolution, three dimensional solar cell inspection system |
US8681211B2 (en) * | 2009-09-22 | 2014-03-25 | Cyberoptics Corporation | High speed optical inspection system with adaptive focusing |
AU2009251147B2 (en) * | 2009-12-23 | 2012-09-06 | Canon Kabushiki Kaisha | Dynamic printer modelling for output checking |
KR101692277B1 (ko) | 2010-11-23 | 2017-01-04 | 주식회사 고영테크놀러지 | 검사방법 |
US8791501B1 (en) | 2010-12-03 | 2014-07-29 | Amkor Technology, Inc. | Integrated passive device structure and method |
KR101642897B1 (ko) * | 2011-07-13 | 2016-07-26 | 주식회사 고영테크놀러지 | 검사방법 |
CN102682166B (zh) * | 2012-05-09 | 2014-01-15 | 上海望友信息科技有限公司 | Smt设备快速制程系统及方法 |
DE202012102237U1 (de) | 2012-06-18 | 2012-07-17 | Wipotec Wiege- Und Positioniersysteme Gmbh | Kontrollvorrichtung für eine Kennzeichnung, mit einer Erfassungs- und Verarbeitungseinrichtung zur Erfassung der Kennzeichnung |
JP6053459B2 (ja) * | 2012-11-01 | 2016-12-27 | 住友重機械工業株式会社 | 基板製造方法及び基板製造装置 |
US9241128B2 (en) | 2013-02-14 | 2016-01-19 | Warner Bros. Entertainment Inc. | Video conversion technology |
CN106651857B (zh) * | 2017-01-04 | 2019-06-04 | 中国农业大学 | 一种印刷电路板贴片缺陷检测方法 |
DE102017217967A1 (de) * | 2017-10-09 | 2019-04-11 | Sieb & Meyer Ag | Verfahren zur Bestimmung von Positionsfehlern von Bohrungen und Sicherung des Bohrprozesses |
CN111566468A (zh) * | 2017-11-07 | 2020-08-21 | Abb瑞士股份有限公司 | 用于开关设备等的成像分析的方法和装置 |
CN109949725B (zh) * | 2019-03-06 | 2022-09-20 | 武汉精立电子技术有限公司 | 一种aoi系统图像灰度标准化方法及系统 |
CN113029049B (zh) * | 2021-05-25 | 2021-09-03 | 武汉理工大学 | 基于加权正负余量方差最小化算法的工件光学测量方法 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4578810A (en) * | 1983-08-08 | 1986-03-25 | Itek Corporation | System for printed circuit board defect detection |
DE3540100A1 (de) * | 1985-11-12 | 1987-06-11 | Mania Gmbh | Verfahren zur optischen pruefung von leiterplatten |
US4859999A (en) * | 1986-07-21 | 1989-08-22 | Gerber Scientific Instrument Company, Inc. | Pattern-boundary image generation system and method |
US4748679A (en) * | 1986-07-25 | 1988-05-31 | Light Signatures, Inc. | Weighted-pixel characteristic sensing system |
US4783826A (en) * | 1986-08-18 | 1988-11-08 | The Gerber Scientific Company, Inc. | Pattern inspection system |
US4877326A (en) * | 1988-02-19 | 1989-10-31 | Kla Instruments Corporation | Method and apparatus for optical inspection of substrates |
IL85862A (en) * | 1988-03-24 | 1993-01-14 | Orbot Systems Ltd | Telecentric imaging system |
US5247585A (en) * | 1988-12-28 | 1993-09-21 | Masaharu Watanabe | Object recognition device |
IL89488A0 (en) * | 1989-03-05 | 1989-09-10 | Orbot Systems Ltd | Work station for orientation of a workpiece relative to a fixed point |
IL90545A (en) * | 1989-06-06 | 1994-07-31 | Orbot Systems Ltd | Immobilizing device for printed-circuit boards |
US5058982A (en) * | 1989-06-21 | 1991-10-22 | Orbot Systems Ltd. | Illumination system and inspection apparatus including same |
DE3941009A1 (de) * | 1989-12-12 | 1991-06-13 | Medmark Pharma Gmbh | Eliminierung von aktivierten lymphozyten |
US5204912A (en) * | 1990-02-26 | 1993-04-20 | Gerber Systems Corporation | Defect verification and marking system for use with printed circuit boards |
US5157762A (en) * | 1990-04-10 | 1992-10-20 | Gerber Systems Corporation | Method and apparatus for providing a three state data base for use with automatic optical inspection systems |
IL94368A (en) * | 1990-05-11 | 1993-07-08 | Orbot Systems Ltd | Optic inspection apparatus and illumination system particularly useful therein |
US5163128A (en) * | 1990-07-27 | 1992-11-10 | Gerber Systems Corporation | Method and apparatus for generating a multiple tolerance, three state data base for use with automatic optical inspection systems |
US5231675A (en) * | 1990-08-31 | 1993-07-27 | The Boeing Company | Sheet metal inspection system and apparatus |
JPH04161841A (ja) * | 1990-10-25 | 1992-06-05 | Nippon Steel Corp | 光学式プリント基板検査装置 |
IL96483A (en) * | 1990-11-27 | 1995-07-31 | Orbotech Ltd | Optical inspection method and apparatus |
JPH04282442A (ja) * | 1991-03-12 | 1992-10-07 | Nec Corp | パターン検査装置 |
US5204910A (en) * | 1991-05-24 | 1993-04-20 | Motorola, Inc. | Method for detection of defects lacking distinct edges |
FR2678454B1 (fr) * | 1991-06-27 | 1994-11-04 | Thomson Csf | Procede et dispositif de modulation et de demodulation de sous-canaux de transmission pour systeme de television compatible. |
EP0521845A1 (fr) * | 1991-07-02 | 1993-01-07 | JANUSCHKOWETZ GmbH | Semoir mobile |
IL100825A (en) * | 1992-01-31 | 1995-12-08 | Orbotech Ltd | Apparatus for loading unloading and precisely positioning articles with respect to a table |
IL100824A (en) * | 1992-01-31 | 1996-12-05 | Orbotech Ltd | Method of inspecting articles |
-
1993
- 1993-10-26 US US08/143,434 patent/US5517234A/en not_active Expired - Lifetime
-
1994
- 1994-10-25 GB GB9421447A patent/GB2283317B/en not_active Expired - Fee Related
- 1994-10-26 FR FR9412826A patent/FR2711820B1/fr not_active Expired - Fee Related
- 1994-10-26 JP JP6262988A patent/JP2733202B2/ja not_active Expired - Lifetime
- 1994-10-26 DE DE4438278A patent/DE4438278C2/de not_active Expired - Fee Related
-
1995
- 1995-11-01 US US08/551,736 patent/US5608453A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2711820A1 (fr) | 1995-05-05 |
JPH07182521A (ja) | 1995-07-21 |
DE4438278C2 (de) | 1997-08-28 |
GB2283317A (en) | 1995-05-03 |
US5608453A (en) | 1997-03-04 |
JP2733202B2 (ja) | 1998-03-30 |
GB2283317B (en) | 1998-04-22 |
DE4438278A1 (de) | 1995-04-27 |
US5517234A (en) | 1996-05-14 |
GB9421447D0 (en) | 1994-12-07 |
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Legal Events
Date | Code | Title | Description |
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ST | Notification of lapse |