FR2708826B1 - Appareil électrique, en particulier appareil de commutation ou de commande pour véhicules à moteur. - Google Patents
Appareil électrique, en particulier appareil de commutation ou de commande pour véhicules à moteur.Info
- Publication number
- FR2708826B1 FR2708826B1 FR9408552A FR9408552A FR2708826B1 FR 2708826 B1 FR2708826 B1 FR 2708826B1 FR 9408552 A FR9408552 A FR 9408552A FR 9408552 A FR9408552 A FR 9408552A FR 2708826 B1 FR2708826 B1 FR 2708826B1
- Authority
- FR
- France
- Prior art keywords
- motor vehicles
- particular switching
- control apparatus
- electric
- electric apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
- B60R16/0239—Electronic boxes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09572—Solder filled plated through-hole in the final product
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4326506A DE4326506A1 (de) | 1993-08-06 | 1993-08-06 | Elektrisches Gerät, insbesondere Schalt- oder Steuergerät für Kraftfahrzeuge |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2708826A1 FR2708826A1 (fr) | 1995-02-10 |
FR2708826B1 true FR2708826B1 (fr) | 1996-03-22 |
Family
ID=6494639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9408552A Expired - Fee Related FR2708826B1 (fr) | 1993-08-06 | 1994-07-11 | Appareil électrique, en particulier appareil de commutation ou de commande pour véhicules à moteur. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5539618A (fr) |
JP (1) | JPH0779053A (fr) |
DE (1) | DE4326506A1 (fr) |
FR (1) | FR2708826B1 (fr) |
IT (1) | IT1274704B (fr) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6252179B1 (en) * | 1995-04-27 | 2001-06-26 | International Business Machines Corporation | Electronic package on metal carrier |
DE19601649A1 (de) * | 1996-01-18 | 1997-07-24 | Telefunken Microelectron | Anordnung zur Verbesserung der Wärmeableitung bei elektrischen und elektronischen Bauelementen |
DE19654606C2 (de) * | 1996-12-20 | 1998-10-22 | Siemens Ag | Beidseitig oder mehrschichtig kupferkaschierte Leiterplatte und Verfahren zu ihrer Herstellung |
DE19654353A1 (de) * | 1996-12-24 | 1998-06-25 | Bosch Gmbh Robert | Montageanordnung eines Halbleiterbauelements auf einer Leiterplatte |
US5994679A (en) * | 1997-12-19 | 1999-11-30 | Lucent Technologies Inc. | Thermal housing for optical circuits |
DE19805492C2 (de) * | 1998-02-11 | 1999-12-02 | Siemens Ag | Leiterplatte |
FR2775553B1 (fr) * | 1998-03-02 | 2000-05-19 | Valeo Electronique | Raccordement d'un point d'une carte electronique a circuit imprime sur un substrat metallique qui porte ladite carte |
JPH11297906A (ja) * | 1998-03-23 | 1999-10-29 | Motorola Inc | 電子アセンブリおよび製造方法 |
DE19949429C2 (de) * | 1999-10-13 | 2003-10-09 | Conti Temic Microelectronic | Verfahren zur Bearbeitung einer durchkontaktierten Leiterplatte |
FR2801763B1 (fr) * | 1999-11-30 | 2002-02-15 | Sagem | Module electronique de puissance et procede de fabrication d'un tel module |
FR2802714B1 (fr) * | 1999-12-21 | 2002-03-08 | Sagem | Module electrique de puissance et procede pour sa fabrication |
JP3804861B2 (ja) | 2002-08-29 | 2006-08-02 | 株式会社デンソー | 電気装置および配線基板 |
DE10250697A1 (de) * | 2002-10-31 | 2004-05-13 | Hella Kg Hueck & Co. | Leiterplatte |
DE20300626U1 (de) | 2002-11-19 | 2003-05-28 | electronic service willms GmbH & Co. KG, 52223 Stolberg | Leiterkarte, Anordnung aus Leiterkarte, Bauteil und/oder Kühlelement sowie Hochleistungs-LED-Anordnung |
DE20301773U1 (de) | 2003-02-05 | 2003-04-17 | Leopold Kostal GmbH & Co. KG, 58507 Lüdenscheid | Elektrische Einrichtung |
DE102005019922A1 (de) * | 2005-04-27 | 2006-11-02 | Conti Temic Microelectronic Gmbh | Multilayerleiterplatte mit integriertem Widerstand |
DE102005021918B4 (de) * | 2005-05-12 | 2015-04-02 | Conti Temic Microelectronic Gmbh | Verfahren zur Bestimmung der Temperatur eines Bauelementes |
DE102007029422A1 (de) * | 2007-06-26 | 2009-01-08 | Behr-Hella Thermocontrol Gmbh | Thermische Kontaktierung eines Leistungsbauelements auf einem Schaltungsträger durch Kaltgasspritzen |
DE102007037297A1 (de) | 2007-08-07 | 2009-02-19 | Continental Automotive Gmbh | Schaltungsträgeraufbau mit verbesserter Wärmeableitung |
DE102007062167A1 (de) * | 2007-12-21 | 2009-06-25 | Robert Bosch Gmbh | Leistungsschaltung |
CN103025122A (zh) * | 2011-09-23 | 2013-04-03 | 联想(北京)有限公司 | 一种电子设备 |
JP6287659B2 (ja) * | 2014-07-22 | 2018-03-07 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
JP6287815B2 (ja) * | 2014-12-24 | 2018-03-07 | 株式会社オートネットワーク技術研究所 | 回路構成体の製造方法 |
FR3036917B1 (fr) * | 2015-05-28 | 2018-11-02 | IFP Energies Nouvelles | Dispositif electronique comprenant une carte de circuit imprime avec un refroidissement ameliore. |
DE102018200022A1 (de) * | 2018-01-02 | 2019-07-04 | Osram Gmbh | Anordnung und scheinwerfer |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3115017A1 (de) * | 1981-04-14 | 1982-11-04 | Blaupunkt-Werke Gmbh, 3200 Hildesheim | Elektronisches bauelement |
GB2135521A (en) * | 1983-02-16 | 1984-08-30 | Ferranti Plc | Printed circuit boards |
US4628407A (en) * | 1983-04-22 | 1986-12-09 | Cray Research, Inc. | Circuit module with enhanced heat transfer and distribution |
DE4023319C1 (fr) * | 1990-07-21 | 1991-12-12 | Robert Bosch Gmbh, 7000 Stuttgart, De | |
DE4107312A1 (de) * | 1991-03-07 | 1992-09-10 | Telefunken Electronic Gmbh | Montageanordnung von halbleiterbauelementen auf einer leiterplatte |
US5285352A (en) * | 1992-07-15 | 1994-02-08 | Motorola, Inc. | Pad array semiconductor device with thermal conductor and process for making the same |
-
1993
- 1993-08-06 DE DE4326506A patent/DE4326506A1/de not_active Ceased
-
1994
- 1994-07-11 FR FR9408552A patent/FR2708826B1/fr not_active Expired - Fee Related
- 1994-08-02 JP JP6181595A patent/JPH0779053A/ja active Pending
- 1994-08-03 IT ITMI941689A patent/IT1274704B/it active IP Right Grant
-
1995
- 1995-06-05 US US08/461,671 patent/US5539618A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE4326506A1 (de) | 1995-02-09 |
JPH0779053A (ja) | 1995-03-20 |
IT1274704B (it) | 1997-07-24 |
US5539618A (en) | 1996-07-23 |
ITMI941689A1 (it) | 1996-02-03 |
FR2708826A1 (fr) | 1995-02-10 |
ITMI941689A0 (it) | 1994-08-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |